S93462S2.7

S93462 SUMMIT | Alldatasheet

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© SUMMIT MICROELECTRONICS, Inc. 2001 • 300 Orchard City Drive, Suite 131  Campbell, CA 95008  Telephone 408-378-6461  Fax 408-378-6586  www.summitmicro.com S93462/S93463 Characteristics subject to change without notice Precision Supply-Voltage Monitor and Reset Controller SUMMIT MICROELECTRONICS, Inc. 2021 4.2 1/23/01

FEATURES

• Precision Monitor & RESET Controller — RESET and RESET Outputs — Guaranteed RESET Assertion to VCC = 1V — 150ms Reset Pulse Width — Internal 1.26V Reference with ±1% Accuracy — ZERO External Components Required  Memory — 1K-bit Microwire Memory — S93462 – Internally Ties ORG Low – 100% Compatible With all 8-bit Implementations Sixteen Byte Page Write Capability — S93463 – Internally Ties ORG High – 100% Compatible With all 16-bit Implementations – Eight Word Page Write Capability OVERVIEW The S93462 and S93463 are precision power supervi- sory circuits providing both active high and active low reset outputs. Both devices have 1k-bits of E2PROM memory that is accessible via the industry standard microwire bus. The S93462 is configured with an internal ORG pin tied low providing a 8-bit byte organization and the S93463 is configured with an internal ORG pin tied high providing a 16-bit word organization. Both the S93462 and S93463 have page write capability. The devices are designed for a minimum 100,000 program/erase cycles and have data retention in excess of 100 years. BLOCK DIAGRAM GND VCC RESET#6 VTRIP RESET PULSE GENERATOR 5kHz OSCILLATOR RESET CONTROL MODE DECODE ADDRESS DECODER WRITE CONTROL DATA I/O E2PROM MEMORY ARRAY RESET7 1.26V SK 2 DI 3 WATCHDOG TIMERCS 1 2021 T BD 2.0 DO 4

2021 4.2 1/23/01 Summit Microelectronics, Inc. PIN FUNCTIONS Pin Name Function CS Chip Select SK Clock Input DI Serial Data Input DO Serial Data Output VCC +2.7 to 6.0V Power Supply GND Ground RESET/RESET# RESET I/O PIN CONFIGURATION DEVICE OPERATION

APPLICATIONS

The S93462/463 is ideal for applications requiring low voltage and low power consumption. This device pro- vides microcontroller RESET control and can be manu- ally resettable. RESET CONTROLLER DESCRIPTION The S93462/463 provides a precision reset controller that ensures correct system operation during brownout and power-up/-down conditions. It is configured with two open drain reset outputs; pin 7 is an active high output and pin 6 is an active low output. During power-up, the reset outputs remain active until V CC reaches the VTRIP threshold. The outputs will con- tinue to be driven for approximately 150ms after reach- ing VTRIP. The reset outputs will be valid so long as VCC is ≥ 1.0V. During power-down, the reset outputs will begin driving active when VCC falls below VTRIP. The reset pins are I/Os; therefore, the S93462/463 can act as a signal conditioning circuit for an externally applied reset. The inputs are edge triggered; that is, the RESET input will initiate a reset time-out after detecting a low to high transition and the RESET# input will initiate a reset time-out after detecting a high to low transition. Refer to the applications Information section for more details on device operation as a debounce/reset ex- tender circuit. It should be noted the reset outputs are open drain. When used as outputs driving a circuit they need to be either tied high (RESET#) or tied to ground (RESET) through the use of pull-up or pull-down resistors. Refer to the applications aid section for help in determining the value of resistor to be used. Internally these pins are weakly pulled up (RESET#) and pulled down (RESET): therefore, if the signals are not being used the pins may be left unconnected. GENERAL OPERATION The S93462/463 is a 1024-bit nonvolatile memory intended for use with industry standard microproces- sors. The S93463 is organized as X16, seven 9-bit instructions control the reading, writing and erase operations of the device. The S93462 is organized as X8, seven 10-bit instructions control the reading, writing and erase operations of the device. The device operates on a single 3V or 5V supply and will generate on chip, the high voltage required during any write operation. Instructions, addresses, and write data are clocked into the DI pin on the rising edge of the clock (SK). The DO pin is normally in a high impedance state except when reading data from the device, or when checking the ready/busy status after a write operation. The ready/busy status can be determined after the start of a write operation by selecting the device (CS high) and polling the DO pin; DO low indicates that the write operation is not completed, while DO high indicates that the device is ready for the next instruction. See the Applications Aid section for detailed use of the ready busy status. CS SK DI DO VCC RESET RESET# GND 8-Pin SOIC 2021 T PCon 2.0

