SAA1300

SAA1300 PHILIPS

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Technical content

Product specification File under Integrated Circuits, IC12 June 1987 INTEGRATED CIRCUITS SAA1300 Tuner switching circuit

Philips Semiconductors Product specification Tuner switching circuit SAA1300 The SAA1300 is for switching on and off the supply lines of various circuit parts via an I2C bus signal. Furthermore, it can be used to supply current for switching diodes in radio and television tuners. It contains 5 output stages, which are capable of supplying up to 85 mA in the ON state or sinking up to−100 µA in the OFF state. Current limiting and short-circuit protection are included. The output stages are driven by a shift register/latch combination which is loaded via data from the I 2C bus. A power-on reset of the latches ensures the OFF state of the output stages (OUT 2 to OUT 5) without data reception from the I 2C bus. A subaddressing system allows the connection of up to three circuits on the same I2C bus lines; one of the outputs (OUT 1, pin 7) can also be used as an input to select the device via a simple internal A/D converter. PACKAGE OUTLINE 9-lead SIL; plastic (SOT142); SOT142-1; 1996 September 05. Fig.1 Block diagram.

Philips Semiconductors Product specification Tuner switching circuit SAA1300 PINNING I2C BUS INFORMATION Address, first byte Data, second byte OUT 5, OUT 4, OUT 3, OUT 2, OUT 1, X, X, X The I/O output stage (OUT 1) is switched as an input stage after a power-on reset. It depends on the contents of the first data transmission whether the output stage is switched as an output or remains as an input. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PIN NO. SYMBOL FUNCTION

1 GND ground

3 OUT 5

5 OUT 3

6 OUT 2

7 OUT 1 output and subaddressing input

8 SDA serial data line I

2C bus9 SCL serial clock line 0 1 0 0 0 A B 0 where, A B FUNCTION CONDITION 0 0 general address OUT 1 = output 0 1 OUT 1 = input address accepted if V OUT 1 = VOUT L (LOW) 1 0 OUT 1 = input address accepted if V OUT 1 = VOUT H (HIGH) 1 1 OUT 1 = input address accepted if V OUT 1 = VOUT M (MEDIUM) Supply voltage V P max. 13,2 V Input voltage range at SDA, SCL V I −0,5 to+ 6,0 V Input voltage range at OUT 1 V I −0,5 to + 12,5 V Output voltage range at OUT 1 to OUT 5 V O −0,5 to + 12,5 V Input current at SDA, SCL I I max. 20 mA Input current at OUT 1 I I max. 20 mA Total power dissipation P tot max. 825 mW Storage temperature range T stg −40 to + 125 °C Operating ambient temperature ranges T amb −20 to + 80 °C

Philips Semiconductors Product specification Tuner switching circuit SAA1300 CHARACTERISTICS VP = 8 V; Tamb = 24°C; unless otherwise specified Note 1. Outputs must not be driven simultaneously at maximum source current. PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply (pin 2) Supply voltage range V P 481 2 V Supply current 5 outputs LOW I PL 5 1 01 5m A 5 outputs HIGH I PH 30 50 70 mA Power on reset level output stage in “OFF” condition VPR − 3,5 3,8 V Maximum power dissipation(1) Pmax − 650 − mW Inputs SDA, SCL (pins 8 and 9) Input voltage HIGH V IH 3,0 − 5,5 V Input voltage LOW V IL 0 − 1,5 V Input current HIGH −IIH −− 10 µA Input current LOW I IH −− 0,4 µA Acknowledge sink current I ACK 2,5 −− mA Maximum input frequency f i max 100 −− kHz Outputs OUT 1 to OUT 5 (pins 3 to 7) Maximum output current; source: “ON” I Oso +85 − +150 mA Maximum output current; source: “ON” Tamb = 80°CI Oso 60 −− mA Output voltage HIGH at IOso = 85 mA V OH Vp−2 −− V Output current; sink “OFF” I Osi −100 −300 −µ A Output voltage LOW at IOsi= −100 µAV OL −− 100 mV Output voltage MEDIUM at IO = 10 mA V OM VP−0,5 −− V OUT 1 used as subaddressing input Input voltage HIGH (code 1 0) V OUT 1H 0,72 VP − VP V Input voltage MEDIUM (code 1 1) V OUT 1M 0,39 VP − 0,61 VP V Input voltage LOW (code 0 1) V OUT 1L 0 − 0,28 VP V

Philips Semiconductors Product specification Tuner switching circuit SAA1300 PACKAGE OUTLINE UNIT A A 3 b 1 D 1b 2bc D (1) E (1) eL REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 12 1.8 1.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 D 2 18.6 18.2 6.48 6.20 2.54 3.9 3.4 Q 1.75 1.55 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. SOT142-1 95-02-09 97-12-16 0 5 10 mm scale Z (1) 1.00.25 w max. D E A A c A 2 L Q w M b D 1 D 2 Z e seating plane pin 1 index SIL9MP: plastic single in-line medium power package; 9 leads SOT142-1 A max. 3.7

Philips Semiconductors Product specification Tuner switching circuit SAA1300 SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T stg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300°C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400°C, contact may be up to 5 seconds. DEFINITIONS LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I 2C COMPONENTS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification. Purchase of Philips I 2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.