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Publication Number S75PL-N_00 Revision 01E Issue Date April 21, 2006 S75PL-N MirrorBit ORNAND MCPs S75PL-N MirrorBit ORNAND MCPs Cover Sheet Stacked Multi-Chip Product (MCP) S29PL-N: CMOS 3.0 Volt-only Simultaneous Read/Write, Page-mode Flash Memory (NOR Interface) S30ML-P: ORNAND Flash (NAND Interface) 3V pSRAM Data Sheet (Advance Information) Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Each product described herein may be designated as Advance Information, Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.

MCPs April 21, 2006 S75PL-N_00-01E Data Sheet (Advance Information) Notice On Data Sheet Designations Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. In all cases, however, readers are encouraged to verify that they have the latest information before finalizing their design. The following descriptions of Spansion data sheet designations are presented here to highlight their presence and definitions. Advance Information The Advance Information designation indicates that Spansion LLC is developing one or more specific products, but has not committed any design to production. Information presented in a document with this designation is likely to change, and in some cases, development on the product may discontinue. Spansion LLC therefore places the following conditions upon Advance Information content: “This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.” Preliminary The Preliminary designation indicates that the product development has progressed such that a commitment to production has taken place. This designation covers several aspects of the product life cycle, including product qualification, initial production, and the subsequent phases in the manufacturing process that occur before full production is achieved. Changes to the technical specifications presented in a Preliminary document should be expected while keeping these aspects of production under consideration. Spansion places the following conditions upon Preliminary content: “This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that product qualification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document may be revised by subsequent versions or modifications due to changes in technical specifications.” Combination Some data sheets contain a combination of products with different designations (Advance Information, Preliminary, or Full Production). This type of document distinguishes these products and their designations wherever necessary, typically on the first page, the ordering information page, and pages with the DC Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first page refers the reader to the notice on this page. Full Production (No Designation on Document) When a product has been in production for a period of time such that no changes or only nominal changes are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include those affecting the number of ordering part numbers available, such as the addition or deletion of a speed option, temperature range, package type, or V IO range. Changes may also include those needed to clarify a description or to correct a typographical error or incorrect specification. Spansion LLC applies the following conditions to documents in this category: “This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion LLC deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur.” Questions regarding these document designations may be directed to your local AMD or Fujitsu sales office.

This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice. Publication Number S75PL-N_00 Revision 01E Issue Date April 21, 2006

Features

/G132Speed – PL-N: 70 ns (initial access, 30 ns page access) – ML-P: 30 ns (page access) – pSRAM: 70 ns /G132107-Ball Fine-Pitch Ball Grid Array (FBGA) – 9 x 12 x 1.4mm for ML512P based MCP's – 11 x 13 x 1.4mm for ML01GP based MCPs /G132Operating Temperature Range – Temperature Range of –25°C to +85°C General Description This document contains information for the S75PL-N MirrorBit MCP product. TheS75PL-N product consists of the following devices: /G132S29PL-N /G132S30ML-P /G1323V p S R A M Flash/RAM Combinations Table Product Selector Guide For detailed specifications, please refer to the individual data sheets: S75PL-N MirrorBit™ ORNAND™ MCPs Stacked Multi-Chip Product (MCP) S29PL-N: CMOS 3.0 Volt-only Simultaneous Read/Write, Page-mode Flash Memory (NOR Interface) S30ML-P: ORNAND Flash (NAND interface) 3V pSRAM Data Sheet (Advance Information) S29PL127N + pSRAM Density

32 Mb 64 Mb

Device pSRAM Density pSRAM Type S75PL127NBF 32 Mb pSRAM Type 7 Document Publication Identification Number (PID) S29PL-N S29PL-N_M0 S30ML-P S30ML-GP_00 32M pSRAM Type 7 pSRAM_29