2021 4.2 1/23/01 Summit Microelectronics, Inc. Erase/Write Enable and Disable The S93462/463 powers up in the write disable state. Any writing after power-up or after an EWDS (write disable) instruction must first be preceded by the EWEN (write enable) instruction. Once the write instruction is enabled, it will remain enabled until power to the device is removed, or the EWDS instruction is sent. The EWDS instruction can be used to disable all S93462/463 write and clear instructions, and will prevent any accidental writing or clearing of the device. Data can be read normally from the device regardless of the write enable/ disable status. Erase All Upon receiving an ERAL command, the CS (Chip Select) pin must be deselected for a minimum of 250ns CSMIN ). The falling edge of CS will start the self clocking clear cycle of all memory locations in the device. The clocking of the SK pin is not necessary after the device has entered the self clocking mode. The ready/busy status of the S93462/463 can be determined by select- ing the device and polling the DO pin. Once cleared, the contents of all memory bits will be in a logical “1” state. Write All Upon receiving a WRAL command and data, the CS (Chip Select) pin must be deselected for a minimum of 250ns (t CSMIN ). The falling edge of CS will start the self clocking data write to all memory locations in the device. The clocking of the SK pin is not necessary after the device has entered the self clocking mode. The ready/ busy status of the S93462/463 can be determined by selecting the device and polling the DO pin. It is not necessary for all memory locations to be cleared before the WRAL command is executed. Page Write 93462 - Assume WEN has been issued. The host will then take CS high, and begin clocking in the start bit, write command and 7-bit address immediately fol- lowed by the first byte of data to be written. The host can then continue clocking in 8-bit bytes of data with each byte to be written to the next higher address. Internally the address pointer is incremented after receiving each group of eight clocks; however, once the address counter reaches xxx 1111 it will roll over to xxx 0000 with the next clock. After the last bit is clocked in no internal write operation will occur until CS is brought low. 93463 - Assume WEN has been issued. The host will then take CS high, and begin clocking in the start bit, write command and 6-bit address immediately followed by the first 16-bit word of data to be written. The host can then continue clocking in 16-bit words of data with each word to be written to the next higher address. Internally the address pointer is incremented after receiving each group of sixteen clocks; however, once the address counter reaches xxx x111 it will roll over to xx x000 with the next clock. After the last bit is clocked in no internal write operation will occur until CS is brought low. Continuous Read This begins just like a standard read with the host issuing a read instruction and clocking out the data byte [word]. If the host then keeps CS high and continues generating clocks on SK, the S93462/463 will output data from the next higher address location. The S93462/463 will continue incrementing the ad- dress and outputting data so long as CS stays high. If the highest address is reached, the address counter will roll over to address 0000. CS going low will reset the instruction register and any subsequent read must be initiated in the normal manner of issuing the com- mand and address.

2021 4.2 1/23/01Summit Microelectronics, Inc. Figure 3. Write Instruction Timing Figure 4. Erase Instruction Timing Figure 5. EWEN/EWDS Instruction Timing

