SBLF1630CT THINKISEMI | Alldatasheet
Document overview
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Technical content
16.0 Ampere Insulated Pkg Common Cathode Schottky Barrier Rectifier Diodes
© 1995 Thinki Semiconductor Co., Ltd. http://www.thinkisemi.com.tw/ Page 1/2 Pb Rev.11T Features ¬ ThinkiSemi Planar NMBR Technology Guardring for overvoltage protection Ideally Suited for Automatic Assembly Low Forward Voltage High Surge Current Capability Low Leakage Current
Applications
Freewheeling, Snubber, Clamp Solar Junction Box Application PFC Plating Power Supply Ultrasonic Cleaner and Welder Converter & Chopper UPS/LED SMPS/HID Positive Common Cathode Unit : inch (mm) ITO-220AB/TO-220F-3L Case Internal Configuration Maximum Ratings C = 25°C unless otherwise noted) Parameter Symbol SBLF1630CT/SBLF1640CT Unit Maximum repetitive peak reverse voltage V RRM Working peak reverse voltage V RWM Maximum DC blocking voltage V DC Maximum average forward rectified current Total device at T C = 95°C Per leg I F(AV) 8.0 A Peak forward surge current 8.3ms single half sine-wave superimposed I FSM 250 A on rated load (JEDEC Method) per leg Operating junction and storage temperature range T J , T STG –40 to +125 °C RMS Isolation voltage (SBLF type only) from terminals 4500 (NOTE 1) to heatsink with t = 1.0 second, RH 30% V ISOL 3500 (NOTE 2) V 1500 (NOTE 3)
Electrical Characteristics
C = 25°C unless otherwise noted) Parameter Symbol Value Unit Maximum instantaneous forward voltage per leg at 10.0 A (Note 4) V F Maximum instantaneous reverse current T C = 25°C 0.5 at rated DC blocking voltage per leg (Note 4) T C = 100°C I R mA Thermal Characteristics C = 25°C unless otherwise noted) Typical thermal resistance from junction to case per leg R Θ JC Notes: (1) Clip mounting (on case), where lead does not overlap heatsink with 0.110” offset (2) Clip mounting (on case), where leads do overlap heatsink (3) Screw mounting with 4-40 screw, where washer diameter is 4.9 mm (0.19”) (4) Pulse test: 300 µ s pulse width, 1% duty cycle 45V(Typical>50V) V V 45V(Typical>50V) V 0.49V V Parameter Symbol SBLF1630CT/SBLF1640CT Unit 3.0 °C/W .130(3.3) .114(2.9) .071(1.8) .055(1.4) .035(0.9) .011(0.3) (2.55) (2.55) .1 .1 .032(.8) .606(15.4) .543(13.8) .161(4.1)MAX .134(3.4) .165(4.2).381(9.7) .114(2.9) .098(2.5) .055(1.4) .039(1.0) MAX .583(14.8) .512(13.0) .118(3.0)
© 1995 Thinki Semiconductor Co., Ltd. http://www.thinkisemi.com.tw/ Page 2/2Rev.11T Ratings and Characteristic Curves A = 25°C unless otherwise noted) I F Instantaneous Forward Current (A) I R Instantaneous Reverse Current (mA) Typical Reverse Characteristics Per Leg 1.0 0.1 0.01 Forward Current Derating Curve 100 150 Average Forward Current (A) Peak Forward Surge Current (A) Number of Cycles at 60 H Z Maximum Non-Repetitive Peak Forward Surge Current Per Leg 150 100 250 200 300 11 0 100 T J = T J max. 8.3ms Single Half Sine-Wave (JEDEC Method) Case Temperature ( Typical Instantaneous Forward Characteristics Per Leg 1.0 0.01 0.001 0.1 T J = 125 C C C Resistive or Inductive Load Transient Thermal Impedance ( C/W) 0.01 11 0 100 100 0.1 0.1 t Pulse Duration (sec.) T J = 25 C T J = 125 C Typical Junction Capacitance Per Leg pF Junction Capacitance 11 0 100 1,000 4,000 100 0.1 Reverse Voltage (V) T J = 25 C f = 1.0 MH Z V sig = 50mVp-p Instantaneous Forward Voltage (V) 0 0.2 0.1 0.6 1.1 1.2 0.4 0.3 0.7 0.8 0.9 0.5 1.0 Pulse Width = 300 µ s 1% Duty Cycle 0 20 100 40 60 80 Typical Transient Thermal Impedance Per Leg Percent of Rated Peak Reverse Voltage (%) SBLF1630CT/SBLF1640CT