S3A MCC | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 3
Technical content
Features
- For Surface Mount Applications
- Extremely Low Thermal Resistance
- Easy Pick And Place
- High Temp Soldering: 250°C for 10 Seconds At Terminals\\
- High Current Capability Maximum Ratings
- O perating Temperature: -55°C to +150°C
- Storage Temperature: -55°C to +150°C
- Maximum Thermal Resistance; 10°C/W Junction To Lead MCC Part Number Device Marking Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage S3A S3A 50V 35V 50V S3B S3B 100V 70V 100V S3D S3D 200V 140V 200V S3G S3G 400V 280V 400V S3J S3J 600V 420V 600V S3K S3K 800V 560V 800V S3M S3M 1000V 700V 1000V Electrical Characteristics @ 25°C Unless Otherwise Specified Average Forward Current I F(AV) 3.0A TJ = 120°C Peak Forward Surge Current I FSM 100A 8.3ms, half sine Maximum Instantaneous Forward Voltage V F 1.20V IFM = 3.0A; TJ = 25°C* Maximum DC Reverse Current At Rated DC Blocking Voltage I R 10µA 250µA TJ = 25°C TJ = 125°C Typical Junction Capacitance C J 60pF Measured at 1.0MHz, VR =4.0V *Pulse test: Pulse width 200 µsec, Duty cycle 2% DO-214AB (SMCJ) DIMENSIONS INCHES MM DIM MIN MAX MIN MAX NOTE A .079 .103 2.00 2.62 B .108 .128 2.75 3.25 C .002 .008 .051 .203 D E .030 .050 .76 1.27 F G .305 .320 7.75 8.13 H .260 .280 6.60 7.11 J .220 .245 5.59 6.22 H J E F G A BD C 0.070” 0.190 0.125” SUGGESTED SOLDER PAD LAYOUT /G01/G02/G03/G04/G05/G06/G07/G05/G08/G08/G09/G04/G03/G02/G0A/G0B/G06/G07omponents
21201 Itasca Street Chatsworth
/G07/G18/G06/G19/G0F/G1A/G0F/G0F /G1B/G15/G05/G1C/G09/G1D/G06/G1E/G1F/G0F/G1F/G20/G06/G21/G10/G0F/G22/G23/G19/G1A/G1A /G24/G0A/G25/G1D/G06/G06/G06/G1E/G1F/G0F/G1F/G20/G06/G21/G10/G0F/G22/G23/G19/G1A/G19 MCC www.mccsemi.com Version: 3 2002/12/27