STS7PF30L_07 STMICROELECTRONICS | Alldatasheet
Document overview
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Technical content
P-CHANNEL 30V - 0.16Ω - 7A - SO-8 STripFET™ II Power MOSFET General features ■ STANDARD OUTLINE FOR EASY AUTOMATED SURFACE MOUNT ASSEMBLY ■ LOW THRESHOLD DRIVE
Description
This Power MOSFET is the latest development of STMicroelectronics’ unique “Single Feature Size™” strip-based process. The resulting transistor shows extremely high packing densisty for low on-resistance, rugged avalanche characteristics and less critical alignment steps, therefore a remarkable manufacturing reproducibility.
Applications
■ BATTERY MANAGEMENT IN NOMADIC EQUIPMENT. ■ BATTERY MANAGEMENT IN NOMADIC EQUIPMENT Internal schematic diagram Type VDSS RDS(on) ID STS7PF30L 30V <0.021 Ω 7A SO-8 Order Codes Sales Type Marking Package Packaging STS7PF30L S7PF30L SO-8 TAPE & REEL
1 Electrical ratings STS7PF30L
1 Electrical ratings
Table 1. Absolute maximum ratings Table 2. Thermal data
2 Electrical characteristics
Table 3. On/off states Table 4. Dynamic Table 5. Switching times
2 Electrical characteristics STS7PF30L
Table 6. Source-Drain Diode
2.1 Electrical characteristics (curves)
Figure 1. Safe Operating Area Figure 2. Thermal Impedance Figure 3. Output Characteristics Figure 4. Transfer Characteristics Figure 5. Transconductance Figure 6. Static Drain-Source on Resistance
Figure 7. Gate Charge vs Gate-Source Voltage Figure 8. Capacitance Variations Figure 9. Normalized Gate Threshold Voltage Figure 10. Normalized on Resistance vs Figure 11. Source-Drain Diode Forward Figure 12. Normalized Breakdown Voltage vs
3 Test Circuits
Figure 13. Switching Times Test Circuit For Figure 14. Gate Charge Test Circuit Figure 15. Test Circuit For Inductive Load
4 Package Mechanical Data STS7PF30L
4 Package Mechanical Data
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
DIM. mm. inch A 1.75 0.068 a1 0.1 0.25 0.003 0.009 a2 1.65 0.064 a3 0.65 0.85 0.025 0.033 b 0.35 0.48 0.013 0.018 b1 0.19 0.25 0.007 0.010 C 0.25 0.5 0.010 0.019 c1 45 (typ.) D 4.8 5.0 0.188 0.196 E 5.8 6.2 0.228 0.244 e 1.27 0.050 e3 3.81 0.150 F 3.8 4.0 0.14 0.157 L 0.4 1.27 0.015 0.050 M 0.6 0.023 S 8 (max.) SO-8 MECHANICAL DATA
5 Revision History STS7PF30L
5 Revision History
25-Jun-2004 2 Preliminary Data 18-Jan-2005 3 Modified value on table 5 29-Sep-2005 4 Complete version 09-Nov-2005 5 New template
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the con sequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publicatio n are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics produ cts are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectron ics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Ital y - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America