S3ABF_V01 CHENDA | Alldatasheet
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For surface mounted applications Low profile package Glass Passivated Chip Junction E asy to pick and place Lead free in comply with EU RoHS 2011/65/EU diretives Dimensions in inches and (millimeters) Reverse Voltage - 50 to 1000 Volts Forward Current - 3.0 Ampere SMBF 0.216(5.50) 0.200(5.10) 0.048(1.20) 0.031(0.80) 0.010(0.26) 0.007(0.18) 0.051(1.30) 0.043(1.10) 0.173(4.40) 0.165(4.20) 0.086 (2.20) 0.075 (1.90) 0.146(3.70) 0.138(3.50) Mechanical Data Case: JEDEC 60B) molded plastic body Terminals: Solderable per MIL-STD-750,Method 2026 Polarity: Polarity symbol marking on body Mounting Position: Any Weight : 0.002 ounce, 0.057 grams Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. Maximum Ratings And Electrical Characteristics Parameter SYMBOLS S3ABF S3BBF S3DBF S3GBF S3JBF S3KBF S3MBF UNITS Marking Code MDD S3ABF MDD S3BBF MDD S3DBF MDD S3GBF MDD S3JBF MDD S3KBF MDD S3MBF Maximum repetitive peak reverse voltage VRMM 50 100 200 400 600 800 1000 V Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V Maximum average forward rectified current at TL=65¥ I(AV) 3.0 A Peak forward surge current 8.3ms single half sine-wave superimposed onrated load (JEDEC Method) IFSM 80 A Maximum instantaneous forward voltage at 3.0A VF 1.10 V Maximum DC reverse current TA=25℃ at rated DCblocking voltage TA=125℃ IR 5.0 150.0 μA Typical junction capacitance (NOTE 1) CJ 35.0 pF Typical thermal resistance (NOTE 2) RJA 45.0 ℃/W Operating junction and storage temperature range TJ,TSTG -55 to +150 ℃ 3.The typical data above is for reference only.
Rev:2019A0 Page :2 Typical Characterisitics The curve above is for reference only. https://www.microdiode.com S3ABF THRU S3MBF Reverse Voltage - 50 to 1000 Volts Forward Current - 3.0 Ampere Fig.2 Typical Reverse Characteristics 0.1 1.0 100 20 40 60 80 100 12000 140 percent of Rated Peak Reverse Voltage (%) Instaneous Reverse Current（μ A） TJ=125°C TJ=25°C Junction Capacitance (pF) 1.0 10 1000.1 100 Reverse Voltage (V) TJ=25°C 100 120 10 100 Fig.6 Maximum Non-Repetitive Peak Forward Surge Current Peak Forward Surge Current (A) Number of Cycles 8.3 ms Single Half Sine Wave (JEDEC Method) 25 50 75 100 125 150 175 Average Forward Current (A) Case Temperature (°C) Fig.1 Forward Current Derating Curve 1.0 2.0 3.0 0.0 Fig.4 Typical Junction Capacitance 0.1 0.6 1.0 1.2 1.6 Instaneous Forward Current (A) Instaneous Forward Voltage (V) 0.4 Fig.3 Typical Forward Characteristic 1.0 1.40.8 1.8 TJ=25°C Single phase half-wave 60 Hz resistive or inductive load
https://www.microdiode.com Rev:2019A0 Page :3 Important Notice and Disclaimer Microdiode Electronics (Jiangsu) reserves the right to make changes to this document and its products and specifications at any time without notice. Customers should obtain and confirm the latest product information and specifications before final design,purchase or use. Microdiode Electronics (Jiangsu) makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, not does Microdiode Electronics (Jiangsu) assume any liability for application assistance or customer product design. Microdiode Electronics (Jiangsu) does not warrant or accept any liability with products which are purchased or used for any unintended or unauthorized application. No license is granted by implication or otherwise under any intellectual property rights of Microdiode Electronics (Jiangsu). Microdiode Electronics (Jiangsu) products are not authorized for use as critical components in life support devices or systems without express written approval of Microdiode Electronics (Jiangsu). Suggested Pad Layout 0.118 0.260 Symbol Unit (mm) A C D 0.071 6.6 3.0 E B Unit (inch) 0.189 1.8 0.1002.54 E B d F W PA D D1D2 C T Item Tolerance SMBF Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width P E B C d F T W P A D D Symbol 0.1 0.1 0.1 min 0.5 0.1 0.3 1.0 0.1 0.05 0.1 0.1 0.1 0.1 2.0 unit:mm 1 . 50 330.00 50.00 13.00 1.75 5.50 4.00 4.00 2.00 0.30 12.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. 3.81 5.61 1.60 Reel packing SMB F 13" 5,000 4.0 10,000 190*190*41 330 365*365* 360 80,000 14.0 PACKAGE REEL SIZE REEL COMPONENT SPACING BOX INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(mm)(mm)(mm)(pcs)(mm)(pcs) 4.8 12.30W1Reel width S3ABF THRU S3MBF Reverse Voltage - 50 to 1000 Volts Forward Current - 3.0 Ampere