SAE6530P0DA01

SAE6530P0DA01 SANKEN | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 29

Technical content

Datasheet sections

Features

• AEC-Q100 Qualified
• Bare Lead Frame: Pb-free (RoHS Compliant)
• Isolation Voltage: 2500 V (for 1 min)
• Built-in Thermistor
• Built-in Bootstrap Diodes
• CMOS-compatible Input (3.3 V or 5 V)
• Fault Signal Output at Protection Activation
• Shutdown Signal Input
• Adjustable OCP Hold Time
• Protections Include: Undervoltage Lockout for Power Supply VBx Pin (UVLO_VBx): Auto-restart VCCx H Pin (UVLO_VCCxH): Auto-restart VCCL Pin (UVLO_VCCL): Auto-restart Overcurrent Protection (OCP): Auto-restart Typical Application High-side MIC1 W U VFO COM INWL INVL INUL INWH INVH INUH P V OCP NW NV VVFO-PU RS Controller M VP I NW H I NV H I NU H I NW L I NV L I NU L Fault GND NU VCC Low-side MIC VCCL CFO 19

28 TH2

Tem p. Tem p. VBW VSW VBV VSV VBU VSU VCCWH VCCVH VCCUH CP High-side MIC2 High-side MIC3 RVFO CVFO SAE6530P0DA01 Package DIP29 Pin Pitch: 2.54 mm Mold Dimensions: 60 × 31 × 6.3 mm Not to scale Specifications

• Output Transistors: IGBT + Freewheeling Diode
• Output Transistor Breakdown Voltage: 650 V
• Rated Current: 30 A

Applications

For driving 3 -phase motor of the following high voltage auxiliary equipment system such as hybrid electric vehicles (HEV) and electric vehicles (EV):

• Electric Compressor
• Electric Oil Pump

SAE6530P0DA01-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 3 Sep. 25, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018

SAE6530P0DA01-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 4 Sep. 25, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 1. Introduction For pin descriptions, this docment employs a notation system that denotes a pin name with the arbitrary letter “x”, depending on context. The U-, V-, and W-phase (3-phases) output pins are represented as the pin numbers U, V, and W, respectively. Thus, “the VBx pin” is used when referring to any or all of the VB U, VB V, and VB W pins. When different pin names are mentioned as a pair (e.g., “the VBx and V Sx pins”), they are meant to be the pins in the same phase. Also, “the OUTx pin” is used when referring to any or all of the output pins (U, V, and W). Current polarities are defined as follows: current going into the IC (sinking) is positive current (+); current coming out of the IC (sourcing) is negative current (−). 2. Absolute Maximum Ratings Unless specifically noted, TA = 25 °C. Parameter Symbol Conditions Ratings Unit Main Power Supply Operation Main Supply Voltage VP In operation, P–COM 500 V In non-operation, P–COM 650 V Output Collector-to-Emitter Voltage (Surge) VCE(SURGE) In operation, P–OUTx, OUTx–Nx 550 V Collector-to-Emitter Voltage VCES In non-operation, P–OUTx, OUTx–Nx 650 V Collector Current(1) IC TC = 25 °C 30 A Collector Current (Peak) ICP TC = 25 °C, pulse width < 1 ms, duty cycle < 1% 60 A Power Dissipation PC TC = 25 °C, 1 element operating (IGBT) 125 W TC = 25 °C, 1 element operating (fleewheeling diodes) 62.5 W Control Nx Pin Voltage VNx Nx–COM −5 to 5 V VCCxH Pin Voltage VVCCxH VCCxH–COM −0.5 to 20 V VCCL Pin Voltage VVCCL VCCL–COM −0.5 to 20 V VBx-VSx Voltage VVBx-VSx VBx–VSx −0.5 to 20 V INxH Pin Voltage VINxH INxH–COM −0.5 to 5.5 V INxL Pin Voltage VINxL INxL–COM −0.5 to 5.5 V VFO Pin Voltage VVFO VFO–COM −0.5 to 5.5 V VFO Pin Sink Current IVFO 1 mA OCP Pin Voltage VOCP OCP–COM −0.5 to 5.5 V Change Rate of VCC Supply Voltage Time ΔVVCC/Δt −1 to 1 V/μs Bootstrap Circuit Bootstrap Diode Reverse Voltage VR-BS 650 V (1) Should be derated depending on an actual case temperature. See Section 15.4.

