S255N100K502CT

S242N100J502CT WALSIN | Alldatasheet

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Multilayer Ceramic Capacitors Approval Sheet Page 1 of 11 ASC Safety Certified X1/Y2_(S2)_010X_AS May. 2019 *Contents in this sheet are subject to change without prior notice. MULTILAYER CERAMIC CAPACITORS Safety Certified X1/Y2, S2 Series 1808 to 2220 Sizes NP0 & X7R Dielectrics Halogen Free & RoHS Compliance

Multilayer Ceramic Capacitors Approval Sheet Page 2 of 11 ASC Safety Certified X1/Y2_(S2)_010X_AS May. 2019 1. DESCRIPTION WTC’s SAFETY CERTIFIED CAPACITORS are designed for surge or lightning immunity in modem facsimile and other equipments. The capacitors of series S2 are class X1/Y2 compliant respectively. The green type capacitors in S2 and S3 series are manufactured by using environmentally friendly materials without lead or cadmium. The terminations are composed of plated nickel and pure tin to feature the superior leaching resistance during soldering. 4. HOW TO ORDER S2 42 N 100 J 502 C T Series S2=X1/Y2 Safety Certified Size 42 =1808 (4520) 43 =1812 (4532) 52 =2211 (5728) 55 =2220 (5750) Dielectric N =NP0 B =X7R Capacitance Two significant digits followed by no. of zeros. And R is in place of decimal point. eg.: 0R5=0.5pF 1R0=1.0pF 100=10x10 =10pF Tolerance D = ±0.5pF F= ±1.0% G = ±2.0% J= ±5.0% K = ±10% M = ±20% Rated voltage Two significant digits followed by no. of zeros. And R is in place of decimal point. 502: 5000V Impulse Voltage 602: 6000V Impulse Voltage Termination C =Cu/Ni/Sn Packaging T=7” reeled G =13” reeled 2. FEATURES a. High reliability and stability. b. Small size and high capacitance c. RoHS compliant d. Safety standard approval by EN 60384-14 : 2013 IEC 60384-14 : 2013 UL 60384-14 (Ed 2.0) e. Certificate number: TUV: R50195920, TUV: R50381780 UL: E182369 f. HALOGEN compliant. 3. APPLICATIONS a. Modem. b. Facsimile. c. Telephone. d. Other electronic equipment for lighting or surge protection and isolation

Multilayer Ceramic Capacitors Approval Sheet Page 3 of 11 ASC Safety Certified X1/Y2_(S2)_010X_AS May. 2019 5. EXTERNAL DIMENSIONS & STRUCTURE 6. GENERAL ELECTRICAL DATA Dielectric NP0 X7R Size 1808, 1812, 2211 1808, 1812, 2211, 2220 Capacitance 3pF to 680pF 100pF to 4700pF Capacitance tolerance Cap.<10pF: D (±0.5pF) K (±10%), M (±20%) Rated voltage (WVAC) 250Vac Q/ DF(Tan δ) Cap<30pF: Q ≥400+20C Cap ≥30pF: Q ≥1000 DF ≤2.5% Insulation resistance at Ur ≥10G Ω Peak impulse voltage 5000V ~ 6000V Operating temperature -55 to +125° C Capacitance characteristic ±30ppm/° C ±15% Termination Ni/Sn (lead-free termination) Certified number TUV: R50195920, TUV: R50381780, UL: E182369 Test standard EN 60384-14 : 2013, IEC 60384-14 : 2013, UL 60384-14 (Ed 2.0) * X7R: Apply 1.0±0.2Vrms, 1.0kHz±10%, at 25° C ambient temperature. 7. PACKAGE DIMENSION AND QUANTITY Size Thickness (mm)/Symbol Plastic tape 7” reel 13” reel 1808 (4520) 1.40±0.15 F 2k - 1.60 ±0.20 G 2k 8k 2.00±0.20 K 1k 6k 1812 (4532) 1.25 ±0.10 D 1k - 1.60 ±0.20 G 1k 2.00±0.20 K 1k - 2.50±0.30 M 0.5k 3k 2211 (5728) 1.60±0.20 G 1k - 2.00±0.20 K 1k - 2.50±0.30 M 0.5k - 2.80±0.30 U 0.5k - 2220 (5750) 2.00±0.20 K 1k - 2.50±0.30 M 0.5k 2k Unit: pieces T W L MB MBCP Fig. 1 The outline of MLCC Size Inch (mm) L (mm) W (mm) T (mm) CP (mm) M B (mm) 1.25±0.10 (D) 1.40±0.15 (F) 1.60±0.20 (G) 2.00±0.20 (K) 2.50±0.30 (M) 2.80±0.30 (U) ≥3.5 0.50±0.25 # Reflow soldering only is recommended.

