S30AG250KY1234 DILABS | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
HEAT SINKS AND STANDOFFSHEAT SINKS AND STANDOFFS dielectric laboratories Part Number Single Layer Aluminum Nitride for use as Standoffs or Heatsinks. S 30 A G 250 K Y 1234 Product Code Width Code Material Code Thickness Code Drawing Reference Code Surface Finish Code Thickness T olerance Code Part Number ApplicationsApplications o Laser diode mounts o HPA MMIC submounts o Standoffs BenefitsBenefits o High thermal conductivity o Low capacitance o Available with AuSn for solder die attach o 4.6 PPM/°C coefficient of thermal expansion provides stable match for GaAs and Si die HEAT SINKS AND STANDOFFS HEAT SINKS AND STANDOFFS
HEAT SINKS AND STANDOFFSHEAT SINKS AND STANDOFFS dielectric laboratories S 30 A G 250 K Y 1234 Part NumberPart Number
2777 Route 20 East • Cazenovia, New Y ork 13035
HEAT SINKS AND STANDOFFSHEAT SINKS AND STANDOFFS Outline DrawingOutline Drawing Typical ApplicationsTypical Applications PackagingPackaging Metalization OptionsMetalization Options T L W Standard T olerance L & W – .002'' Pkg Floor Pkg Floor Photo-Diode LED or Laser Diode Wire Bonds For Signal & Bias Aluminum Nitride Heat Sink Metalized 6 Sides (i. e. DC Short) Standoff (Metalization T op & Bottom Only i. e. DC Isolated) Characteristics Material Aluminum Nitride: >97% purity Thermal Conductivity: 170 W/mK Coefficient of Thermal Expansion: 4.6 ppm/°C Dielectric Constant: 8.85 Dissipation Factor: .0005 Max @ 1GHz (Unmetalized) Insulation Resistance: 106 megohms minimum 25°C Thickness Code: Thickness in thousandths of an inch. 250 = .025" Thickness T olerance Codes K= ± 10% As Fired ± .002 Machined Surface Finish Codes X= As Fired Y= Machined Characteristics M= 300Å TiW, 100 m" Au (min) T= 300Å TiW, 50 m" Au A side, 300Å TiW, 50m" NiV, 300m",AuSn B side E= 300Å TiW, 50 m" Au both sides. Patterned TiW/NiV/AuSn (300m" min) per customer specifications. 4mil minimum exposure of underlying TiW Au to ensure bondability. N= 300Å TiW, 50 m" NiV 1/100m" Au Standard: Waffle Packs. Custom packaging available. Call with requirements.