SAE6530P0DA01-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 5 Sep. 25, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 Parameter Symbol Conditions Ratings Unit Thermistor Operating Thermistor Temperature TTH −40 to 150 °C Thermistor Allowable Current ITH-MAX 10 mA Thermistor Allowable Power PTH-MAX 300 mW Common Junction Temperature(2) TJ −40 to 150 °C Operating Case Temperature(3) TC For measurement point, see Figure 2-1. −40 to 125 °C Storage Temperature TSTG −40 to 150 °C Isolation Voltage(4) VISO(RMS) Between surface of heatsink side and each pin; AC, 60 Hz, 1 min 2500 V (2) Refers to the junction temperature of each chip built in the IC, including the monolithic IC (MIC), IGBT s, and freewheeling diodes. (3) Refers to a case temperature measured during IC operation. (4) Refers to voltage conditions to be applied between the case and all pins. All pins have to be shorted. Measurement point 2921 120 16.44 mm 33.35 mm Figure 2-1. Operating Case Temperature Measurement Point

SAE6530P0DA01-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 6 Sep. 25, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 3. Recommended Operating Conditions Unless specifically noted, TC = −40 °C to 125 °C, VP = 300 V, VVCCxH = VVCCL = 15 V, RVFO = 10 kΩ, CVFO = 0 μF, and VVFO-PU = 5 V. Parameter Symbol Conditions Min. Typ. Max. Unit Main Supply Voltage VP P–COM 150 300 450 V Phase Current (Effective Value)(1) IC(RMS) Sine wave, modulation index = 1, power factor = 0.8, −40°C ≤ TJ ≤ 150°C fPWM = 5 kHz — — 21 A fPWM = 10 kHz — — 17 fPWM = 15 kHz — — 14 fPWM = 20 kHz — — 11 VCCxH Pin Voltage VVCCxH VCCxH–COM 13.5 15.0 16.5 V VCCL Pin Voltage VVCCL VCCL–COM 13.5 15.0 16.5 V VBx-VSx Voltage VVBx-VSx VBx–VSx 13.5 15.0 16.5 V Dead Time of Input Signal tDEAD INxH, INxL 2.0 2.5 — μs PWM Control Frequency fPWM 5 10 20 kHz INxH Pin Input Pulse Width (On) tINXH(ON) 0.5 — — μs INxH Pin Input Pulse Width (Off) tINXH(OFF) 0.5 — — μs INxL Pin Input Pulse Width (On) tINXL(ON) 0.5 — — μs INxL Pin Input Pulse Width (Off) tINXL(OFF) 0.5 — — μs P Pin Capacitor CP 22 47 — μF VCCxH/VCCL Pin Capacitor 1 CVCC1 22 47 — μF VCCxH/VCCL Pin Capacitor 2 CVCC2 Ceramic capacitor 0.47 1.0 2.2 μF Bootstrap Capacitor 1 CBS1 4.7 10 22 μF Bootstrap Capacitor 2 CBS2 Ceramic capacitor 0.47 1.0 2.2 μF External VCC Supply Output Current IVCC fPWM = 5 kHz 15 — — mA fPWM = 10 kHz 18 — — fPWM = 15 kHz 21 — — fPWM = 20 kHz 24 — — VCCxH/VCCL Pin Zener Diode Breakdown Voltage VZ-DVCC IZ = 1 mA 16.5 18.2 20.0 V VFO Pin Pull-up Resistor RVFO 5.5 10 33 kΩ VFO Pin Pull-up Voltage VVFO_PU 3.0 5.0 5.5 V VFO Pin Capacitor CVFO — 1000 3300 pF CFO Pin Capacitor CCFO 0.01 0.1 1 μF Shunt Resistor RS OCP operating current: 30 A to 60 A 9.0 12.2 15.3 mΩ OCP RC Filter Time Constant tRFCF tRFCF = RF × CF 1.0 1.5 2.0 μs Thermistor Operating Current ITH — — 0.3 mA (1) The maximum value of the phase current varies depending on application conditions.