Multilayer Ceramic Capacitors Approval Sheet Page 4 of 11 ASC Safety Certified X1/Y2_(S2)_010X_AS May. 2019 8. CAPACITANCE RANGE DIELECTRIC NP0 SIZE 1808 1812 2211 2211 PEAK IMPULSE VOLTAGE 5000 6000 Certificated TUV IEC60384-14 UL 60384 TUV IEC60384-14 UL 60384 TUV IEC60384-14 UL 60384 TUV IEC60384-14 UL 60384 Capacitance 3.0pF (3R0) F F 3.3pF (3R3) F F 3.9pF (3R9) F F 4.0pF (4R0) F F K K K K 4.7pF (4R7) F F K K K K 5.0pF (5R0) F F K K K K 5.6pF (5R6) F F K K K K 6.0pF (6R0) F F K K K K 6.8pF (6R8) F F K K K K 7.0pF (7R0) F F K K K K 8.0pF (8R0) F F K K K K 8.2pF (8R2) F F K K K K 9.0pF (9R0) F F K K 10pF (100) F F D D K K K K 12pF (120) F F D D K K K K 15pF (150) F F D D K K K K 18pF (180) F D D K K K K 22pF (220) F F D D K K K K 27pF (270) F F D D K K K K 33pF (330) F F D D K K K K 39pF (390) G G D D K K K K 47pF (470) G G D D K K K K 56pF (560) G G D D K K K K 68pF (680) G G D D K K M M 82pF (820) G G D D K K M M 100pF (101) K K D D K K U U 120pF (121) K K D D M M 130pF (131) K K D D M 150pF (151) K K D D M M 160pF (161) K K D D M M 180pF (181) K K D D M M 220pF (221) K K K K M M 270pF (271) K K K K M M 300pF (301) K K M 330pF (331) K K M M 390pF (391) K K M M 470pF (471) K K M M 560pF (561) M M 680pF (681) M M 720pF (721) 1. The letter in cell is expressed the symbol of product thickness. 2. For more information about products with special capacitance or other data, please contact WTC local representative.

Multilayer Ceramic Capacitors Approval Sheet Page 5 of 11 ASC Safety Certified X1/Y2_(S2)_010X_AS May. 2019 1. The letter in cell is expressed the symbol of product thickness. 2. For more information about products with special capacitance or other data, please contact WTC local representative. DIELECTRIC X7R SIZE 1808 1812 2211 2220 PEAK IMPULSE VOLTAGE 5000 Certificated TUV IEC60384-14 UL 60384 TUV IEC60384-14 UL 60384 TUV IEC60384-14 UL 60384 TUV IEC60384-14 UL 60384 Capacitance 100pF (101) G G 120pF (121) G G 130pF (131) G G G 150pF (151) G G G G G G 160pF (161) G G G K K 180pF (181) G G G G G G K K 220pF (221) G G G G G G K K 270pF (271) K K G G G G K K 300pF (301) K G G K 330pF (331) K K G G G G K K 390pF (391) K K G G G G K K 470pF (471) K K G G K K K K 560pF (561) K K G G K K K K 680pF (681) K K K K K K K K 720pF (721) K K K K K 820pF (821) K K K K K K K K 1,000pF (102) K K M M M M K K 1,200pF (122) M M M M 1,500pF (152) M M M M 1,800pF (182) M M M M 2,200pF (222) M M M M 2,700pF (272) M M 3,300pF (332) M M 3,900pF (392) M M 4,700pF (472) M M

