SAF3560 NXP | Alldatasheet
Document overview
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Technical content
- General description The SAF3560 is a digital radio processor that demodulates and processes digital terrestrial baseband signals, such as HD Radio signals, into audio signals and digital data signals. Major benefits of terrestrial radio processor systems with SAF3560 are:
- Compatibility with conventional baseband radio reception ICs
- Dramatically improved reception and sound quality
- CD-sound quality without noise, interference and multipath fading for FM
- Providing new data services
- HD Radio reception including audio processing
- Voltage partitioning of I/Os SAF3560 Terrestrial digital radio processor Rev. 03 — 15 September 2010 Product short data sheet (1) Second input only supported by specific types (see Table 3) Fig 1. System block diagram 001aal423 TUNER1 OPTIONAL AUDIO POST PROCESSING AND STEREO AUDIO DAC RENDERING OF DATA: LIVE TRAFFIC REPORTS WEATHER SPORTS SCORES STOCK TICKER TUNER2 IF PROCESSING IF PROCESSING SAF3560 MICROPROCESSOR SERIAL NOR-FLASH MEMORY SDRAM SPI2 blended audio (analog) I2C-bus or SPI1baseband I2S interface baseband I2S interface digital audio blend
Product short data sheet Rev. 03 — 15 September 2010 2 of 20 NXP Semiconductors SAF3560 Terrestrial digital radio processor System designers can add digital terrestrial radio capability in a simple and inexpensive way through the SAF3560. The SAF3560 decodes digital radio input to provide digital audio and also processes digital data. Multiple interfaces give flexibility while integrating the SAF3560 into the receiver system. 2. Features and benefits
2.1 HD Radio technology
HD Radio signal decoding for AM and FM digital audio Dual HD Radio support for support of 2nd station for background scanning and data service Front-end to baseband interface support through serial baseband I2S-bus type interface Secondary baseband interface for dual tuner applications Metadata support for HD Radio reception Data services support for HD Radio reception Advanced HD Radio feature support, such as1: Conditional Access (CA) Store and replay Apple ID3 tag Multicasting Electronic Program Guide (EPG)
2.2 Digital audio
Up to 6 channel (5.1) audio support through I2S-bus serial audio interface Optional SRC (8 kHz to 48 kHz) for up to 6 channels of I2S-bus audio output I2S-bus serial audio input for auxiliary processing Optional SRC (8 kHz to 48 kHz) for I2S-bus input Optional restricted support for 96 kHz input and output sample-rate conversion Optional digital audio output through S/PDIF (without SRC) Basic audio processing for external digital audio sources Advanced audio processing (please contact NXP for a list of supported audio processing features: Section 14 “Contact information”)
2.3 Memory
Supports SDR-SDRAM controller (up to 512 Mbit in 16-bit configuration) Supports serial NOR-Flash memory with various sizes depending on the actual application 1. Please contact NXP for a detailed list of supported feature sets: Section 14 “Contact information”.
2.4 Other peripheral interfaces
2.5 Miscellaneous
[1] Through pins V DDA(OSC)(1V2), VDDA(PLL)(1V2), VDDD(C)(1V2) and VDDD(MEM)(1V2). [2] Through pins V DDD(DAB)(3V3), VDDD(DSP)(3V3), VDDD(JTAG)(3V3), VDDD(MC)(3V3) and VDDD(SDRAM)(3V3). Table 1. Power supply characteristics After power-up the SAF3560 needs a reset pulse for at least 2 ms.
