S3AB

S3AB_16 TMT | Alldatasheet

Document overview

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Technical content

FEATURES

• Glass passivated chip junction - Ideal for automated placement - Low forward voltage drop - High surge current capability - Halogen-free according to IEC 61249-2-21 definition MECHANICAL DATA Case: DO-214AA (SMB) Molding compound, UL flammability classification rating 94V-0 Moisture sensitivity level: level 1, per J-STD-020 Part no. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.09 g (approximately) V RRM 50 100 200 400 600 800 1000 V VRMS 35 70 140 280 420 560 700 V VDC 50 100 200 400 600 800 1000 V IF(AV) A trr μs CJ pF RθJL °C/W TJ °C TSTG °C Note 1: Pulse test with PW=300μs, 1% duty cycle Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C. Document Number: DS_D1410018 Version: J15 Maximum reverse current @ rated VR TJ=25°C TJ=125°C Taiwan Semiconductor 1.15 250 Typical junction capacitance (Note 3) 40 V IR μA Storage temperature range - 55 to +150 Typical reverse recovery time (Note 2) 1.5 Typical thermal resistance 10 - 55 to +150Operating junction temperature range Maximum instantaneous forward voltage (Note 1) @ 3 A VF Maximum average forward rectified current 3 Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 80 A Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER SYMBOL S3 AB BB S3AB - S3MB 3A, 50V - 1000V Surface Mount Rectifiers DB GB JB KB - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC DO-214AA (SMB) MB Unit

PART NO. PART NO. (TA=25°C unless otherwise noted) Document Number: DS_D1410018 Version: J15 AEC-Q101 qualified Green compoundS3MBHR5G S3MB H R5 G M4 SMB 3,000 / 13" Plastic reel Note 1: "x" defines voltage from 50V (S3AB) to 1000V (S3MB) EXAMPLE PREFERRED P/N PART NO. SUFFIX PACKING CODE PACKING CODE SUFFIX

DESCRIPTION

(Note 1) H G SMB 850 / 7" Plastic reel R4 SMB 3,000 / 13" Paper reel Taiwan Semiconductor S3AB - S3MB RATINGS AND CHARACTERISTICS CURVES

ORDERING INFORMATION

PART NO. SUFFIX PACKING CODE PACKING CODE SUFFIX PACKAGE 0.5 1.5 2.5 3.5 0 2 04 06 08 0 1 0 0 1 2 0 1 4 0 1 6 0 AVERAGE FORWARD CURRENT (A) LEAD TEMPERATURE (°C) FIG.1 FORWARD CURRENT DERATING CURVE RESISTIVE OR INDUCTIVE LOAD 100 1 10 100 PEAK FORWARD SURGE URRENT (A) NUMBER OF CYCLES AT 60 Hz FIG. 3 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 8.3ms Single Half Sine Wave 0.1 100 0 20 40 60 80 100 120 140 INSTANTANEOUS REVERSE CURRENT (μA) PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FIG. 2 TYPICAL REVERSE CHARACTERISTICS TJ=25°C TJ=125°C 0.1 100 INSTANTANEOUS FORWARD CURRENT (A) FORWARD VOLTAGE (V) FIG. 4 TYPICAL FORWARD CHARACTERISTICS Pulse Width=300μs 1% Duty Cycle

A 1.95 2.10 0.077 0.083 B 4.25 4.75 0.167 0.187 C 3.48 3.73 0.137 0.147 D 1.99 2.61 0.078 0.103 E 0.90 1.41 0.035 0.056 F 5.10 5.30 0.201 0.209 G 0.10 0.20 0.004 0.008 H 0.15 0.31 0.006 0.012 P/N = Specific Device Code G = Green Compound YW = Date Code F = Factory Code Document Number: DS_D1410018 Version: J15 MARKING DIAGRAM D 1.8 0.071 E 6.8 0.268 B 2.5 0.098 C 4.3 0.169 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 2.3 0.091 S3AB - S3MB Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DIM. Unit (mm) Unit (inch) DO-214AA (SMB) 100 1 10 100 CAPACITANCE (pF) REVERSE VOLTAGE (V) FIG. 5 TYPICAL JUNCTION CAPACITANCE f=1.0MHz Vsig=50mVp-p

assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1410018 Version: J15 S3AB - S3MB Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,