2021 Fig05

2021 4.2 1/23/01Summit Microelectronics, Inc. ABSOLUTE MAXIMUM RATINGS* *COMMENT Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability. Note: (1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC voltage on output pins is VCC +0.5V, which may overshoot to VCC +2.0V for periods of less than 20 ns. (2) Output shorted for no more than one second. No more than one output shorted at a time. (3) This parameter is tested initially and after a design or process change that affects the parameter. (4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to V CC +1V. D.C. OPERATING CHARACTERISTICS (over recommended operating conditions unless otherwise specified) Limits Symbol Parameter Min. Typ. Max. Units Test Conditions ICC Power Supply Current 3 mA DI = 0.0V, f SK = 1MHz (Operating) V CC = 5.0V, CS = 5.0V, Output Open ISB Power Supply Current 50 µA CS = 0V (Standby) Reset Outputs Open ILI Input Leakage Current 2 µA V IN = 0V to VCC ILO Output Leakage Current 10 µA V OUT = 0V to VCC , (Including ORG pin) CS = 0V VIL1 Input Low Voltage -0.1 0.8 V 4.5V-VCC <5.5V VIH1 Input High Voltage 2 V CC +1 V VIL2 Input Low Voltage 0 V CC X0.2 V 1.8V-V CC <2.7V VIH2 Input High Voltage V CC X0.7 V CC +1 V VOL1 Output Low Voltage 0.4 V 4.5V-VCC <5.5V VOH1 Output High Voltage 2.4 V I OL = 2.1mA IOH = -400µA VOL2 Output Low Voltage 0.2 V 1.8V-VCC <2.7V VOH2 Output High Voltage V CC -0.2 V I OL = 1mA IOH = -100µA 2021 PGM T3 1.0 RELIABILITY CHARACTERISTICS Symbol Parameter Min. Max. Units Reference Test Method N END (3) Endurance 100,000 Cycles/Byte MIL-STD-883, Test Method 1033 TDR (3) Data Retention 100 Years MIL-STD-883, Test Method 1008 VZAP (3) ESD Susceptibility 2000 Volts MIL-STD-883, Test Method 3015 ILTH (3)(4) Latch-Up 100 mA JEDEC Standard 17 2021 PGM T2 1.1 Temperature Min Max Commercial 0 °C +70 °C Industrial -40 °C +85 °C RECOMMENDED OPERATING CONDITIONS 2021 PGM T7 1.0

2021 4.2 1/23/01 Summit Microelectronics, Inc. Limits VCC =2.7V-4.5V VCC =4.5V-5.5V Test SYMBOL PARAMETER Min. Max. Min. Max. UNITS Conditions tCSS CS Setup Time 100 50 ns tCSH CS Hold Time 0 0 ns V IL = 0.45V tDIS DI Setup Time 200 100 ns V IH = 2.4V tDIH DI Hold Time 200 100 ns C L = 100pF tPD1 Output Delay to 1 0.5 0.25 µs V OL = 0.8V tPD0 Output Delay to 0 0.5 0.25 µs V OH = 2.0v tHZ (1) Output Delay to High-Z 200 100 ns tEW Program/Erase Pulse Width 10 10 ms tCSMIN Minimum CS Low Time 0.5 0.25 µs tSKHI Minimum SK High Time 0.5 0.25 µs tSKLOW Minimum SK Low Time 0.5 0.25 µs tSV Output Delay to Status Valid 0.5 0.25 µs C L = 100pF SK MAX Maximum Clock Frequency DC 500 DC 1000 KHZ Note: (1) This parameter is tested initially and after a design or process change that affects the parameter. Note: (1) This parameter is tested initially and after a design or process change that affects the parameter. A.C. CHARACTERISTICS (over recommended operating conditions unless otherwise specified) C L = 100pF 2021 PGM T6 1.0 PIN CAPACITANCE Symbol Test Max. Units Conditions C OUT (1) OUTPUT CAPACITANCE (DO) 5 pF V OUT =OV C IN(1) INPUT CAPACITANCE (CS, SK, DI, ORG) 5 pF V IN=OV 2021 PGM T4 1.0

2021 4.2 1/23/01Summit Microelectronics, Inc. Figure 8. RESET Timing Diagram

2021 4.2 1/23/01 Summit Microelectronics, Inc. .228 (5.80) .035 (.90) .020 (.50) .010 (.25) x45° .0192 (.49) .0138 (.35) .061 (1.75) .053 (1.35) .0098 (.25) .004 (.127) .05 (1.27) TYP. .275 (6.99) TYP. .030 (.762) TYP.

