SAB6456T

SAB6456 PHILIPS | Alldatasheet

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Product specification File under Integrated Circuits, IC02 June 1986 INTEGRATED CIRCUITS SAB6456 SAB6456T Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler

Philips Semiconductors Product specification Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler SAB6456 SAB6456T GENERAL DESCRIPTION The SAB6456/SAB6456T is a prescaler for UHF/VHF tuners. It can be switched to divide-by-64 or divide-by-256 by the mode-control (MC) pin. The circuit has an input frequency range of 70 MHz to 1 GHz, has high input sensitivity and good harmonic suppression. QUICK REFERENCE DATA PACKAGE OUTLINES SAB6456 : 8-lead DIL; plastic (SOT97); SOT97-1; 1996 November 18. SAB6456T: 8-lead mini-pack (SO8; SOT96A); SOT96-1; 1996 November 18. PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply voltage pin 8 to pin 4 V CC 4,5 5,0 5,5 V Supply current pin 8 I CC − 21 − mA Input frequency range pins 2 and 3 f i 70 − 1000 MHz Sensitivity to input voltage (r.m.s. value) V i(rms) −− 10 mV Output voltage (peak-to-peak value) pins 6 and 7 V o(p-p) − 1 − V Operating ambient temperature range T amb 0 − 80 °C Fig.1 Block diagram.

Philips Semiconductors Product specification Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler SAB6456 SAB6456T Fig.2 Pinning diagram. PINNING 1. n.c. not connected 2. C1 differential inputs3. C2 4. V EE ground (0 V) 5. MC mode control 6. Q H complementary outputs7. Q L 8. V CC positive supply voltage FUNCTIONAL DESCRIPTION The circuit comprises an input amplifier, a divider stage with selectable division ratio and an output stage. The input amplifier is driven by a sinusoidal signal from the local oscillator of a television tuner. The inputs (C1, C2) are differential and are biased internally to permit capacitive coupling. When driven asymmetrically the unused input should be connected to ground via a capacitor. The mode-control (MC) input to the divider stage is intended for static control of the division ratio, selection is made as follows: divide-by-64: MC pin open-circuit divide-by-256: MC pin connected to ground The divider stage may oscillate during no-signal conditions but this oscillation is suppressed when input signals are received. Two complementary signals (Q H , QL) are provided by the output differential amplifier stage. The voltage-edges of the output signals are slowed internally to reduce harmonics in the television intermediate frequency band.

Philips Semiconductors Product specification Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler SAB6456 SAB6456T ELECTROSTATIC DISCHARGE PROTECTION Inputs and outputs have electrostatic discharge protection according to specification MIL-883C, class B. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC-134) THERMAL RESISTANCE D.C. CHARACTERISTICS VCC =5V ; VEE =0V ; Tamb =2 5°C; test IC mounted in a test socket or on a printed circuit board; measurements taken after thermal equilibrium is established PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply voltage pin 8 to pin 4 V CC −− 7,0 V Input voltage V i −− VCC V Storage temperature range T stg −55 −+ 150 ° C Junction temperature T j −−+ 150 ° C From junction to ambient 8-lead DIL; plastic (SOT-97A) R th j-a 120 K/W 8-lead mini-pack (SO-8; SOT-96A) on printed circuit board R th j-a 260 K/W on ceramic substrate R th j-a 170 K/W PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Output voltage HIGH V OH −− VCC V Output voltage LOW V OL −− VCC − 0.8 V Supply current I CC − 21 28 mA Mode-control (MC) Input voltage LOW (divide-by-256) V IL 0 − 0,2 V Input current LOW −IL − 25 60 µA Input voltage HIGH (divide-by-64) pin 5 open-circuit V IH 1,4 − 3,0 V

Philips Semiconductors Product specification Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler SAB6456 SAB6456T A.C. CHARACTERISTICS VCC = 4,5 to 5,5 V; VEE =0V ; Tamb = 0 to+80 °C PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Sensitivity to input 50 Ω system voltage (r.m.s. value) f i= 70 MHz V i(rms) −− 10 mV fi= 150 MHz V i(rms) −− 10 mV fi= 300 MHz V i(rms) −− 10 mV fi= 500 MHz V i(rms) −− 10 mV fi= 900 MHz V i(rms) −− 10 mV fi= 1000 MHz V i(rms) −− 10 mV Input overload voltage 50 Ω system (r.m.s. value) f i= 70 MHz to

1000 MHz V i 300 −− mV

Input parallel resistance f i= 70 MHz R i − 560 −Ω fi= 1000 MHz R i − 30 −Ω Input capacitance f i= 70 MHz C i − 5 − pF fi= 1000 MHz C i − 1,5 − pF Output voltage HIGH V OH −− VCC V Output voltage LOW V OL −− VCC − 0,8 V Output voltage swing (peak-to-peak value) f i= 70 MHz V o(p-p) 0,8 1,0 1,2 V fi= 1000 MHz; R L = 820Ω ; C L =6 0p F V o(p-p) 0,17 −− V Attenuation of third harmonic at output f i= 800 MHz; R L = 820Ω ; C L =6 0p F −15 −23 − dB Output unbalance see Fig.3 ΔVo −− 0,1 V Output resistance R o − 500 −Ω

Philips Semiconductors Product specification Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler SAB6456 SAB6456T Fig.3 Test circuit for output unbalance measurement. Fig.4 Typical input sensitivity curve: VCC =5V ; Tamb =2 5°C. Fig.5 Smith chart of typical input impedance: Vi(rms)= 25 mV; VCC = 5 V; reference value = 50Ω .

Philips Semiconductors Product specification Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler SAB6456 SAB6456T PACKAGE OUTLINES REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT97-1 92-11-17 95-02-04 UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M ZHL mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max.wM Ee1 1.73 1.14 0.53 0.38 0.36 0.23 9.8 9.2 6.48 6.20 3.60 7.80 10.0 inches 0.068 0.045 0.021 0.015 0.014 0.009 1.07 0.89 0.042 0.035 0.39 0.36 0.26 0.24 0.14 0.31 0.39 050G01 MO-001AN M H c (e )1 M E A L seating plane w M e D A 2 Z b E 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. pin 1 index DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1

Philips Semiconductors Product specification Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler SAB6456 SAB6456T UNIT A max. A 1 A 2 A 3 bp cD (1) E (2) (1)eH E LL p QZ ywv θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 0.7 0.6 0.7 0.3 8 o o 0.25 0.10.25 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 1.0 0.4 SOT96-1 X w M θ AA 1 A 2 bp D H E Lp Q detail X E Z e c L v M A (A )3 A pin 1 index y 076E03S MS-012AA 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.20 0.19 0.16 0.15 0.050 0.244 0.228 0.028 0.024 0.028 0.016 0 2.5 5 mm scale SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 95-02-04 97-05-22

Philips Semiconductors Product specification Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler SAB6456 SAB6456T SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T stg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. R EPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300°C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400°C, contact may be up to 5 seconds. SO R EFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250°C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. W AVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.
• The longitudinal axis of the package footprint must be parallel to the solder flow.
• The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260°C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150°C within 6 seconds. Typical dwell time is 4 seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. R EPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300°C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320°C.

Philips Semiconductors Product specification Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler SAB6456 SAB6456T DEFINITIONS LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.