S71GL032N80-0K

S71GL-N_08 SPANSION | Alldatasheet

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Publication Number S71GL-N_00 Revision 03 Issue Date March 25, 2008 S71GL-N Based MCPs S71GL-N Based MCPs Cover Sheet Stacked Multi-Chip Product (MCP) Flash Memory and RAM 64/32 Megabit (4/2 M x 16-bit) CMOS 3.0 Volt-only Page Mode Flash Memory and 32/16/8/4 Megabit (2M/1M/512k/256k x 16-bit) Pseudo Static RAM Data Sheet (Advance Information) Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Each product described herein may be designated as Advance Information, Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.

2 S71GL-N Based MCPs S71GL-N_00_03 March 25, 2008

Data Sheet (Advance Information) Notice On Data Sheet Designations Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. In all cases, however, readers are encouraged to verify that they have the latest information before finalizing their design. The following descriptions of Spansion data sheet designations are presented here to highlight their presence and definitions. Advance Information The Advance Information designation indicates that Spansion Inc. is developing one or more specific products, but has not committed any design to production. Information presented in a document with this designation is likely to change, and in some cases, development on the product may discontinue. Spansion Inc. therefore places the following conditions upon Advance Information content: “This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.” Preliminary The Preliminary designation indicates that the product development has progressed such that a commitment to production has taken place. This designation covers several aspects of the product life cycle, including product qualification, initial production, and the subsequent phases in the manufacturing process that occur before full production is achieved. Changes to the technical specifications presented in a Preliminary document should be expected while keeping these aspects of production under consideration. Spansion places the following conditions upon Preliminary content: “This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that product qualification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document may be revised by subsequent versions or modifications due to changes in technical specifications.” Combination Some data sheets contain a combination of products with different designations (Advance Information, Preliminary, or Full Production). This type of document distinguishes these products and their designations wherever necessary, typically on the first page, the ordering information page, and pages with the DC Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first page refers the reader to the notice on this page. Full Production (No Designation on Document) When a product has been in production for a period of time such that no changes or only nominal changes are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include those affecting the number of ordering part numbers available, such as the addition or deletion of a speed option, temperature range, package type, or V IO range. Changes may also include those needed to clarify a description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following conditions to documents in this category: “This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur.” Questions regarding these document designations may be directed to your local sales office.

This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice. Publication Number S71GL-N_00 Revision 03 Issue Date March 25, 2008 Distinctive Characteristics MCP Features „ Power supply voltage of 2.7 to 3.1 volt „ High performance – 90 ns access time (90 ns Flash, 70 ns pSRAM/SRAM) – 25 ns page read times „ Packages – 7 x 9 x 1.2 mm 56 ball FBGA (TLC056) „ Operating Temperature – –25°C to +85°C General Description The S71GL-N product series consists of S29GL-N Flash memory with pSRAM combinations defined as: For detailed specifications, please refer to the individual data sheets. S71GL-N Based MCPs Stacked Multi-Chip Product (MCP) Flash Memory and RAM 64/32 Megabit (4/2 M x 16-bit) CMOS 3.0 Volt-only Page Mode Flash Memory and 32/16/8/4 Megabit (2M/1M/512k/256k x 16-bit) Pseudo Static RAM Data Sheet (Advance Information) Flash Memory Density

32 Mb 64 Mb

4 Mb S71GL032N40

8 Mb S71GL032N80

16 Mb S71GL032NA0 S71GL064NA0

32 Mb S71GL064NB0

Document Publication Identification Number (PID) S29GL-N S29GL-N_00

4 Mb pSRAM Type 9 pSRAM_33

8 Mb pSRAM Type 9 pSRAM_34

16 Mb pSRAM Type 7 pSRAM_13

32 Mb pSRAM Type 8 pSRAM_31

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Data Sheet (Advance Information) 1. Product Selector Guide 1.1 64 Mb Flash Memory Note Please see the valid combinations table for the model# description. Device-Model# (Note) Flash Access time (ns) (p)SRAM density (p)SRAM Access time (ns) (p)SRAM type Package S71GL032N40-0K 4 Mb pSRAM 9 TLC056 S71GL032N40-0P S71GL032N80-0K 8 Mb S71GL032N80-0P S71GL032NA0-0U

