S6A MCC | Alldatasheet
Document overview
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- PDF pages: 3
Technical content
Features
- For Surface Mount Applications
- Extremely Low Thermal Resistance
- Easy Pick And Place
- High Temp Soldering: 250°C for 10 Seconds At Terminals
- High Current Capability Maximum Ratings
- Operating Temperature: -55°C to +150°C
- Storage Temperature: -55°C to +150°C MCC Part Number Device Marking Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage S6A S6A 50V 35V 50V S6B S6B 100V 70V 100V S6D S6D 200V 140V 200V S6G S6G 400V 280V 400V S6J S6J 600V 420V 600V S6K S6K 800V 560V 800V S6M S6M 1000V 700V 1000V Electrical Characteristics @ 25°C Unless Otherwise Specified Average Forward Current I F(AV) 6.0A TJ = 75°C Peak Forward Surge Current I FSM 200A 8.3ms, half sine Maximum Instantaneous Forward Voltage V F 1.20V IFM = 6.0A; TJ = 25°C* Maximum DC Reverse Current At Rated DC Blocking Voltage I R 10µA 100µA TJ = 25°C TJ = 100°C Typical Junction Capacitance C J 150pF Mea sured at 1.0MHz, VR =4.0V *Pulse test: Pulse w idth 200 µsec, D uty cycle 2% H J E F G A BD C Cathode Band www.mccsemi.com DO-214AB (SMCJ) (Round Lead) 0.070” 0.190 0.200” SUGGESTED SOLDER PAD LAYOUT DIMENSIONS INCHES MM DIM MIN MAX MIN MAX NOTE A .200 .214 5.08 5.43 B .177 .203 4.70 5.30 C .002 .005 .05 .13 D --- .02 --- .51 E .053 .067 1.35 1.70 F .168 .179 4.27 4.55 G .320 .330 8.13 8.38 H .239 .243 6.08 6.18 J .234 .240 5.95 6.10 /G01/G02/G03/G04/G05/G06/G07/G05/G08/G08/G09/G04/G03/G02/G0A/G0B/G06/G07omponents
21201 Itasca Street Chatsworth
/G07/G18/G06/G19/G0F/G1A/G0F/G0F /G1B/G15/G05/G1C/G09/G1D/G06/G1E/G1F/G0F/G1F/G20/G06/G21/G10/G0F/G22/G23/G19/G1A/G1A /G24/G0A/G25/G1D/G06/G06/G06/G1E/G1F/G0F/G1F/G20/G06/G21/G10/G0F/G22/G23/G19/G1A/G19 MCC