SA5.0 LEIDITECH | Alldatasheet

Document overview

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Technical content

Features

DO-15 unit:inch(mm)

  • Halogen-free
  • Rohs compliant
  • Typical maximum temperature coefficient
  • ΔV BR = 0.1% x V BR @25°C x ΔT
  • Glass passivated Chip junction in DO-15 package
  • 500W peak pulse capadility at 10×1000μs waveform, repetition rate(duty cycles):0.01%
  • Fast response time:typically less than 1.0ps from 0 Volts to BV min
  • Excellent clamping capability
  • Low incremental surge resistance
  • Typical I R less than 5μA above 11V
  • High temperature soldering guaranteed: 260°C/40 seconds / 0.375”,
  • (9.5mm) lead length, 5lbs., (2.3kg) tension
  • Plastic package has underwriters laboratory flammability classification 94v-0 Maximum Ratings And Characteristics (TA=25°C unless otherwise noted)

Applications

TVS devices are ideal for the protection of I/O interfaces, V CC bus and other vulnerable circuits used in telecom,computer, industrial and consumer electronic applications. TVS 01 Rating Symbol Value Units Peak Pulse Power Dissipation by 10x1000μs test waveform (Fig.1)(Note 1) P PPM

500 Watts

Steady State Power Dissipation on inifinite heat sink at TL=75°C (Fig. 5) P D

3 Watts

Peak Forward Surge Current, 8.3ms Single Half Sine Wave Unidirectional only (Note 2) I FSM

70 Amps

Maximum Instantaneous Forward Voltage at 25A for Unidirectional only (Note 3) V F 3.5/5.0 V Operating junction and Storage Temperature Range. T J T STG -55 to 175 °C Typical Thermal Resistance Junction to Lead R uJL 20 °C/W Typical Thermal Resistance Junction to Ambient R uJA 75 °C/W Operating junction and Storage Temperature Range. T T STG -55°C to +175°C °C Notes: 1. Non-repetitive current pulse , per Fig. 3 and derated above T A = 25°C per Fig. 2. 2. Measured on 8.3ms single half sine wave or equivalent square wave, duty cycle=4 per minute maximum. AEC -Q101 qualified.

Electriacl Characteristics Type Number Reverse Stand- Off V oltage Breakdown V oltage@I T Test Current Maximum Clamping V oltage@I PP Peak Pulse Current Reverse Leakage RWM (UNI) (BI) V RWM (V) V BR MIN. (V) V BR.MAX. (V) I T (mA) V C (V) I PP (A) I R (µA) TVS 02

Ratings and Characteristic Curves A =25℃ unless otherwise noted) TVS 03 P PPM - Peak Pulse Power (KW) 01.µs 1.0µs 10µs 100µs 1.0ms 10ms 0.1 Non-repetitive Pulse Waveform Shown in Fig. 3 T A =25ûC t d - Pulse Width (sec. ) P P P T d T d T d Half SINE Exponential Square I PPM - P eak P ulse Cur rent, % I RSM 10 0 15 0 1. 0 2.0 3.0 4.0 t r =1 0µsec P eak V alue I PPM I PPM T J =25° C as the point where the peak cur rent decays to 50% of I PPM 10 /1 00 0µsec. W avefor m t d t-T ime (ms) Half V alue I PPM ( ) T A - Ambient T emperature (ºC) Peak Pulse Power (P PP ) or Current (I PP Derating in Percentage, % 100 100 12 51 50 17 52 00 10 0 1000 1000 0 1. 01 0. 0 100 .0 1000 .0 Cj ( pF ) Tj =2 5C f= 1.0M Hz Vs ig =5 0m Vp -p Un i- di re ct i ona l V= 0V Bi -d ir ec ti ona l V= 0V Uni-directional @ V R Bi-directional @ V R V BR - Reverse Breakdown Vo ltage (V) 0. 5 1. 5 2. 5 3. 5 02 55 07 51 00 12 51 50 17 52 00 St ea dy S tate P o wer Di ss ip at io n (W ) T L - Lead T em pe ra tu re (º C) L = 0.375” (9.5mm) Lead Length s Figur e 1 - P eak Pulse Po w er Rating Cur ve Figur e 2 - Pulse Der ating Cur ve Figur e 3 - Pulse W av ef or m Figur e 4 - T ypical Junction Capacitance Figur e 5 - St eady Stat e P ow er Der ating Cur ve 001011 Nu mb er o f Cy cl es at 6 0 Hz I FSM - Peak Forward Surge Current (A) Figur e 6 - Maximum Non-Repetiti ve F or wa r d Su rg e Cu rr ent Uni-Dir ectional Only Ratings and Char ac te r istic Curv es A =25°C unless otherwise not ed)

Weight 0.045oz., 1.2g Case JEDEC DO-201 molded plastic body over passivated junction. Polarity Color band denotes the cathode except Bipolar. Terminal Matte Tin axial leads, solderable per JESD22-B102D. Temperature CycleJ ESD22-A104 Pressure CookerJ ESD 22-A102 High Temp. Storage JESD22-A103 HTRB JESD22-A108 Thermal Shock JESD22-A106 T( erutarep meT) Time (t) T s(min) T s(max) T L T P t s Preheat t L t p enoZ lacitirCpu-pmaR T L to T P Ramp-down Pre Heat - Temperature Min (T s(min) )1 50°C - Temperature Max (T s(max) )2 00°C - Time (min to max) (t s Average ramp up rate (Liquidus Temp L ) to peak 3°C/second max T S(max) to T L - Ramp-up Rate 3°C/second max - Temperature (T L ) (Liquidus) 217°C - Time (min to max) (t s Peak Temperature (T P ) 260 +0/-5 Time within 5°C of actual peak Temperature (t p Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T P )8 minutes Max. Do not exceed 280°C Flow/Wave Soldering (Solder Dipping) Peak Temperature : 265 O C Dipping Time :1 0 seconds Soldering :1 time Soldering Parameters TVS 04 Dimensions Dimensions D A A C B T( erutarep meT Time (t) T s(min) T s(max) T L T P t s Preheat t L t p enoZ lacitirCpu-pmaR T L to T P Ramp-down P re Heat - T ime (min to max) (t s L ) to peak T S(max) to T L - R amp-up R ate 3°C/second max - T emperature (T L ) (Liquidus) 21 7°C - T ime (min to max) (t s P ) 260 +0/-5 p P O C

Phone: +86- 021-50828806 TVS 05 T Reel Tape SAxxxXX X Concord Packing Spec Email:sale1@leiditech.com http://www.leiditech.com SHANGHAI LEIDITECH ELECTRONICS TECHNOLOGY CO., LTD