Table 2. Ordering information Table 3. Main applications
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6.1 Pinning
Table 4. Pin allocation table (HLQFP144)
1 CLKOUT 2 RESET_N 3 I2C1_SCL 4 I2C1_SDA
5 I2C1_DA 6 V DDD(MC)(3V3) 7 I2C2_SCL 8 I2C2_SDA
9 I2C2_DA 10 SPI1_SO 11 SPI1_SI 12 SPI1_SCLK
13 SPI1_SS_N 14 V
17 SPI2_MO 18 SPI2_SCLK 19 SPI2_SS1_N 20 SPI2_SS2_N
25 UART_RD 26 UART_RTS 27 V DDD(C)(1V2) 28 V DDD(MC)(3V3)
29 UART_CTS 30 SPI3_MISO 31 SPI3_MOSI 32 SPI3_SCLK
33 SPI3_SS1_N 34 V
37 GPIO1 38 GPIO2 39 GPIO3 40 GPIO4
57 BB1_I2S_I 58 BB1_I2S_Q 59 BB2_I2S_BCK 60 BB2_I2S_WS
61 BB2_I2S_I 62 BB2_I2S_Q 63 V
65 HBCKOUT 66 I2S1_O_BCK 67 I2S1_O_WS 68 I2S1_O_SD
69 BLEND 70 V DDD(MEM)(1V2) 71 V DDD(DSP)(3V3) 72 I2S2_O_SD
73 I2S3_O_SD/
74 I2S_I_WS 75 I2S_I_BCK 76 I2S_I_SD
77 SDRAM_DIO0 78 SDRAM_DIO1 79 SDRAM_DIO2 80 V DDD(SDRAM)(3V3)
81 SDRAM_DIO3 82 SDRAM_DIO4 83 SDRAM_DIO5 84 SDRAM_DIO6
85 V DDD(SDRAM)(3V3) 86 SDRAM_DIO7 87 SDRA M_DIO8 88 SDRAM_DIO9
89 SDRAM_DIO10 90 V DDD(SDRAM)(3V3) 91 V DDD(C)(1V2) 92 SDRAM_DIO11
[1] See Table 14 for unused pins.
6.2 Pin description
93 SDRAM_DIO12 94 SDRAM_DIO13 95 SDRAM_DIO14 96 V DDD(SDRAM)(3V3)
97 SDRAM_DIO15 98 SDRAM_WE_N 99 SDRAM_DQM0 100 SDRAM_DQM1
101 V DDD(SDRAM)(3V3) 102 V DDD(MEM)(1V2) 103 SDRAM_BA0 104 SDRAM_BA1
105 SDRAM_CS_N 106 SDRAM_RAS_N 107 V DDD(SDRAM)(3V3) 108 SDRAM_CAS_N
109 SDRAM_CLKE 110 SDRAM_AO0 111 SDRAM_AO1 112 V DDD(SDRAM)(3V3)
113 SDRAM_AO2 114 SDRAM_AO3 115 SDRAM_AO4 116 V DDD(SDRAM)(3V3)
117 SDRAM_AO5 118 SDRAM_AO6 119 SDRAM_AO7 120 SDRAM_AO8
121 SDRAM_AO9 122 V
125 SDRAM_AO11 126 SDRAM_AO12 127 SDRAM_CLK 128 SDRAM_CLKIN
133 TMS 134 V DDD(C)(1V2) 135 TDI 136 TDO
137 V SS[2] 138 V DDD(JTAG)(3V3) 139 V DDA(PLL)(1V2) 140 V DDA(OSC)(1V2)
141 XTALI 142 XTALO 143 V DDD(MEM)(1V2) 144 V SS[2]
Table 4. Pin allocation table (HLQFP144) …continued Table 5. Pin description overview Table 6. Pin description (power supplies)
[1] Table 15 defines the pin type. [1] Table 15 defines the pin type. [3] 256 × fS output, required by some external DACs. Table 7. Pin description (baseband interface)
73 OL serial data output line of third I 2S-bus output interface;
Table 6. Pin description (power supplies) …continued
[1] Table 15 defines the pin type. Table 8. Pin description (generic tuner interface) Table 9. Pin description (SDRAM interface)
[1] Table 15 defines the pin type. [1] Table 15 defines the pin type. Table 10. Pin description (serial NOR-Flash interface)
[1] Table 15 defines the pin type. [1] Table 15 defines the pin type. [1] Table 15 defines the pin type. Table 11. Pin description (external host microcontroller interface) Table 12. Pin description (JTAG interface) Table 13. Pin description (crystal oscillator) Table 14. Pin description (internally connected pins)
or malfunction of the device. Table 15. Pin type description
[1] Class 2 according to JEDEC JESD22-A114. [2] According to AEC-Q100-G. electrical reasons. For soldering considerations, see Section 10. the effective Rth(j-a) all power and ground pins must be connected to the power and ground layers directly. conductance after curing is recommended. Table 16. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Table 17. Thermal characteristics
