S3A1U3L-A1 SILICOM | Alldatasheet

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Silicom Ltd. Connectivity Solutions Page 1 S3A1U3L-A1 1U PCI Express Gen3.0 Host Connector Interface Adapter Product Description Silicom SETAC (Server to Appliances Converter) solution designed for system where needed high quantity of I/O ports and interfaces, and where high quantity of different configurations must handle efficiently by end user. Silicom SETAC is designed for standard servers and common 1U, 2U or 3U mountable chassis with 3 to 6 HD bays on the front end. The Silicom SETAC provides front networking connectivity for the standard rack mountable server. Silicom SETAC solution based on Silicom ExpressModule cards, providing widest networking and Bypass solution. Silicom SETAC replaces SATA HD trays by Silicom ExpressModule I/O. Silicom SETAC replaces HD SATA backplane with PCI Express backplane. Key Features  Based on server grade reliability  Leverage the price / performance / reliability of standard server  Maximize the I/O ports and interfaces  Field replaceable – End user can change the configuration without opening of sever chassis  High quantity of various configurations can be efficiently handled and final configuration can be done just before shipment  Server and IO module flexibility:  Based on standard server  Based on Silicom ExpressModule cards  Simpler maintenance – Components can be replaced quickly and assuredly Reliable solution:  Based on current SATA backplane  Better than SATA cables  Better than standard add-in PCI form factor

Silicom Ltd. Connectivity Solutions Page 2  Redundant PSU (1+1), low cost model with single PSU  Standard dimension motherboard (12×13) with next generation NEHALEM CPUs  Based on embedded solutions –Up to 5 years product life cycle Host Interface:  Host Interface standard support PCI Express 2.0 (5Gb/s)  Host Interface standard support PCI Express 3.0 (8Gb/s)  PCI Express X8 lanes  Signaling and interface based on PCI-Express EM standard (PCI-SIG) ver. 2.0 (5.0 Gb/s)  Module Width same as standard of 3.5” Hard Disk (101.6mm)  Module install to 3.5” Hard disk Bay of rack mountable server  PCI-E EM Backplane replacing HD Backplane  PCI Express ExpressModule Electromechanical Specification Revision 1.0 (2.0)  PCI Express External Cabling Specification Revision 1.0 (2.0)  PCI Express External Cabling Specification 2.0 Revision 0.3 RC2  PCI Express External Cabling Specification 3.0 Revision 1.0 Building Blocks:  Silicom’s PCI Express backplane replaces SATA backplane  Silicom’s Express Module I/O cards replace SAS / SATA drives  Standard PCI Express host connector interface adapter  In system TWINAX PCI Express cabling Technical Specifications General Technical Specifications Size: 4.528” x 1.268” (115mm x 32.21mm) PCI Express Card Type: X8 Lane Voltage: +12V (Min 11.4, Max, 12.6V) Holder: Metal Bracket Weight: 10gr (0.353 oz) Power Consumption: 0.05A @ 12V , 0.6W

Silicom Ltd. Connectivity Solutions Page 3 Operating Humidity: 0%–90%, non-condensing Operating Temperature: 0°C – 50°C (32°F – 122°F) Storage Temperature: -20°C–65°C (-4°F–149°F) EMC Certifications: Class B MTBF*: TBD (Years) *According to Telcordia SR-332 Issue 1 Environmental condition – GB (Ground, Fixed, Controlled). Ambient temperature – 25°C. Temperature rise of 15°C above the system ambient temperature was assumed for the cards components Connector Specifications Connectors: (1) iPass Connector Order Information P/N Description Notes S3A1U3L-A1 1U PCI Express Gen 3.0 x8 Host Connector to Single TWINAX Connector Interface Adapter (without power to backplane) PCI Express Gen 3.0 x8 Host Connector S3A3U1-A1 1U PCI Express Gen 3.0 x8 Host Connector to Single TWINAX Connector Interface Adapter (without power to backplane) PCI Express Gen 3.0 x8 Host Connector 1V0