Multilayer Ceramic Capacitors Approval Sheet Page 6 of 11 ASC Safety Certified X1/Y2_(S2)_010X_AS May. 2019 9. RELIABILITY TEST CONDITIONS AND REQUIREMENTS No. Item Standard Method Test Condition Requirements 1. Visual examination and Dimensions IEC 60384-1 4.1 * No remarkable defect. * Dimensions to confirm to individual specification sheet. 2. Capacitance IEC 60384-1 4.2.2 * Class I : (C0G) Cap. ≤1000pF, 1.0±0.2Vrms, 1MHz±10%. Cap.>1000pF, 1.0±0.2Vrms, 1KHz±10%. * Class II : (X7R) 1.0±0.2Vrms, 1KHz±10%. * Capacitance is within specified tolerance. * C R means rated capacitance for conform to the E6 series of preferred values given in IEC 60063. 3. D.F. (Dissipation Factor) Tangent of loos angle IEC 60384-1 4.2.3 Dielectric Q/D.F. Remark Class I (C0G) Q ≥1000 Cap. ≥30pF Q ≥400+20C Cap.<30pF Class II (X7R) D.F. ≤2.5% 4. Temperature Coefficient IEC 60384-21/22 4.6 With no electrical load. T.C. Operating Temp C0G(NP0) -55~125° C at 25° C X7R -55~125° C at 25° C T.C. Capacitance Change C0G(NP0) Within ±30ppm/ ℃ X7R Within ±15% 5. Voltage proof (Dielectric Strength) IEC 60384-14 4.2.1 * To apply voltage : X Capacitor : 1075Vdc (4.3U R ). Y Capacitor : 1500Vac. * Duration : 60 sec. * The charge current shall not exceed 0.05A. * The voltage shall be raised from the near zero to the test voltage a rate not exceeding 150V(r.m.s.)/sec. * No evidence of damage or flash over during test. 6. Insulation Resistance IEC 60384 -21/22 4.5.3 Rated Vol.(V) Apply Voltage Charge Current Charge Time >500 500Vdc ≤50mA 60 sec. Dielectric Requirements Class I (C0G) ≥100G Ω or RxC ≥1000 Ω-F, whichever is smaller Class II (X7R) ≥10G Ω or RxC ≥500 Ω-F, whichever is smaller Solderability IEC 60384 -21/22 4.10 * Solder temperature: 235±5° C(0201~1210). * Solder temperature: 245±5° C(1808~2225). * Dipping time : 2±0.5 sec. * 75% min. coverage of all metalized area. 8. Resistance to Soldering Heat IEC 60384-14 4.4 IEC 60384-21/22 4.9 * Solder temperature : 260±5° C. * Dipping time : 10±1 sec. * Preheating : 120 to 150° C for 1 minute before immerse the capacitor in a eutectic solder. * Measurement to be made after keeping at room temperature for 24±2 hrs. Class I (C0G) ≥1G Ω Within ±2.5% or ±0.25pF, whichever is larger ≤100% of initial requireme nt Class II (X7R) ≥1G Ω Within ±7.5% 9. Temperature Cycle IEC 60384-21/22 4.11 * Conduct the five cycles according to the temperatures and time. Step Temp.(° C) Time(min.) 1 Min. operating temp. +0/-3 30±3 2 Room temp. 2~3 3 Max.operating temp. +3/-0 30±3 4 Room temp. 2~3 * Measurement to be made after keeping at room temperature for 24±2 hrs. Class I (C0G) To meet initial require ment Within ±2.5% or ±0.25pF, whichever is larger ≤1.0(Q) × initial requirement Class II (X7R) Within ±7.5% ≤1.5(D.F.) × initial requirement