Product short data sheet Rev. 03 — 15 September 2010 14 of 20 NXP Semiconductors SAF3560 Terrestrial digital radio processor 9. Package outline Fig 4. Package outline SOT612-4 (HLQFP144) REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT612-4 MS-026 SOT612-4 07-12-11 08-01-18 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. UNIT A max mm 1.6 0.12 0.05 1.45 1.35 0.27 0.17 0.20 0.09 20.1 19.9 4.3 4.1 4.3 4.1 0.5 22.15 21.85 1.4 1.1 1.4 1.1 A DIMENSIONS (mm are the original dimensions) HLQFP144: plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad 0 5 10 mm scale A2 A3 0.25 bp c D(1) Dh E(1) 20.1 19.9 Eh e HD 22.15 21.85 HE L Lp 0.75 0.45 v 0.2 y 0.08 w 0.08 ZD(1) ZE(1) θ detail X θ A L A2 (A3) Lp c y Xexposed die pad bp bp D E HD HE ZD ZE B A e e w M w M vBM vAM Dh Eh 144 13 6 73108 109 pin 1 index
Product short data sheet Rev. 03 — 15 September 2010 15 of 20 NXP Semiconductors SAF3560 Terrestrial digital radio processor 10. Soldering Fig 5. Soldering footprint SOT612-4 (HLQFP144) SOT612-4 DIMENSIONS in mm Footprint information for reflow soldering of HLQFP144 package Ax Bx Gx GyHy Hx AyBy P1P2 D2 (8×) D1 (0.125) C Generic footprint pattern Refer to the package outline drawing for actual layout occupied area solder paste solder land SPx tot SPy tot nSPx nSPy SPx SPy SLx SLy nSPx nSPy Ax Ay Bx By D1 D2 Gx Gy Hx Hy 23.300 23.300 20.300 20.300 0.500 0.560 0.280 C SLx SLy SPx tot SPy tot SPx SPy
Table 18. Abbreviations
Table 19. Revision history
- The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors.
- Legal texts have been adapted where appropriate.
- Minor text changes SAF3560_SDS v.2 20100503 Product short data sheet - -
Product short data sheet Rev. 03 — 15 September 2010 18 of 20 NXP Semiconductors SAF3560 Terrestrial digital radio processor 13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This docu ment contains the product specification.
Product short data sheet Rev. 03 — 15 September 2010 19 of 20 NXP Semiconductors SAF3560 Terrestrial digital radio processor Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
13.4 Licenses
13.5 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. HD Radio — is a trademark of iBiquity Digital Corporation. HD Radio — logo is a registered trademark of iBiquity Digital Corporation. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com ICs with HD Radio functionality NXP Semiconductors ICs with HD Radio functionality are manufactured under license from iBiquity Digital Corporation. Sale or distribution of equipment that includes this device requires a license, which may be obtained at: iBiquity Digital Corporation, 6711 Columbia Gateway Drive, Suite 500, Columbia MD 21046, USA. Telephone: +1 (443) 539 4290, fax: +1 (443) 539 4291, e-mail: info@ibiquity.com
NXP Semiconductors SAF3560 Terrestrial digital radio processor © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 September 2010 Document identifier: SAF3560_SDS Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 15. Contents