2 S75PL-N MirrorBit ™ ORNAND™ MCPs S75PL-N_00_01E April 21, 2006

Data Sheet (Advance Information) 1. Ordering Information The ordering part number is formed by a valid combination of the following: S75PL 127 N B F JF W GZ 0 PACKING TYPE 0 = Tray 2 = 7” Tape and Reel 3 = 13” Tape and Reel MODEL NUMBER Refer to the Valid Combinations table below TEMPERATURE RANGE W = Wireless (–25°C to +85°C) PACKAGE TYPE AND MATERIAL JA = MCP BGA, 1.4 mm height, 0.8 mm pitch, Lead (Pb)-free Compliant package JF = MCP BGA, 1.4 mm height, 0.8 mm pitch, Lead (Pb)-free package ORNAND DATA DENSITY F = S30ML512P G = S30ML01GP pSRAM DENSITY B = 32 Mb pSRAM C = 64 Mb pSRAM D = 128 Mb pSRAM PROCESS TECHNOLOGY N = 110 nm MirrorBit™ Technology FLASH DENSITY 256 = 256 Mb 127 = 128 Mb (Single CE#) DEVICE FAMILY S75PL = 3.0 Volt-only Simultaneous Read/Write, Page Mode Flash Memory with Data storage ORNAND and pSRAM

S75PL-N_00_01E April 21, 2006 S75PL-N MirrorBit™ ORNAND™ MCPs 3 Data Sheet (Advance Information)

1.1 Valid Combinations

Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm availability of specific valid combinations and to check on newly released combinations. Notes: 1. /G55/G92/G83/G72/G3/G19/G3/G76/G86/G3/G86/G87/G68/G81/G71/G68/G85/G71/G17/G3/G54/G83/G72/G70/G76/G73/G92/G3/G82/G87/G75/G72/G85/G3/G82/G83/G87/G76/G82/G81/G86/G3/G68/G86/G3/G85/G72/G84/G88/G76/G85/G72/G71/G17 2. BGA package marking omits leading “S” and packing type designator from ordering part number. 3. Contact factory for availability for any of the OPNs listed since RAM type availability may vary over time. 2. Block Diagram (S29PL-N and pSRAM on Bus 1, S30ML-P on Bus 2) Valid Combinations Base Ordering Part Number (2) Package & Temperature Model Number Packing Type pSRAM Type PL-N Linear Mode Access Time ML-P Page Mode Access Time pSRAM Linear Mode Access Time Package Name S75PL127NBF JAW, JFW GZ 0, 2, 3 (1), (2) T y p e 7 7 0n s 3 0n s 7 0n s FMH107 9x12x1.4mm, 107 ball A0-A20 A0-A20 A21-A22 A21-A22 RY/BY# RY/BY# DQ0-DQ15 F-CE# CE# OE# OE# F-RST# SSV#TESER VSS F-ACC/WP# ACC/WP# WE# WE# VCC F-VCC VCCQ A0-A20 R-CE# CE# OE# R-LB# LB# R-UB# UB# WE# R-CE2 R-CE2 VSS VCC R-VCC VCCQ I/O0-I/O7 I/O0-I/O7 N-RY/BY # CCVRY/BY# N-VCC N-PRE PRE N-CLE CLE N-CE# CE# N-ALE ALE VSS N-VSS N-RE# #ER I/O0-I/O7 N-WP# WP# N-WE# WE# DQ0-DQ15 DQ0-DQ15 S29PL127N 32Mb pSRAM Memory S30ML512P x8 ORNAND FP# I/O0-I/O7