16 Mb pSRAM7

32 Mb pSRAM 8

March 25, 2008 S71GL-N_00_03 S71GL-N Based MCPs 5 Data Sheet (Advance Information) 2. MCP Block Diagram VSS RESET# Flash IO15-IO0 VCCf DQ15 to DQ0 RY/BY# WP#/ACC VCCVCC CE1#f Flash-only Address Shared Address OE# WE# VCCS VCC CE1#s UB# LB# CE# UB# LB# pSRAM CE2s

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Data Sheet (Advance Information) 3. Connection Diagram Note May be shared depending on density.

3.1 Special Handling Instru ctions For FBGA Package

Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time. MCP Flash-only Addresses Shared Addresses S71GL032NA0 A20 A19-A0 S71GL032N80 A20-A19 A18-A0 S71GL032N40 A20-A18 A17-A0 S71GL064NB0 A21 A20-A0 S71GL064NA0 A21-A20 A19-A0 UB# A18 A17 DQ1 DQ9 DQ10 DQ2 LB# CE2s A20 DQ4 VCCs RFU WE# A19 A10 DQ6 DQ13 DQ12 DQ5 RST#f RY/BY# DQ3 VCCf DQ11 WP/ACC A12 A13 A14 RFU DQ15 DQ7 DQ14 A11 A15 A21 RFU A16 RFU VSS VSS OE# DQ0CE1#s DQ8 CE1#f F5F4 B1 B8 A3 A5 A6A4 A7A2 RAM only Shared (Note 1) Flash only Legend Reserved for Future Use 56-ball Fine-Pitch Ball Grid Array (Top View, Balls Facing Down)

March 25, 2008 S71GL-N_00_03 S71GL-N Based MCPs 7 Data Sheet (Advance Information) 4. Pin Description Pin Description A21–A0 22 Address Inputs (Common and Flas h only) (A20-A0 for the S71GL032N) DQ15–DQ0 16 Data Inputs/Outputs (Common) CE1#f Chip Enable (Flash) CE1#s Chip Enable 1 (pSRAM/SRAM) CE2s Chip Enable 2 (pSRAM/SRAM) OE# Output Enable (Common) WE# Write Enable (Common) RY/BY# Ready/Busy Output (Flash 1) UB# Upper Byte Control (pSRAM/SRAM) LB# Lower Byte Control (pSRAM/SRAM) RESET# Hardware Reset Pin, Active Low (Flash) WP#/ACC Hardware Write Protect/Acceleration Pin (Flash) VCCf Flash 3.0 volt-only single power supply (see Product Selector Guide for speed options and voltage supply tolerances) VCCS pSRAM/SRAM Power Supply VSS Device Ground (Common) NC Pin Not Connected Internally