SAE6530P0DA01-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 7 Sep. 25, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 4. Electrical Characteristics Unless specifically noted, TC = −40 °C to 125 °C, VP = 300 V, VVCCxH = VVCCL = 15 V, RVFO = 10 kΩ, CVFO = 0 μF, and VVFO-PU = 5 V. The shipping test is performed at T A = 25 °C and 125 °C for the electrical characteristics shown below (except for the parameters guaranteed by design). 4.1. Characteristics of Control Parts Parameter Symbol Conditions Min. Typ. Max. Unit Remarks Power Supply Operation VCCxH Pin Operating Voltage VVCCxH_H 11.0 11.6 12.5 V UVLO recovery voltage VCCxH Pin Operating Stop Voltage VVCCxH_L 10.5 11.1 12.0 V UVLO detection voltage VCCxH Pin Hysteresis VVCCxH_HYS — 0.5 — V VCCL Pin Operating Voltage VVCCL_H 12.0 12.6 13.5 V UVLO recovery voltage VCCL Pin Operating Stop Voltage VVCCL_L 11.5 12.1 13.0 V UVLO detection voltage VCCL Pin Hysteresis VVCCL_HYS — 0.5 — V VBx−VSx Operating Voltage VVBx-VSx_H 11.0 11.6 12.5 V UVLO recovery voltage VBx−VSx Operating Stop Voltage VVBx-VSx_L 10.5 11.1 12.0 V UVLO detection voltage VBx−VSx Hysteresis VVBx-VSx_HYS — 0.5 — V VCCxH Pin Input Current IVCCXH VINxH = 0 V, each pin — 1.1 2.0 mA VINxH = 5 V, each pin — 1.1 2.0 VCCL Pin Input Current IVCCL VINxL = 0 V — 2.2 3.0 mA VINxL = 5 V — 2.8 4.0 VBx−VSx Input Current IVBx-VSx VVBx-VSx = 15 V, VINxH = 0 V, in 1-phase operation — 0.09 0.30 mA VVBx-VSx = 15 V, VINxH = 5 V, in 1-phase operation — 0.11 0.30 Input Signal INxH Pin High-level Input Threshold Voltage VINxH_H — 2.0 2.5 V INxH Pin Low-level Input Threshold Voltage VINxH_L 1.0 1.5 — V INxH Pin Hysteresis VINxH_HYS — 0.5 — V INxL High-level Input Threshold Voltage VINxL_H — 2.0 2.5 V INxL Pin Low-level Input Threshold Voltage VINxL_L 1.0 1.5 — V INxL Pin Hysteresis VINxL_HYS — 0.5 — V INxH Pin Input Current IINxH VINxH = 5 V, each pin — 0.23 0.50 mA INxL Pin Input Current IINxL VINxL = 5 V, each pin — 0.23 0.50 mA INxH Pin Minimum Response Pulse Width (On)(1) tINXH_MIN(ON) — 0.34 0.50 μs (1) Guaranteed by design.

