S2A_18 JUXING | Alldatasheet
Document overview
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Technical content
Features
Ideal for automated placement Open junction chip junctions Low forward voltage drop Low leakage current High forward surge capability High temperature soldering 260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC Mechanical Date Case: JEDEC SMA molded plastic Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D Polarity: Laser band denotes cathode end Maximum Ratings & Thermal Characteristics A = 25 °C unless otherwise noted)
Electrical Characteristics
A = 25 °C unless otherwise noted) Note 2: Pulse test:300μs pulse width,1% duty cycle. 1.10 V 50 μAT A =25℃ T A =125℃ I R V F Reverse current V R DC 0.98 Symbol Min Type Max Items Test conditions Instantaneous forward voltage Operating junction and storage temperature range T J , T STG –55 to +125 UNIT I F =2A (2) Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load I FSM 50 A Thermal resistance from junction to lead (1) R θJL 25 ℃/ W 600 800 1000 V50 100 200 400 Maximum average forward rectified current I F(AV) 420 560 700 V Maximum DC blocking voltage V DC 600 800 1000 V Maximum RMS voltage V RMS 35 70 140 280 S2J S2K S2M UNIT Maximum repetitive peak reverse voltage V RRM 50 100 200 400 Items Symbol S2A S2B S2D S2G pFTypical junction capacitance 4.0 V ,1MHz C J - 30.0 - DO-214AC(SMA) Dimensions in inches and (millimeters)
http://www.trr-jx.comversion: 02 Characteristic Curves A =25 ℃ unless otherwise noted) S2A~S2M Surface Mount Standard Rectifiers