8 Places

.050 (1.27) TYP. .050 (1.270) TYP. .157 (4.00) .150 (3.80) .196 (5.00)1 .189 (4.80) FOOTPRINT 8pn JEDEC SOIC ILL.2

8 Pin SOIC (Type S) Package JEDEC (150 mil body width)

2021 4.2 1/23/01Summit Microelectronics, Inc. Frequently the reset controller will be deployed on a PC board that provides a peripheral function to a system. Examples might be modem or network cards in a PC or a PCMCIA card in a laptop. In instances like this the peripheral card may have a requirement for a clean reset function to insure proper operation. The system may or may not provide a reset pulse of sufficient duration to clear the peripheral or to protect data stored in a nonvolatile memory. The I/O capability of the RESET pins can provide a solution. The system’s reset signal to the peripheral can be fed into the S93462/463 and it in turn can clean up the signal and provide a known entity to the peripheral’s circuits. The figure below shows the basic timing characteristics under the assumption the reset input is shorter in duration than t PURST . The same reset output affect can be attained by using the active high reset input. When planning your resistor pull-up and pull-down values, use the following chart to help determine min. resistances. Condition Min Typ Max Units VCC = 1.0V, IOL =100µA 0.3 V VCC = 1.2V, IOL =100µA 0.3 V VCC = 3.0V, IOL =500µA 0.3 V VCC = 3.6V, IOL =500µA 0.3 V VCC = 4.5V, IOL =750µA 0.3 V VCC = 1.0V, IOL =100µA 0.4 V VCC = 1.2V, IOL =150µA 0.4 V VCC = 3.0V, IOL =750µA 0.4 V VCC = 3.6V, IOL =1mA 0.4 V VCC = 4.5V, IOL =1mA 0.4 V VCC = 1.0V, IOH =400µA V CC -0.75 V VCC = 1.2V, IOH =800µA V CC -0.75 V VCC = 3.0V, IOH =800µA V CC -0.5 V VCC = 3.6V, IOH =800µA V CC -0.5 V VCC = 4.5V, IOH =800µA V CC -0.5 V Worst Case RESET Sink/Source Capabilities at Various VCC Levels Parameter Symbol RESET# Output V OL Voltage RESET# Output V OL Voltage RESET Output V OH Voltage 2021 PGM T5 1.0 RESET# Input RESET# Output RESET Output 2021 T fig09 2.0 tPURST

2021 4.2 1/23/01 Summit Microelectronics, Inc. Ready/Busy Status During the internal write operation the S93462/463 memory array is inaccessible. After starting the write operation (taking CS low) the host can implement a 10ms timeout routine or alternatively it can employ a polling routine that tests the state of the DO pin. After starting the write, testing for the status is easily accomplished by taking CS high and testing the state of DO. If it is low the device is still busy with the internal write. If it is high the write operation has completed. For the polling routine the host has the option of toggling CS for each test of DO, or it can place CS high and then intermittently test DO. SK is not required for any of these operations. Once the device is ready, it will continue to drive DO high whenever the S93462/463 is selected. The ready state of DO can be cleared by clocking in a start bit; this start bit can either be the beginning of a new command sequence or it can be a dummy start bit with CS returning low before the host issues a new command. SK 2021 ILL 13 1.0 CS DI DO tCS HIGH-Z HIGH-Z STATUS CLEARED BUSY READY STATUS VERIFY tSV tHZ tEW

2021 4.2 1/23/01Summit Microelectronics, Inc.

ORDERING INFORMATION

Blank = Tube T = Tape & Reel A = 4.5V to 5.5V VTRIP min. @ 4.25V B = 4.5V to 5.5V VTRIP min. @ 4.50V S93462 S A T Base Part Number Package S = 8 lead 150mil SOIC S93462 = 8-bit configuration S93463 = 16-bit configuration Tape & Reel Option Operating Voltage Range 2021 Tree 2.0

2021 4.2 1/23/01 Summit Microelectronics, Inc. NOTICE SUMMIT Microelectronics, Inc. reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. SUMMIT Microelectronics, Inc. assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained herein reflect representative operating parameters, and may vary depending upon a user’s specific application. While the information in this publication has been carefully checked, SUMMIT Microelectronics, Inc. shall not be liable for any damages arising as a result of any error or omission. SUMMIT Microelectronics, Inc. does not recommend the use of any of its products in life support or aviation applications where the failure or malfunction of the product can reasonably be expected to cause any failure of either system or to significantly affect their safety or effectiveness. Products are not authorized for use in such applications unless SUMMIT Microelectronics, Inc. receives written assurances, to its satisfaction, that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; and (c) potential liability of SUMMIT Microelectronics, Inc. is adequately protected under the circumstances. © Copyright 2001 SUMMIT Microelectronics, Inc. This Document supersedes all previous versions.