SAE6530P0DA01-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 8 Sep. 25, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 Parameter Symbol Conditions Min. Typ. Max. Unit Remarks INxH Pin Minimum Response Pulse Width (Off) (2) tINXH_MIN(OFF) — 0.36 0.50 μs INxL Pin Minimum Response Pulse Width (On) (2) tINXL_MIN(ON) — 0.26 0.50 μs INxL Pin Minimum Response Pulse Width (Off) (2) tINXL_MIN(OFF) — 0.27 0.50 μs Fault Signal Output and Shutdown Signal Input VFO Pin Shutdown Release Voltage VVFO_H — 2.0 2.5 V VFO Pin Shutdown Threshold Voltage VVFO_L 1.0 1.5 — V VFO Pin Shutdown Hysteresis VVFO_HYS — 0.5 — V VFO Pin Output Voltage in Normal Operation VVFO_H VVFO_PU = 5 V, RVFO = 10 kΩ, VOCP = 0 V 4.8 5.0 — V VFO Pin Error Signal Output Voltage VVFO_L VVFO_PU = 5 V, RVFO = 10 kΩ, VOCP = 1 V — 0.05 0.50 V VFO Pin OCP Hold Time(2) (3) tVFO CCFO = 0 μF 0.022 0.032 0.044 ms CCFO = 0.001 μF 0.22 0.32 0.44 ms CCFO = 0.01 μF 2.2 3.2 4.2 ms CCFO = 0.1 μF 22 32 42 ms CCFO = 1 μF 220 320 420 ms Protection OCP Pin Overcurrent Detection Voltage VOCP_H 0.46 0.50 0.54 V OCP Pin Overcurrent Release Voltage VOCP_L 0.32 0.38 0.44 V OCP Pin Overcurrent Hysteresis VOCP_HYS — 0.12 — V OCP Pin Detection Delay Time tOCP_DELAY (4) — 2.7 5.0 μs OCP Pin Input Current IOCP VOCP = 0.5 V — 0 — mA (2) Guaranteed by design. (3) For a relation between tVFO and CCFO, see Figure 13-3. The shipping test is performed with the condition at CCFO = 0.01 μF only. (4) For the measurement circuit for the OCP Pin Detection Delay Time, see Figure 4-1 (all the pins that are not represented in the figure are open). Figure 4-2 provides the definition of the OCP Pin Detection Delay Time. COM U NW NV NU 23OCP VFO INUL 10 kΩ

15 V5 V

0→1V VCCL 10 Ω 15 V OCP VFO U 50% tOCP_DE LAY 15 V 50% 1 V Figure 4-1. Measurement Circuit for OCP Pin Detection Delay Time Figure 4-2. OCP Pin Detection Delay Time Definition

SAE6530P0DA01-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 10 Sep. 25, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 4.3. Bootstrap Diode Characteristics Parameter Symbol Conditions Min. Typ. Max. Unit Remarks Bootstrap Diode Forward Voltage VF_BS IF_BS = 0.1 A 2.1 3.1 4.1 V Including voltage drop of series resistor Bootstrap Diode Series Resistor* RS_BS 15 24 33 Ω * Guaranteed by design. 4.4. Thermistor Characteristics Parameter Symbol Conditions Min. Typ. Max. Unit Remarks Thermistor Resistance* R25 TA = 25 °C — 30 — kΩ Including voltage drop of series resistor * Guaranteed by design. 4.5. Thermal Resistance Characteristics Parameter Symbol Conditions Min. Typ. Max. Unit Remarks Junction-to-Case Thermal Resistance(1) (2) R(J- C)Q (3) 1 element operating (IGBT) — — 1.0 °C/W R(J-C)F (4) 1 element operating (freewheeling diode) — — 2.0 °C/W (1) Guaranteed by design. (2) Refers to a case temperature at the measurement point described in Figure 4-4, below. (3) Refers to steady-state thermal resistance between the junction of the built-in IGBTs and the case. For transient thermal characteristics, see Section 15.1. (4) Refers to steady-state thermal resistance between the junction of the built-in freewheeling diodes and the case. IGBT measurement point 2921 120 9.79 mm 16.44 mm 33.35 mm Freewheeling diode measurement point Figure 4-4. Case Temperature Measurement Point

SAE6530P0DA01-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 12 Sep. 25, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 7. Truth Table Table 7-1 is a truth table that provides the logic level definitions of operation modes. In the case where the INxH and INxL in each phase are high at the same time, both the high- and low-side IGBTs become on (simultaneous on- state). Therefore, INxH and INxL signals, the input signals for the INxH and INxL pins, require dead time setting so that such a simultaneous on-state event can be avoided. Table 7-1. Truth Table for Operation Modes Mode INxH INxL High-side IGBT Low-side IGBT VFO Pin Output Normal Operation L L OFF OFF H H L ON OFF L H OFF ON H H ON ON External Shutdown Signal Input VFO = L L L OFF OFF ― H L ON OFF L H OFF OFF H H ON OFF VBx Pin Undervoltage Lockout Operation (UVLO_VBx) L L OFF OFF H H L OFF OFF L H OFF ON H H OFF ON VCCxH Pin Undervoltage Lockout Operation (UVLO_VCCxH) L L OFF OFF H H L OFF OFF L H OFF ON H H OFF ON VCCL Pin Undervoltage Lockout Operation (UVLO_VCCL) L L OFF OFF L H L ON OFF L H OFF OFF H H ON OFF Overcurrent Protection (OCP) L L OFF OFF L H L ON OFF L H OFF OFF H H ON OFF

