SAA1310 PHILIPS

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Technical content

Product specification File under Integrated Circuits, IC02 April 1995 INTEGRATED CIRCUITS SAA1310 Control interface for VHS video recorders

Philips Semiconductors Product specification Control interface for VHS video recorders SAA1310

FEATURES

  • Full support of VISS and VASS mode (VHS Index/Address Search System)
  • Read, write and overwrite of Tape Control/head signal (CTL)
  • Power-ON and power-failure indicator
  • 4 general purpose comparators for interface between sensors and microprocessor
  • 2 comparators have a 100 mA output driver
  • PAL and NTSC compatible GENERAL DESCRIPTION The SAA1310 provides an interface between the tape control head in the VHS deck-electronics. The circuit also includes an interface between sensors in the deck mechanics and the microprocessor.

ORDERING INFORMATION

  1. SOT102-1; 1996 December 02. 2. SOT163-1; 1996 December 02. EXTENDED TYPE NUMBER PACKAGE PINS PIN POSITION MATERIAL CODE SAA1310 18 DIL plastic SOT102 (1) SAA1310T 20 SO plastic SOT163A (2)

Philips Semiconductors Product specification Control interface for VHS video recorders SAA1310 Pin numbers in parenthesis refer to the SAA1310T. Fig.1 Block diagram. handbook, full pagewidth comparator 1 comparator 2 comparator 3 comparator 4 SAA1310 (SAA1310T) V ref POWER-ON AND POWER-FAILURE DETECTOR AMPLIFIER FILTER DETECTOR WRITE AMPLIFIER Vref write current VP GNDVP comparator 1 non - inverting input comparator 1 output comparator 2 non - inverting input comparator 2 output comparator 3 inverting input comparator 3 output comparator 4 inverting input comparator 4 output power on/failure output power on/failure capacitor write/read input control head data output reference voltage output control head input/output control head feedback (1) (4) (20) (19) (18) (17) (15) (14) (12) (11) (2) (3) (6) (7) (8) 12 (13) (9) 9 (10) capstan reverse input MEA082 - 1

Philips Semiconductors Product specification Control interface for VHS video recorders SAA1310 PIN CONFIGURATION PINNING (pins in parenthesis refer to SAA1310T) SYMBOL PIN DESCRIPTION CTL FB 1 (1) control head feedback CTL I/O 2 (2) control head input/output V ref 3 (3) reference voltage output CPO/FAIL 4 (4) power on/failure capacitor CIN1 5 (6) comparator 1 input CIN2 6 (7) comparator 2 input CIN3 7 (8) comparator 3 input CIN4 8 (9) comparator 4 input V P 9 (10) supply voltage WRITE/ READ 10 (11) write/read input COUT4 11 (12) comparator 4 output GND 12 (13) ground COUT3 13 (14) comparator 3 output COUT2 14 (15) comparator 2 output COUT1 15 (17) comparator 1 input CTL DATA 16 (18) control head data output PO/FAIL OUT 17 (19) power on/failure output CAPREV 18 (20) capstan reverse input dbook, halfpage MEA083 CAPREV PO/FAIL OUT CTL DATA COUT1 GND COUT2 COUT3 COUT4 CTL FB CTL I/O Vref CPO/FAIL VP CIN1 CIN2 CIN3 CIN4 SAA1310 WRITE/READ handbook, halfpage MEA084 CAPREV PO/FAIL OUT CTL DATA COUT1 CTL FB CTL I/O Vref CPO/FAIL SAA1310T VP CIN1 CIN2 CIN3 CIN4 GND COUT2 COUT3 COUT4 WRITE/READ n.c. n.c. Fig.2 Pin configurations. a. SAA1310. b. SAA1310T.

