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G GND V CC G D, DB, N, NS, J, OR W PACKAGE (TOP VIEW) 192013 2 1312119 10 NC G G NC NC V GND NC FK PACKAGE (TOP VIEW) CC AM26LS31C AM26LS31M QUADRUPLE DIFFERENTIAL LINE DRIVER SLLS114I JANUARY 1979 REVISED FEBRUARY 2006 Meets or Exceeds the Requirements of ANSI TIA/EIA-422-B and ITU Operates From a Single 5-V Supply TTL Compatible Complementary Outputs High Output Impedance in Power-Off Conditions Complementary Output-Enable Inputs The AM26LS31 is a quadruple complementary-output line driver designed to meet the requirements of ANSI TIA/EIA-422-B and ITU (formerly CCITT) Recommendation V.11. The 3-state outputs have high-current capability for driving balanced lines such as twisted-pair or parallel-wire transmission lines, and they are in the high-impedance state in the power-off condition. The enable function is common to all four drivers and offers the choice of an active-high or active-low enable (G, G input. Low-power Schottky circuitry reduces power consumption without sacrificing speed. ORDERING INFORMATION T A PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING PDIP N Tube AM26LS31CN AM26LS31CN Tube AM26LS31CD SOIC D AM26LS31C C to C Tape and reel AM26LS31CDR SOP NS Tape and reel AM26LS31CNSR 26LS31 SSOP DB Tape and reel AM26LS31CDBR SA31C CDIP J Tube AM26LS31MJB AM26LS31MJB C to 125 C LCCC FK Tube AM26LS31MFKB AM26LS31MFKB CFP W Tube AM26LS31MWB AM26LS31MWB (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical
applications
sheet. PRODUCTION DATA information is current as of publication date. Copyright 1979 2006, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
www.ti.com G G AM26LS31C AM26LS31M QUADRUPLE DIFFERENTIAL LINE DRIVER SLLS114I JANUARY 1979 REVISED FEBRUARY 2006 FUNCTION TABLE (1) (EACH DRIVER) ENABLES OUTPUTS INPUT A G G Y Z H H X H L L H X L H H X L H L L X L L H X L H Z Z (1) H high level, L low level, X irrelevant, Z high impedance (off) LOGIC DIAGRAM (POSITIVE LOGIC) Submit Documentation Feedback
www.ti.com 22 kΩ To Three Other Drivers Common to All Four Drivers GND Enable G Enable G VCC V V Output Y 9 Ω Input A 22 kΩ 22 kΩ All resistor values are nominal. Output Z 9 Ω Absolute Maximum Ratings (1) AM26LS31C AM26LS31M QUADRUPLE DIFFERENTIAL LINE DRIVER SLLS114I JANUARY 1979 REVISED FEBRUARY 2006 SCHEMATIC (EACH DRIVER) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V CC Supply voltage (2) V V I Input voltage V Output off-state voltage 5.5 V D package DB package θ JA Package thermal impedance (3) C/W N package NS package Lead temperature 1,6 mm (1/16 in) from case for s 260 C Lead temperature 1,6 mm (1/16 in) from case for s J package 300 C T stg Storage temperature range 150 C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential output voltage V OD are with respect to network GND. (3) The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback
www.ti.com Recommended Operating Conditions Electrical Characteristics (1) Switching Characteristics AM26LS31C AM26LS31M QUADRUPLE DIFFERENTIAL LINE DRIVER SLLS114I JANUARY 1979 REVISED FEBRUARY 2006 MIN NOM MAX UNIT AM26LS31C 4.75 5.25 V CC Supply voltage V AM26LS31M 4.5 5.5 V IH High-level input voltage V V IL Low-level input voltage 0.8 V I OH High-level output current mA I OL Low-level output current mA AM26LS31C T A Operating free-air temperature C AM26LS31M 125 over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT V IK Input clamp voltage V CC MIN, I I mA 1.5 V V OH High-level output voltage V CC MIN, I OH mA 2.5 V V OL Low-level output voltage V CC MIN, I OL mA 0.5 V V O 0.5 V Off-state (high-impedance-state) I OZ V CC MIN, µ A output current V O 2.5 V I I Input current at maximum input voltage V CC MAX, V I V 0.1 mA I IH High-level input current V CC MAX, V I 2.7 V µ A I