SAE6530P0DA01-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 13 Sep. 25, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 8. Block Diagram Low-side Input Logic UVLO P V W NW NV U NU Thermistor TH1 TH2 Low-side Driver W-phase High-side MIC Low-side MIC 29 28 LOU LOV LOW OCP UVLO UVLO High-side Input Logic Level Shift V-phase High-side MIC UVLO UVLO High-side Input Logic Level Shift U-phase High-side MIC UVLO UVLO High-side Input Logic Level Shift HOW HOV HOU High-side Driver High-side Driver High-side Driver VFO COM INWL INVL INUL VCCL INWH OCP CFO 19 VCCWH 11 VBW 10 INVH 8 VCCVH 7 VBV 6 INUH 4 VCCUH 3 VBU 2 VSW 9 VSV 5 VSU 1

SAE6530P0DA01-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 14 Sep. 25, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 9. Pin Configuration Definitions Heatsink side Pin Number Pin Name Description

1 VSU U-phase high-side floating supply ground

2 VBU U-phase high-side floating supply voltage input

3 VCCUH U-phase high-side logic supply voltage input

4 INUH Logic input for U-phase high-side gate driver

5 VSV V-phase high-side floating supply ground

6 VBV V-phase high-side floating supply voltage input

7 VCCVH V-phase high-side logic supply voltage input

8 INVH Logic input for V-phase high-side gate driver

9 VSW W-phase high-side floating supply ground

10 VBW W-phase high-side floating supply voltage input

11 VCCWH W-phase high-side logic supply voltage input

12 INWH Logic input for W-phase high-side gate driver

13 INUL Logic input for U-phase low-side gate driver

14 INVL Logic input for V-phase low-side gate driver

15 INWL Logic input for W-phase low-side gate driver

16 COM Logic ground

17 VCCL Low-side logic supply voltage input

18 VFO Fault signal output and shutdown signal input

19 CFO Capacitor connection for overcurrent protection hold time setting

20 OCP Overcurrent protection signal input

21 NW W-phase low-side IGBT emitter

22 NV V-phase low-side IGBT emitter

23 NU U-phase low-side IGBT emitter

24 W W-phase output

25 V V-phase output

26 U U-phase output

27 P Positive DC bus supply voltage

28 TH2 Thermistor output 2

29 TH1 Thermistor output 1

SAE6530P0DA01-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 15 Sep. 25, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 10. Typical Application CR filters and Zener diodes should be added to your application as needed. This is to protect each pin against surge voltages causing malfunctions, and to avoid the IC being used under the conditions exceeding the absolute maximum ratings where critical damage is inevitable. Then, check all the pins thoroughly under actual operating conditions to ensure that your application works flawlessly. High-side MIC1 W U VFO COM INWL INVL INUL INWH INVH INUH P V OCP NW NV VVFO-PU RS Controller M I NW H I NV H I NU H I NW L I NV L I NU L Fault GND NU VCC Low-side MIC VCCL CFO 19 Tem p. VBW VSW VBV VSV VBU VSU VCCWH VCCVH VCCUH High-side MIC2 High-side MIC3 RVFO CVFO 5 V/3.3 V Thermistor signal RTH CP Thermistor signal CBS1(U) CBS2(U) CVCC1 DVCC CCFO CF RF CVCC2(L) CVCC2(UH) CVCC2(VH) CVCC2(WH) VP CBS1(V) CBS2(V) CBS1(W) CBS2(W) CTH SAE6530P0DA01 Figure10-1. Typical Application

