S2GA-13-F MULTICOMP | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 3
Technical content
Page <1> V1.013/09/19 Surface Mount Rectifier Newark.com/multicomp-pro Farnell.com/multicomp-pro Element14.com/multicomp-pro Features:
- Plastic Package
- For Surface Mounted Applications
- Low Profile Package
- Built-In Strain Relief, Ideal for Automated Placement
- High Temperature Soldering : 250°C/10 seconds at Terminals Mechanical Data
- Case : JEDEC DO-214AC molded plastic over passivated chip
- Terminals : Solder plated, solderable per MIL-STD-750, method 2026
- Polarity : Colour band denotes cathode end
- Weight : 0.002oz, 0.064g Maximum Ratings and Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified Note: (1) Measured at 1MHz and applied reverse voltage of 4V (2) Thermal resistance from junction to ambient and junction to lead PCB mounted on 0.27ʺ × 0.27ʺ (7 × 7mm2) copper pad areas Characteristic Symbol S2GA-13-F S2JA-13-F S2MA-13-F Units Maximum repetitive peak reverse voltage VRRM 400 600 1,000 V Maximum RMS voltage VRWS 280 420 700 V Maximum DC blocking voltage VDC 400 600 1,000 V Maximum average forward rectified current at TL=90°C IF(AV) 2 A Peak forward surge current at TL = 110°C 8.3 ms single half-sine-wave superimposed on rated load (JEDEC Method) IFSM 50 A Maximum instantaneous forward voltage at 2A VF 1.15 V Maximum DC reverse current TA=25°C at rated DC blocking voltage TA=125°C IR 125 μA Typical junction capacitance (Note 1) CJ 20 pF Typical thermal resistance (Note 2) RθJA 50 °C/W Operating junction and storage temperature range TJ, TSTG -55 to +150 °C
Page <2> V1.013/09/19 Surface Mount Rectifier Newark.com/multicomp-pro Farnell.com/multicomp-pro Element14.com/multicomp-pro
Page <3> V1.013/09/19 Surface Mount Rectifier Newark.com/multicomp-pro Farnell.com/multicomp-pro Element14.com/multicomp-pro DO-214AC(SMA) Dim. Min. Max. A 4.25 4.65 B 2.4 2.8 C 1.85 2.15 D 4.85 5.35 E 0.2 Typ. F 0.9 1.5 G 0.2 Max. H 1.9 2.3 I 1.35 1.65 Dimensions : Millimetres Dimensions : Millimetres Package Outline Dimensions Soldering Footprint Device Package Shipping S2GA-13-F S2JA-13-F S2MA-13-F DO-214AC(SMA) 5,000 / Tape & Reel
Package Information
Important Notice : This data sheet and its contents (the “Information”) belong to the members of the AVNET group of companies (the “Group”) or are licensed to it. No licence is granted for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence. Multicomp Pro is the registered trademark of Premier Farnell Limited 2019.