Philips Semiconductors Product specification Control interface for VHS video recorders SAA1310 LIMITING VALUES (PIN NUMBERS IN PARENTHESIS REFER TO SAA1310T) In accordance with the Absolute Maximum System (IEC 134) THERMAL RESISTANCE SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP supply voltage range 0 6.0 V VI/VO voltage on all pins except pins 11 (12) and 13 (14) 0 V P V VO output voltage on pins 11 (12) and 13 (14) 0 18 V Tstg storage temperature range −65 +150 °C Tamb ambient temperature range 0 +70 °C SYMBOL PARAMETER TYP. MAX. UNIT R th thermal resistance (SAA1310) 75 − K/W R th thermal resistance (SAA1310T) 90 − K/W

Philips Semiconductors Product specification Control interface for VHS video recorders SAA1310 CHARACTERISTICS (PIN NUMBERS IN PARENTHESIS REFER TO SAA1310T) VP =5V ;T amb =2 5°C; all voltage referenced to pin 12 (13); according to the test set-up (see Fig.4); unless otherwise specified SYMBOL PARAMETER CONDITION MIN. TYP. MAX. UNIT Pd power dissipation note 1 − 85 − mW Supply pin 9 (10) VP supply voltage 4.5 5.0 5.5 V IP supply current read mode 10 15 20 mA write mode; duty factor = 50% 13 18 24 mA CTL I/O pin 2 (2) READ MODE PIN 10 (11)< 0.5 V VI input voltage (peak-to- f = 500 Hz 0.35 −− mV peak value) f = 30 kHz; non-linear operation −− 200 mV B bandwidth low-pass filter − 3 − kHz Ib input bias current read mode − 0.1 −µ A WRITE MODE PIN 10 (11)> 3.5 V VO output voltage LOW I CTL I/O= 3 mA; −− 0.4 V pin CTL DATA = HIGH VO output voltage HIGH I CTL I/O= − 3 mA; 4.6 −− V pin CTL DATA = LOW WRITE/ READ pin 10 (11) VI input voltage read mode −− 0.5 V write mode; analog 1.6 − 3.3 V II input current read mode −− 1.5 −µ A write mode − 0.1 −µ A Vref pin 3 (3); note2 VO output voltage 2.4 2.5 2.6 V Itot total current including write current −4 −+ 4m A R O output resistance − 0.4 0.6 Ω CAPREV pin 18 (20) VIH input voltage HIGH 2.0 −− V VIL input voltage LOW −− 0.8 V IIH input current HIGH V CAPREV =5V −− 10 µA IIH input current LOW V CAPREV =0V −10 −− µ A

Philips Semiconductors Product specification Control interface for VHS video recorders SAA1310 CTL DATA pin 16 (18) WRITE MODE VIH input voltage HIGH 2.0 −− V VIL input voltage LOW −− 0.8 V IIH input current HIGH V CTL DATA =5V −− 10 µA IIL input current LOW V CTL DATA =0V −10 −− µ A READ MODE V OL output voltage LOW I OL = 0.5 mA −− 0.4 V VOH output voltage HIGH I OH = − 50 µA 2.4 −− V CPO/FAIL and PO/FAIL OUT pin 4 (4) and 17 (19); see Fig.3 VO operating voltage range at decreasing VP 1.5 − 5.5 V VOL output voltage LOW I OL =1m A −− 0.4 V VOH output voltage HIGH I OH =1m A V P − 0.9 −− V td delay time C CAPREV =6 8n F − 50 − ms VTL1 threshold level 1 4.5 − 4.8 V VTL2 threshold level 2 − 3.5 − V IO source current pin 4 −− 3 −µ A IO sink current pin 4 − 300 −µ A VO(min.) minimum output voltage − 20 − mV VO(max.) maximum output voltage − 2.1 − V High output current type comparators CIN3 and CIN4 pins 7 (8) and 8 (9) Vhys input hysteresis − 10 − mV VIL input voltage LOW −− Vref− 10 mV V VIH input voltage HIGH V ref+ 10 mV −− V IIL input current LOW CIN3 = CIN4 = 0 V −1 −− µ A IIH input current HIGH CIN3 = CIN4 = V P −− + 1 µA COUT3 and COUT4 pins 13 (14) and 11 (12) V OL output voltage LOW I OL = 100 mA −− 1.0 V IOL =2m A −− 0.4 V ±IOL leakage current output voltage HIGH; COUT3 = COUT4 = 17 V −− 1 µA ttr transient time note 3 − 0.5 −µ s Tj thermal protection − 130 −° C SYMBOL PARAMETER CONDITION MIN. TYP. MAX. UNIT