SAE6530P0DA01-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 16 Sep. 25, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 11. Physical Dimensions 11.1. DIP29 IH F E E A=2.54±0.5 C=5.08±0.5 D=7.62±0.5 0.5 ±0.15 2.43 ±0.15 CCDDDDDA +0.15 -0.05 (7.8) +0.15 -0.05 +0.15 -0.05 (7.8) 12.7 ±0.6 +0.15 -0.05 +0.15 -0.05 (6.24) (7.01) (4.6) (4.6) 20 pin1 pin 29 pin 21 pin G (1.8) 10.6 ±0.3 35.49 ±0.5 0.9 ±0.2 0.52 +0.15 -0.05 6.3 ±0.2 3.09 ±0.2 (1.5) (5.5) (5.5) 31.0 ±0.3 (18.95) (15.95) 34.9 ±0.3 φ4.5 ±0.2 (φ4.88) (φ4.59) 5.3 ±0.2 B A B A A A A B B B A A A A A A A A A 12.7 ±0.6 60.0 ±0.3 A=2.54±0.5 B=4.2±0.5 (2) (0.79) (1.2) (3.46)

2.0 MAX

(0.82)(0.42) (0.62) (1) （０～５°） 1.02 1.22 0.62 2.02 1.22 Section view of E-E Detailed view of H Detailed view of I Detailed view of G Detailed view of F Heatsink side NOTES:

• Dimensions in millimeters
• Bare lead frame: Pb-free (RoHS compliant)

SAE6530P0DA01-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 17 Sep. 25, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 11.2. Reference PCB Hole Sizes 1 pin ~ 20 pin, 28 pin, 29 pin 21 pin ~ 27 pin φ1.32 φ1.83 12. Marking Diagram 1 20 Part Number Lot Number Y is the last digit of the year of manufacture (0 to 9) M is the month of the year (1 to 9, O, N, or D) DD is the day of the month (01 to 31) X is the control number 2129 J APAN YMDDX SAE6530P0DA01 Branding area

SAE6530P0DA01-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 18 Sep. 25, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 13. Functional Descriptions All the characteristic values given in this section are typical values, unless they are specified as minimum or maximum. Also, the symbols of the electrical characteristics in Section 4 and the electrical symbol names in Section 10 are used. For the notation system such as pin name used in this section, see Section 1. 13.1. Turning On and Off the IC The procedures listed below provide recommended startup and shutdown sequences. To turn on the IC properly, do not apply any voltage to the INxH and INxL pins until the VCC L pin voltage has reached the maximum value (VVCCL_H ≥ 13.5 V). It is required to charge bootstrap capacitors, CBS1 and CBS2, up to full capacity at startup (see Section 13.2.3). To turn off the IC, set the input signals to the INxH and INxL pins to logic low (or “L”), and then decrease the VCCL pin voltage. 13.2. Pin Descriptions 13.2.1. P This is the input pin for the main supply voltage, i.e., the positive DC bus. All of the IGBT collectors of the high-side are connected to this pin. Voltages to be applied between the P and COM pins should be regulated within the recommended operational range of the main supply voltage, 150 V to 450 V. To suppress the surge voltage, a capacitor of 22 µF or more (CP), should be connected between the P and COM pins. When connecting CP, place it as near as possible to the IC with a minimum length of traces to the P and Nx pins. For more details about PCB pattern layout, see Section 14.1. 13.2.2. U, V, and W These pins are the outputs of the three phases, and serve as the connection terminals to the 3 -phase motor. The U, V, and W pins are internally connected to the VSU, VSV, and VSW pins, respectively. 13.2.3. NU, NV, and NW These are the emitter pins of the low -side IGBTs. For current detection, the NU, NV, and NW pins should be connected externally on a PCB via a shunt resistor, RS. When connecting R S, place it as near as possible to the IC with a minimum length of traces to the Nx pin and CP. For more details about PCB pattern layout, see Section 14.1. 13.2.4. VBU, VBV, and VBW These are the inputs of the high -side floating power supplies for the individual phases. Voltages to be applied between the VBx and VSx pins (hereafter “VBx–VSx”) of each p hase should be regulated within the recommended operational range, 13.5 V to 16.5 V. The capacitors for bootstrap circuit, CBS1 and CBS2, are connected between VB x–VSx of each phase, respectively. The value of CBS1 should be 4.7 μF to 22 μF. The value of CBS2 should be 0.47 μF to 2.2 μF. To protect the VBx pin against such a noise effect, add the bootstrap capacitor s, CBS1 and CBS2, in each phase. CBS1 and CBS2 must be placed near the IC, and be connected between VB x–VSx with a minimal length of traces. For proper startup, turn on the low -side IGBTs first, and then fully charge the bootstrap capacitor s, CBS1 and CBS2. As Figure 13-1 shows, a bootstrap diode, D BOOTx, and a n inrush current-limiting resistor, R BOOTx, are internally placed in series between the VCCx H and VBx pins. Even while the high-side IGBT is off, voltages of CBS1 and CBS2 keep decreasing due to power dissipation in the IC. When the VB x–VSx voltage decreases to V VBx- VSx_L= 11.1 V or less, the VBx pin undervoltage lockout is activated ( see Section 13.3.3.1). Therefore, actual board c hecking should be done thoroughly to validate that VBx–VSx voltage maintains over 12.0 V ( VBx– VSx > VVBx-VSx_L) during a low -frequency operation such as a startup period. High-side MIC1 W U P V NW NV RS M NU VCC Low-side MIC VCCL VBW VSW VBV VSV VBU VSU VCCWH VCCVH VCCUH High-side MIC2 High-side MIC3 CBS1(U) CBS2(U) VP RBOOT1 DBOOT1 RBOOT2 DBOOT2 RBOOT3 DBOOT3 CBS1(W) CBS2(W) COM CBS1(V) CBS2(V) Figure 13-1. Bootstrap Circuit