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Data Sheet (Advance Information) 5. Ordering Information The order number is formed by a valid combinations of the following: Note 1. Type 0 is standard. Specify other options as required. Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm availability of specific valid combinations and to check on newly released combinations. S71GL 064 N A0 BF W 0 Z 0 PACKING TYPE 0= T r a y 2 = 7” Tape and Reel 3 = 13” Tape and Reel MODEL NUMBER See the Valid Combinations table. PACKAGE MODIFIER 0 = 7 x 9 mm, 1.2 mm height, 56 balls (TLC056) TEMPERATURE RANGE W = Wireless (-25 °C to +85°C) PACKAGE TYPE BF = Fine-pitch BGA Lead (Pb)-free package BH = Fine-pitch BGA Lead (PB)-free, Low-Halogen package pSRAM / SRAM DENSITY B0 = 32 Mb pSRAM A0 = 16 Mb pSRAM 40 = 4 Mb pSRAM 80 = 8 Mb pSRAM PROCESS TECHNOLOGY N = 110 nm, MirrorBit ® Technology FLASH DENSITY 064 = 64Mb 032 = 32Mb PRODUCT FAMILY S71GL Multi-chip Product (MCP) 3.0-volt Page Mode Flash Memory and RAM Table 5.1 Valid Combinations S71GL064N Valid Combinations Speed Options (ns)/Boot Sector Option (p)SRAM Type/ Access Time (ns) Package MarkingBase Ordering Part Number Package & Temperature Package Modifier/Model Number Packing Type S71GL032N40 BFW, BHW 0, 2, 3 (1) 90 / Bottom Boot Sector pSRAM9 / 70 TLC056 0P 90 / Top Boot Sector S71GL032N80 0K 90 / Bottom Boot Sector pSRAM9 / 70 0P 90 / Top Boot Sector S71GL032NA0 0U 90 / Bottom Boot Sector pSRAM7 / 70 0Z 90 / Top Boot Sector S71GL064NA0 0U 90 / Bottom Boot Sector pSRAM7 / 70 S71GL064NA0 0Z 90 / Top Boot Sector S71GL064NB0 0U 90 / Bottom Boot Sector pSRAM8 / 70 S71GL064NB0 0Z 90 / Top Boot Sector

March 25, 2008 S71GL-N_00_03 S71GL-N Based MCPs 9 Data Sheet (Advance Information) 6. Physical Dimensions

6.1 TLC056—56-ball Fine-Pitch Ball Grid Array (FBGA) 9 x 7 mm Package

3348 \\ 16-038.22a PACKAGE TLC 056 JEDEC N/A D x E 9.00 mm x 7.00 mm PACKAGE SYMBOL MIN NOM MAX NOTE A --- --- 1.20 PROFILE A1 0.20 --- --- BALL HEIGHT A2 0.81 --- 0.97 BODY THICKNESS D 9.00 BSC. BODY SIZE E 7.00 BSC. BODY SIZE D1 5.60 BSC. MATRIX FOOTPRINT E1 5.60 BSC. MATRIX FOOTPRINT MD 8 MATRIX SIZE D DIRECTION ME 8 MATRIX SIZE E DIRECTION n 56 BALL COUNT φb 0.35 0.40 0.45 BALL DIAMETER eE 0.80 BSC. BALL PITCH eD 0.80 BSC BALL PITCH SD / SE 0.40 BSC. SOLDER BALL PLACEMENT A1,A8,D4,D5,E4,E5,H1,H8 DEPOPULATED SOLDER BALLS NOTES: 1. DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010. 4. e REPRESENTS THE SOLDER BALL GRID PITCH. 5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION. SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION. n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS FOR MATRIX SIZE MD X ME.

6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL

DIAMETER IN A PLANE PARALLEL TO DATUM C.

7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A

AND B AND DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW SD OR SE = 0.000. WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, SD OR SE = e/2 8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS. 9. N/A

10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK

MARK, METALLIZED MARK INDENTATION OR OTHER MEANS. 7SE A eD DCEFGH eE B PIN A1 CORNER7 SD BOTTOM VIEW C0.08 0.20 C A E B C0.15 (2X) C D C0.15 (2X) INDEX MARK b TOP VIEW SIDE VIEW CORNER 56X A2A 0.15 M M C C AB 0.08 PIN A1

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Data Sheet (Advance Information) 7. Revision History Section Description Revision 01 (May 14, 2007) Initial release. Revision 02 (June 19, 2007) Global Editorial changes to valid combinations table Revision 03 (March 25, 2008) Ordering Information Added Low-Halogen option to package type.

March 25, 2008 S71GL-N_00_03 S71GL-N Based MCPs 11 Data Sheet (Advance Information) Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. Y ou must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products. Trademarks and Notice The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document. Copyright © 2007-2008 Spansion Inc. All rights reserved. Spansion®, the Spansion Logo, MirrorBit®, MirrorBit® Eclipse™ , ORNAND™ , ORNAND2™ , HD-SIM™ and combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.