Philips Semiconductors Product specification Control interface for VHS video recorders SAA1310 Notes to the characteristics 1. Without the sink current of the comparators; in write mode. 2. Minimum value of capacitor connected to this pin is 4.7µF. 3. V i= 100 mV p-p. Inputs connected to Vref via a 10 kΩ resistor; outputs connected to VP via a 250Ω resistor. 4. V i= 100 mV p-p. Inputs connected to Vrefvia a 10 kΩ resistor; outputs connected to VP via a 2.5 kΩ resistor. Low output current type comparators CIN1 AND CIN2 pins 5 (6) and 6 (7) Vhys input hysteresis − 10 − mV VIL input voltage LOW −− Vref− 10 mV V VIH input voltage HIGH V ref+ 10 mV −− V II input current CIN1 = CIN2 = 0 V −1 −− µ A CIN1 = CIN2 = VP − − +1 µ A COUT1 AND COUT2 pins 15 (17) and 14 (15) VOL output voltage HIGH I OH = −100 µA 4.5 −− V VOH output voltage LOW I OL =2m A −− 1V ttr transient time note 4 − 0.5 −µ s SYMBOL PARAMETER CONDITION MIN. TYP. MAX. UNIT

Philips Semiconductors Product specification Control interface for VHS video recorders SAA1310 MEA085 100 100 td td td tdtd t VP V17 (19) t VTL1 VTL2 1.5 V Fig.3 Power-ON and power-failure detector.

Philips Semiconductors Product specification Control interface for VHS video recorders SAA1310 APPLICATION INFORAMTION Fig.4 Test circuit diagram. Pin numbers in parenthesis refer to the SAA1310T. handbook, full pagewidth MEA086 - 1 (14) AMPLIFIER FILTER DETECTOR1 (1) (2) VP comparator 1 comparator 2 comparator 3 comparator 4 SAA1310 (SAA1310T) WRITE AMPLIFIER write current GND (4) (20) (18) (17) (15) (12) (11) (3) (6) (7) (8) 12(13) (9) 9(10) V ref POWER-ON AND POWER-FAILURE DETECTOR VP (19) IV IV IV IV V I V I I 82 nF 10 µ F 650 Ω Vi I R W I V I V I V IV I I Vref

Philips Semiconductors Product specification Control interface for VHS video recorders SAA1310 handbook, full pagewidth µF 4.7 nF nF µF 100 nF 47 kΩ +5 V SAA1310 (SAA1310T) (1) (2) (3) (4) (6) (7) (8) (20) (19) (18) (17) (15) (14) (13) VI CTL head 47 µF (9) (12) (11) (10) VI VI VI VI COUT4 COUT1 COUT2 COUT3 CAPREV PO/FAIL OUT CTL DATA WRITE/READ MEA087 Pin numbers in parenthesis refer to the SAA1310T. Fig.5 Application diagram.

Philips Semiconductors Product specification Control interface for VHS video recorders SAA1310 PACKAGE OUTLINES REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT102-1 93-10-14 95-01-23 UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M ZHL mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max.wM Ee1 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 3.9 7.80 9.5 inches 0.055 0.044 0.021 0.015 0.013 0.009 1.40 1.14 0.055 0.044 0.86 0.84 0.26 0.24 0.15 0.31 0.37 M H c (e )1 M E A L seating plane w M e D A 2 Z b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1

Philips Semiconductors Product specification Control interface for VHS video recorders SAA1310 UNIT A max. A 1 A 2 A 3 bp cD (1) E (1) (1)eH E LL p Q Zywv θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 SOT163-1 w M bp detail X Z e D y 0.25 075E04 MS-013AC pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.51 0.49 0.30 0.29 0.050 1.4 0.0550.419 0.394 0.043 0.039 0.035 0.0160.01 0.25 0.01 0.0040.043 0.0160.01 0 5 10 mm scale X θ AA 1 A 2 H E Lp Q E c L v M A (A )3 A SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 95-01-24 97-05-22

Philips Semiconductors Product specification Control interface for VHS video recorders SAA1310 SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T stg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. R EPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300°C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400°C, contact may be up to 5 seconds. SO R EFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250°C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. W AVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed:

  • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.
  • The longitudinal axis of the package footprint must be parallel to the solder flow.
  • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260°C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150°C within 6 seconds. Typical dwell time is 4 seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. R EPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300°C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320°C.

Philips Semiconductors Product specification Control interface for VHS video recorders SAA1310 DEFINITIONS LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.