SAE6530P0DA01-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 26 Sep. 25, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 15. Typical Characteristics 15.1. Thermistor Resistance Table 15-1. Thermistor Resistance Thermistor Temperature Thermistor Resistance (kΩ) Error (%) −40 946 1024 1104 -7.6% 0% 7.8% −35 684 737 792 -7.3% 0% 7.4% −30 500 537 575 -6.9% 0% 7.1% −25 370 396 422 -6.6% 0% 6.7% −20 276 294 313 -6.3% 0% 6.4% −15 208 221 235 -6.0% 0% 6.1% −10 158 168 177 -5.7% 0% 5.8% −5 121 128 135 -5.5% 0% 5.5%

SAE6530P0DA01-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 27 Sep. 25, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 15.2. Bootstrap Diode Characteristics, IF vs. VF 15.3. Transient Thermal Resistance Curve Figure 15-1. Transient Thermal Resistance Curve 200 400 600 800 1000 0 5 10 15 20 25 Forward Current, IF (mA) Forward Voltage, VF (V) 0.01 0.10 1.00 0.001 0.01 0.1 1 10 Ratio of Transient Thermal Resistance Time (s)

SAE6530P0DA01-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 28 Sep. 25, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 15.4. Reference Allowable Effective Current Curves The following curve represent s allowable effective current in 3-phase sine -wave PWM driving with the maximum parameters such as VCE(SAT), VF, switching loss, recovery loss, and thermal resistance. Operating conditions: P pin input voltage, V P = 300 V; input voltage s of VCCxH and VCCL pins, VVCCxH = V VCCL = 15 V; modulation index, M = 1 ; motor power factor, cosθ = 0.8; carrier frequency, fPWM = 10 kHz ; junction temperature, T J = 150 °C ; case-to-heatsink thermal resistance, R(C-F) = 0.44 °C/W; motor rotation speed, 600 rpm; number of motor pole pairs, 3. Figure 15-2. Reference Allowable Current Curve 80 90 100 110 120 130 140 150 Allowable Effective Current (Arms) Heatsink Temperature, TF (°C)

SAE6530P0DA01-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 29 Sep. 25, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 Important Notes