4 S75PL-N MirrorBit ™ ORNAND™ MCPs S75PL-N_00_01E April 21, 2006

Data Sheet (Advance Information) 3. Connection Diagrams

3.1 S75PL-N Pinout

Figure 3.1 107-ball Fine-Pitch Ball Grid Array (S75PL127NBF) Note: Top view—balls facing down. The addresses that are shared vary by MCP combination as shown in the table below: Special Handling Instructions for FBGA Package Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time. PL-N Addresses PL-N/pSRAM Addresses S75PL127NBF A22-A21 A20:A0 329 1 0 547 681 B D E F G H J K L M N P A C DNU DNU DNUDNU VSSRFU RFU RFU RFURFU RFU RFU RFU Index No ball A7RFU RFU RFU WP#/ ACC LB# A8 WE# A11N-RY/BY A6A3 A15 RFU RST#UB# A19 R-CE2 A12N-RE# A5A2 A21 RFU RY/BY#A18 A9 A20 A13N-CE# A4A1 A22 VCCnRFUA17 A10 RFU A14N-VCC VSSA0 A16 VSSnRFUDQ1 DQ6 RFU RFUN-VSS OE#F-CE# RFU I/O7DQ3DQ9 DQ13 DQ4 DQ15N-CLE DQ0R-CE1# VSS I/O6F-VCCDQ10 DQ12 R-VCC DQ7N-ALE DQ8N-WP# I/O4 I/O5DQ11DQ2 DQ5 RFU DQ14N-WE# RFURFU I/O3 N-PRERFUVSS I/O1I/O0 I/O2DNU DNU DNU DNUDNU Legend DNU pSRAM Only Reserved for Future Use NOR Flash Only ORNAND Flash Only

S75PL-N_00_01E April 21, 2006 S75PL-N MirrorBit™ ORNAND™ MCPs 5 Data Sheet (Advance Information)

3.2 FMH107—107-Ball Fine Pitch Ball Grid Array (FBGA) 9 x 12 mm package

Figure 3.2 FMH107 3512 \\ 16-038.19 \\ 8.9.05 PACKAGE FMH 107 JEDEC N/A D x E 12.00 mm x 9.00 mm PACKAGE SYMBOL MIN NOM MAX NOTE A --- --- 1.40 PROFILE A1 0.17 --- --- BALL HEIGHT A2 0.94 --- 1.11 BODY THICKNESS D 12.00 BSC. BODY SIZE E 9.00 BSC. BODY SIZE D1 8.80 BSC. MATRIX FOOTPRINT E1 7.20 BSC. MATRIX FOOTPRINT MD 12 MATRIX SIZE D DIRECTION ME 10 MATRIX SIZE E DIRECTION n 107 BALL COUNT b 0.35 0.40 0.45 BALL DIAMETER eE 0.80 BSC. BALL PITCH eD 0.80 BSC. BALL PITCH SD / SE 0.40 BSC. SOLDER BALL PLACEMENT A3,A4,A5,A6,A7,A8, DEPOPULATED SOLDER BALLS B1,M3,M4,M5,M6,M7,M8 NOTES: 1. DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3. BALL POSITION DESIGNATION PER JEP95, SECTION 4.3, SPP-010. 4. e REPRESENTS THE SOLDER BALL GRID PITCH. 5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION. SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION. n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS FOR MATRIX SIZE MD X ME.

6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL

DIAMETER IN A PLANE PARALLEL TO DATUM C.

7 SD AND SE ARE MEASURED WITH RESPECT TO

DATUMS A AND B AND DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW SD OR SE = 0.000. WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, SD OR SE = e/2 8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS. 9. A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTATION OR OTHER MEANS. Ø SIDE VIEW 107X

0.15 M C

0.08 b 7SE eD 3eE PIN A1 CORNER KML SD BOTTOM VIEW C C BJH G F E C DA AD E C0.15 (2X) B C0.15 (2X) C TOP VIEW PIN A1 CORNER A2A INDEX MARK 0.08 0.20

6 S75PL-N MirrorBit ™ ORNAND™ MCPs S75PL-N_00_01E April 21, 2006

Data Sheet (Advance Information) 4. Revision History

4.1 Revision A (April 21, 2006)

Initial release. Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including wit hout limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and m anufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in we apon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semic onductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any oth er country, the prior authorization by the respective government entity will be required for export of those products. Trademarks and Notice The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The informati on in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document. Copyright © 2006 Spansion LLC. All Rights Reserved. Spansion, th e Spansion logo, MirrorBit, ORNAND, and combinations thereof are trademarks of Spansion LLC. Other names are for informational purposes only and may be trademarks of their respective owners.