S2A_16 TMT | Alldatasheet

Document overview

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Technical content

  • Glass passivated chip junction - Ideal for automated placement - Low forward voltage drop - High surge current capability - Halogen-free according to IEC 61249-2-21 Molding compound: UL flammability classification rating 94V-0 Part no. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test V RRM 50 100 200 400 600 800 1000 1200 1400 V VRMS 35 70 140 280 420 560 700 840 980 V VDC 50 100 200 400 600 800 1000 1200 1400 V IF(AV) A trr μs CJ pF TJ °C TSTG °C Document Number: DS_D1410014 Version: K15 S2B S2K S2M Maximum reverse current @ rated VR TJ=25°C TJ=125°C Taiwan Semiconductor 2A, 50V - 1400V Surface Mount Rectifiers

FEATURES

Moisture sensitivity level: level 1, per J-STD-020 - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC S2D S2V S2QS2G MECHANICAL DATA Case: DO-214AA (SMB) Polarity: Indicated by cathode band Weight: 0.09 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) S2J Maximum DC blocking voltage Maximum average forward rectified current Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM UNIT Maximum repetitive peak reverse voltage Maximum RMS voltage PARAMETER SYMBOL S2A Typical junction capacitance (Note 3) A Maximum instantaneous forward voltage (Note 1) @ 2 A VF V IR μA Note 3: Measured at 1 MHz and applied reverse coltage of 4.0V DC. Typical thermal resistance RθJL RθJA °C/W Operating junction temperature range Storage temperature range Note 1: Pulse test with PW=300μs, 1% duty cycle Note 2: Reverse recovery test conditions: I F=0.5A, IR=1.0A, IRR=0.25A Typical reverse recovery time (Note 2) - 55 to +150 - 55 to +150 DO-214AA (SMB) 1.5 125 1.15

PART NO. *: Optional available PART NO. (TA=25°C unless otherwise noted) Document Number: DS_D1410014 Version: K15 H AEC-Q101 qualified Green compoundS2MHR5G S2M H R5 G Note 1: "x" defines voltage from 50V (S2A) to 1400V (S2V) EXAMPLE EXAMPLE PART NO. PART NO. SUFFIX PACKING CODE PACKING CODE SUFFIX DESCRIPTION G SMB 850 / 7" Plastic reel R4 SMB 3,000 / 13" Paper reel M4 SMB 3,000 / 13" Plastic reel RATINGS AND CHARACTERISTICS CURVES S2A - S2V Taiwan Semiconductor

ORDERING INFORMATION

PART NO. SUFFIX PACKING CODE PACKING CODE SUFFIX (*) PACKAGE PACKING S2x (Note 1) 0.5 1.5 2.5 0 2 04 06 08 0 1 0 0 1 2 0 1 4 0 1 6 0 AVERAGE FORWARD CURRENT (A) LEAD TEMPERATURE (°C) FIG.1 FORWARD CURRENT DERATING CURVE Resistive or inductive load 100 11 0 1 0 0 PEAK FORWARD SURGE URRENT (A) NUMBER OF CYCLES AT 60 Hz FIG. 3 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 8.3ms single half sine wave 0.01 0.1 0 2 04 06 08 0 1 0 0 INSTANTANEOUS REVERSE CURRENT (μA) PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FIG. 2 TYPICAL REVERSE CHARACTERISTICS TJ=125°C TJ=25°C TJ=75°C 0.1 INSTANTANEOUS FORWARD CURRENT (A) FORWARD VOLTAGE (V) FIG. 4 TYPICAL FORWARD CHARACTERISTICS Pulse width=300μs 1% duty cycle TJ=125°C TJ=25°C

A 1.95 2.10 0.077 0.083 B 4.25 4.75 0.167 0.187 C 3.48 3.73 0.137 0.147 D 1.99 2.61 0.078 0.103 E 0.90 1.41 0.035 0.056 F 5.10 5.30 0.201 0.209 G 0.10 0.20 0.004 0.008 H 0.15 0.31 0.006 0.012 P/N = Specific Device Code G = Green Compound YW = Date Code F = Factory Code Document Number: DS_D1410014 Version: K15 S2A - S2V Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DIM. Unit (mm) Unit (inch) DO-214AA (SMB) SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 2.3 0.091 B 2.5 0.098 C 4.3 0.169 MARKING DIAGRAM D 1.8 0.071 E 6.8 0.268 100 0.1 1 10 100 CAPACITANCE (pF) REVERSE VOLTAGE (V) FIG. 5 TYPICAL JUNCTION CAPACITANCE f=1.0MHz Vsig=50mVp-p

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