• All data, illustrations, graphs , tables and any other information included in this document (the “Information”) as to Sanken’s products listed herein (the “Sanken Products”) are current as of the date this document is issued . The Information is subject to any change without notice due to improv ement of the Sanken Products , etc. Please make sure to confirm with a Sanken sales representative that the contents set forth in this document reflect the latest revisions before use.
• The Sanken Products are intended for use as components of general purpos e electronic equipment or apparatus (such as home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Prior to use of the Sanken Products, please put your signature, or affix your name and seal, on the specification docum ents of the Sanken Products and return them to Sanken. When considering use of the Sanken Products for any applications that require higher reliability (such as transportation equipment and its control systems, traffic signal control systems or equipment , disaster/crime alarm systems, various safety devices, etc.), you must contact a Sanken sales representative to discuss the suitability of such use and put your signature, or affix your name and seal, on the specification documents of the Sanken Products and return them to Sanken, prior to the use of the Sanken Products. The Sanken Products are not intended for use in any applications that require extremely high reliability such as: aerospace equipment; nuclear power control systems; and medical equipment or systems, whose failure or malfunction may result in death or serious injury to people, i.e., medical devices in Class III or a higher class as defined by relevant laws of Japan (collectively, the “Specific Applications”). Sanken assumes no liability or re sponsibility whatsoever for any and all damages and losses that may be suffered by you, users or any third party, resulting from the use of the Sanken Products in the Specific Applications or in manner not in compliance with the instructions set forth herein.
• In the event of using the Sanken Products by either (i) combining other products or materials or both therewith or (ii) physically, chemically or otherwise processing or treating or both the same, you must duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility.
• Although Sanken is making efforts to enhance the quality and reliability of its products, it is impossible to completely avoid the occurrence of any failure or defect or both in semiconductor products at a certain rate. You must take, at your own responsibility, preventative measures including using a sufficient safety design and confirming safety of any equipment or systems in/for which the Sanken Products are used, upon due consideration of a failure occurrence rate and derating, etc., in order not to cause any human injury or death, fire accident or social harm which may result from any failure or malfunction of the Sanken Products. Please refer to the relevant specification documents and Sanken’s official website in relation to derating.
• No anti-radioactive ray design has been adopted for the Sanken Products.
• The circuit constant, operation examples, circuit examples, pattern layout examples, design examples , recommended examples, all information and evaluation results based thereon, etc., described in this document are presented for the sole purpose of reference of use of the Sanken Products.
• Sanken assumes no responsibility whatsoever for any and all damages and losses that may be suffered by you, users or any third party, or any possible infringement of any and all property rights including intellectual property rights and any other rights of you, users or any third party, resulting from the Information.
• No information in this document can be transcribed or copied or both without Sanken’s prior written consent.
• Regarding the Information, no license, express, implied or otherwise, is granted hereby under any intellectual property rights and any other rights of Sanken.
• Unless otherwise agreed in writing between Sanken and you, Sanken makes no warranty of any kind, whether express or implied, including, without limitation, any warranty (i) as to the quality or performance of the Sanken Products (such as implied w arranty of merchantability, and implied warranty of fitness for a particular purpose or special environment), (ii) that any Sanken Product is delivered free of claims of third parties by way of infringement or the like, (iii) that may arise from course of performance, course of dealing or usage of trade, and (iv) as to the Information (including its accuracy, usefulness, and reliability).
• In the event of using the Sanken Products, you must use the same after carefully examining all applicable environmental laws and regulations that regulate the inclusion or use or both of any particular controlled substances, including , but not limited to, the EU RoHS Directive, so as to be in strict compliance with such applicable laws and regulations.
• You must not use the Sanken Products or the Information for the purpose of any military applications or use, including but not limited to the development of weapons of mass destruction. In the event of exporting the Sanken Products or the Information, or providing them for non-residents, you must comply with all applicable export control laws and regulations in each country including the U.S. Export Administration Regulations (EAR) and the Foreign Exchange and Foreign Trade Act of Japan , and follow the procedures required by such applicable laws and regulations.
• Sanken assumes no responsibility for any troubles, which may occur during the transportation of the Sanken Products including the falling thereof, out of Sanken’s distribution network.
• Although Sanken has prepared this d ocument with its due care to pursue the accuracy thereof, Sanken does not warrant that it is error free and Sanken assumes no liability whatsoever for any and all damages and losses which may be suffered by you resulting from any possible errors or omissions in connection with the Information.
• Please refer to our official website in relation to general instructions and directions for us ing the Sanken Products, and refer to the relevant specification documents in relation to particular precautions when using the Sanken Products.
• All rights and title in and to any specific trademark or tradename belong to Sanken and such original right holder(s). DSGN-CEZ-16003