IL Low-level input current V CC MAX, V I 0.4 V 0.36 mA I OS Short-circuit output current (3) V CC MAX 150 mA I CC Supply current V CC MAX, All outputs disabled mA (1) For C-suffix devices, V CC min 4.75 V and V CC max 5.25 For M-suffix devices, V CC min 4.5 V and V CC max 5.5 (2) All typical values are at V CC V and T A (3) Not more than one output should be shorted at a time, and duration of the short circuit should not exceed one second. V CC V (see Figure T A C AM26LS31M PARAMETER TEST CONDITIONS UNIT MIN TYP MAX MIN MAX Propagation delay time, low- to t PLH high-level output C L pF, and open ns Propagation delay time, high- to t PHL low-level output t PZH Output enable time to high level R L Ω C L pF ns t PZL Output enable time to low level R L 180 Ω t PHZ Output disable time from high level C L pF, and closed ns t PLZ Output disable time from low level t SKEW Output-to-output skew C L pF, and open ns Submit Documentation Feedback
www.ti.com PARAMETER MEASUREMENT INFORMATION Waveform 1 (see Note E) Output Z Output Y Input A (see Notes B and C) VOL VOH VOL VOH 3 V tPHL Skew Skew tPLH tPLH tPHL 0 V PROPAGATION DELAY TIMES AND SKEW TEST CIRCUIT VCCTest Point 75 Ω 180 Ω CL (see Note A) From Output Under Test VOH VOL ≈ 1.5 V 0 V 3 V Enable G Enable G (see Note D) S1 Open S2 Closed S1 Closed S2 Open tPZH tPZL tPHZ tPLZ S1 Closed S2 Closed 0.5 V ≈ 0 V ≈ 4.5 V S1 Closed S2 Closed ≈ 1.5 V ENABLE AND DISABLE TIME WAVEFORMS See Note D NOTES: A. CL includes probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω , tr ≤ 15 ns, tf ≤ 6 ns. C. When measuring propagation delay times and skew, switches S1 and S2 are open. D. Each enable is tested separately. E. Waveform 1 is for an output with internal conditions such that the output is low , except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. 1.3 V 1.3 V 1.5 V 1.5 V 1.5 V 1.5 V Waveform 2 (see Note E) 0.5 V 1.5 V 1.5 V AM26LS31C AM26LS31M QUADRUPLE DIFFERENTIAL LINE DRIVER SLLS114I JANUARY 1979 REVISED FEBRUARY 2006 Figure Test Circuit and Voltage Waveforms Submit Documentation Feedback
www.ti.com TYPICAL CHARACTERISTICS VI − Enable G Input Voltage − V OUTPUT VOLTAGE vs ENABLE G INPUT VOLTAGE VCC = 5.25 V VCC = 5 V VCC = 4.75 V Load = 470 Ω to GND TA = 25° C See Note A − Y Output Voltage − VVO 0 1 2 3 VI − Enable G Input Voltage − V OUTPUT VOLTAGE vs ENABLE G INPUT VOLTAGE VCC = 5 V Load = 470 Ω to GND See Note A TA = 70° C TA = 0° C TA = 25° C − Y Output Voltage − VVO 0 1 2 3 VI − Enable G Input Voltage − V − Output Voltage − V OUTPUT VOLTAGE vs ENABLE G INPUT VOLTAGE VO VCC = 5.25 V VCC = 5 V VCC = 4.75 V 0 1 2 3 Load = 470 Ω to VCC TA = 25° C See Note B VI − Enable G Input Voltage − V OUTPUT VOLTAGE vs ENABLE G INPUT VOLTAGE TA = 25° C TA = 0° C TA = 70° C − Output Voltage − VVO 0 1 2 3 VCC = 5 V Load = 470 Ω to VCC See Note B AM26LS31C AM26LS31M QUADRUPLE DIFFERENTIAL LINE DRIVER SLLS114I JANUARY 1979 REVISED FEBRUARY 2006 Figure Figure Figure Figure The A input is connected to V CC during testing of the Y outputs and to ground during testing of the Z outputs. The A input is connected to ground during testing of the Y outputs and to V CC during testing of the Z outputs. Submit Documentation Feedback
www.ti.com − High-Level Output Voltage − V IOH = −20 mA IOH = −40 mA HIGH-LEVEL OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE VOH VCC = 5 V See Note A 0 25 50 75 IOH − High-Level Output Current − mA HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT VCC = 5.25 V VCC = 4.75 V VCC = 5 V TA = 25° C See Note A − High-Level Output Voltage − VVOH − Low-Level Output Voltage − V TA − Free-Air Temperature − ° C VCC = 5 V IOL = 40 mA See Note B LOW-LEVEL OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE VOL 0.4 0.3 0.2 0.1 25 50 75 0.5 IOL − Low-Level Output Current − mA LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT VCC = 5.25 V VCC = 4.75 V TA = 25° C See Note B − Low-Level Output Voltage − VVOL 0.4 0.3 0.2 0.1 40 80 120 0.5 0 1006020 0.6 0.7 0.8 0.9 AM26LS31C AM26LS31M QUADRUPLE DIFFERENTIAL LINE DRIVER SLLS114I JANUARY 1979 REVISED FEBRUARY 2006 TYPICAL CHARACTERISTICS (continued) Figure Figure Figure Figure The A input is connected to V CC during testing of the Y outputs and to ground during testing of the Z outputs. The A input is connected to ground during testing of the Y outputs and to V CC during testing of the Z outputs. Submit Documentation Feedback
www.ti.com VCC = 5 V VI − Data Input Voltage − V Y OUTPUT VOLTAGE vs DATA INPUT VOLTAGE VCC = 4.75 V No Load TA = 25° C VCC = 5.25 V − Y Output Voltage − VVO 0 1 2 3 Y OUTPUT VOLTAGE vs DATA INPUT VOLTAGE TA = 25° C No Load TA = 0° C TA = 70° C VI − Data Input Voltage − V − Y Output Voltage − VVO 0 1 2 3 AM26LS31C AM26LS31M QUADRUPLE DIFFERENTIAL LINE DRIVER SLLS114I JANUARY 1979 REVISED FEBRUARY 2006 TYPICAL CHARACTERISTICS (continued) Figure 10. Figure 11. Submit Documentation Feedback
www.ti.com 18-Oct-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples 5962-7802301M2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 7802301M2A AM26LS31 MFKB 5962-7802301MEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-7802301ME A AM26LS31MJB 5962-7802301MFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-7802301MF A AM26LS31MWB 5962-7802301Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type 5962- 7802301Q2A AM26LS31M AM26LS31-W ACTIVE WAFERSALE YS 0 3921 TBD Call TI Call TI AM26LS31CD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26LS31C AM26LS31CDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 SA31C AM26LS31CDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 SA31C AM26LS31CDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 SA31C AM26LS31CDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26LS31C AM26LS31CDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26LS31C AM26LS31CDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 AM26LS31C AM26LS31CDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26LS31C AM26LS31CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26LS31C AM26LS31CN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 AM26LS31CN
www.ti.com 18-Oct-2013 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples AM26LS31CNE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 AM26LS31CN AM26LS31CNSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 26LS31 AM26LS31CNSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 26LS31 AM26LS31MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 7802301M2A AM26LS31 MFKB AM26LS31MJB ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-7802301ME A AM26LS31MJB AM26LS31MWB ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-7802301MF A AM26LS31MWB (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
www.ti.com 18-Oct-2013 Addendum-Page 3 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF AM26LS31, AM26LS31M :
- Catalog: AM26LS31
- Military: AM26LS31M NOTE: Qualified Version Definitions:
- Catalog - TI's standard catalog product
- Military - QML certified for Military and Defense Applications
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) AM26LS31CDBR SSOP DB 16 2000 367.0 367.0 38.0 AM26LS31CDR SOIC D 16 2500 333.2 345.9 28.6 AM26LS31CDR SOIC D 16 2500 367.0 367.0 38.0 AM26LS31CDRG4 SOIC D 16 2500 367.0 367.0 38.0 AM26LS31CDRG4 SOIC D 16 2500 333.2 345.9 28.6 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Pack Materials-Page 2
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01
28 PINS SHOWN
8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150
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