S8A MCC | Alldatasheet
Document overview
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- PDF pages: 2
Technical content
Features
- For Surface Mount Applications
- Extremely Low Thermal Resistance
- Easy Pick And Place
- High Temp Soldering: 250°C for 10 Seconds At Terminals
- High Current Capability DIMENSIONS INCHES MM DIM MIN MAX MIN MAX NOTE A .200 .214 5.08 5.43 B .177 .203 4.70 5.30 C .002 .005 .05 .13 D --- .02 --- .51 E .053 .067 1.35 1.70 F .168 .179 4 .27 4.55 G .320 .330 8.13 8.38 H .239 .243 6.08 6.18 J .234 .240 5.95 6.10 Maximum Ratings
- Operating Temperature: -55°C to +150°C
- Storage Temperature: -55°C to +150°C
- Maximum Thermal Resistance; 8°C/W Junction To Lead Microsemi Part Number Device Marking Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage S8A S8A 50V 35V 50V S8B S8B 100V 70V 100V S8D S8D 200V 140V 200V S8G S8G 400V 280V 400V S8J S8J 600V 420V 600V S8K S8K 800V 560V 800V S8M S8M 1000V 700V 1000V Electrical Characteristics @ 25°C Unless Otherwise Specified Average Forward Current I F(AV) 8.0A TJ = 75°C Peak Forward Surge Current I FSM 300A 8.3m s, half sine Maximum Instantaneous Forward Voltage V F 1.20V IFM = 8.0A; TJ = 25°C* Maximum DC Reverse Current At Rated DC Blocking Voltage I R 10µA 100µA TJ = 25°C TJ = 100°C Typical Junction Capacitance C J 150pF Mea sured at 1.0MHz, VR =4.0V *Pulse test: Pulse w idth 200 µsec, D uty cycle 2% 0.070” 0.190 0.200 SUGGESTED SOLDER PAD LAYOUT H J E F G A BD C Cathode Band www.mccsemi.com DO-214AB (SMCJ) (Round Lead) /G01/G02/G03/G04/G05/G06/G07/G05/G08/G08/G09/G04/G03/G02/G0A/G0B/G06/G07omponents
21201 Itasca Street Chatsworth
/G07/G18/G06/G19/G0F/G1A/G0F/G0F /G1B/G15/G05/G1C/G09/G1D/G06/G1E/G1F/G0F/G1F/G20/G06/G21/G10/G0F/G22/G23/G19/G1A/G1A /G24/G0A/G25/G1D/G06/G06/G06/G1E/G1F/G0F/G1F/G20/G06/G21/G10/G0F/G22/G23/G19/G1A/G19 MCC