Multilayer Ceramic Capacitors Approval Sheet Page 7 of 11 ASC Safety Certified X1/Y2_(S2)_010X_AS May. 2019 No. Item Standard Method Test Condition Requirements 10. Humidity (Damp Heat) Steady State IEC 60384-14 4.12 * Test temp. : 40±2° C. * Humidity : 90~95% RH. * Test time : 500 +24/-0hrs. * Applied voltage : 250Vac. * Measurement to be made after keeping at room temp. for 24±2 hrs (Class I) and 48±4 hrs (Class II). * No remarkable damage. Dielectr Class I (C0G) ≥1G Ω or RxC ≥ 25 Ω-F, whichever is smaller Within ±3.0% or ±2pF, whichever is larger ≤0.25% Class II (X7R) Within ±15% ≤2.0(D.F.) × initial requireme nt 11. Passive Flammability IEC 60384-14 4.17 IEC 60384-1 4.38 * Volume sample: 21.56 mm 3 * Flame exposure time: 5 sec Max. * Category of flammability : C. * Capacitor didn’t burn at all. 12. Active Flammability IEC 60384-21/22 4.18 * The capacitors applied UR (250Vac). Then each sample shall be subjected to 20 discharges from a tank capacitor, charge to a voltage that, when discharged, plase Ui 2500V for X1Y2 across the capacitor under test. The interval between successive discharges shall be 5 sec. * The cheese cloth shall not burn with a flame. 13. High Temperature Load (Endurance) IEC 60384-14 4.14 * Impulse Voltage : Each individual capacitor shall be subjected to a Vp = 5.0KV (X1Y2 Class Impulse 5KV) & Vp = 6.0KV (X1Y2 Class Impulse 6KV) impulse for three times before applied to endurance test. * Test temp. : 125±3° C. * Test time: 1000 +48/-0 hrs. * Applied voltage : X capacitor: 1.25UR (312.5Vac). Y capacitor: 1.70UR (425Vac). Once every hour the voltage shall be increased to 1000Vrms for 0.1 sec. * Measurement to be made after keeping at room temp. for 24±2 hrs (Class I) and 48±4 hrs (Class II). * Appearance : No mechanical damage. * Cap. change : C0G within ±5% or ±0.5pF, whichever is larger. X7R within ±20%. * D.F. value : C0G ≤0.25%. X7R ≤5.0%. * I.R. ≥1G Ω. * Dielectric strength satisfies the specified initial value. 14. Resistance to Flexure of Substrate IEC 60384-21/22 4.8 * Capacitors mounted on a substrate. The board shall be bent 1mm with a rate of 1mm/sec. * No remarkable damage. Dielectric Cap. Change Class I (C0G) Within ±3.0% or ±2pF, whichever is larger Class II (X7R) Within ±12.5% (This capacitance change means the change of capacitance under specified flexure of substrate from the capacitance measured before the test) R = 230 45 ±1 45 ±1 1mm

Multilayer Ceramic Capacitors Approval Sheet Page 8 of 11 ASC Safety Certified X1/Y2_(S2)_010X_AS May. 2019 No. Item Standard Method Test Condition Requirements 15. Adhesive Strength of Termination IEC 60384-21/22 4.15 IEC 60384-1 4.13 * Capacitors mounted on a substrate. A force of 10N applied perpendicular to the place of substrate and parallel the line joining the center of terminations for 10±1 sec. * No remarkable damage or removal of the terminations. 16. Vibration IEC 60384-1 4.17 * Reflow solder the capacitors on P . C. Board before test. * Vibration frequency : 10~55 Hz/min. * Total amplitude : 1.5mm. * Repeat the conditions for 2 hours each in 3 perpendicular directions. * No remarkable damage. * Cap. change and Q/D.F. : To meet initial spec. 17. Impulse Voltage IEC 60384-14 4.13 * X1 : 4.0KV * Y2 : 5.0KV. * Number of impulse : 24 max. * There shall be no permanent breakdown or flashover.

Multilayer Ceramic Capacitors Approval Sheet Page 9 of 11 ASC Safety Certified X1/Y2_(S2)_010X_AS May. 2019 EMBOSSED TAPE DIMENSIONS Size 1808 1812 2211 2220 Chip Thickness 1.25 ±± ±±0.10 1.40 ±± ±±0.15 1.60 ±± ±±0.20 2.00 ±± ±±0.20 1.25 ±± ±±0.10 1.60 ±± ±±0.20 2.00 ±± ±±0.20 2.00 ±± ±±0.20 2.50 ±± ±±0.30 Size 1808, 1812, 2211, 2220 Reel size 7” 13” Fig. 3 The dimension of reel Fig. 2 The dimension of plastic tape

Multilayer Ceramic Capacitors Approval Sheet Page 10 of 11 ASC Safety Certified X1/Y2_(S2)_010X_AS May. 2019 APPLICATION NOTES ◙ Storage To prevent the damage of solderability of terminations, the following storage conditions are recommended: Indoors under 5 ~ 40° C and 20% ~ 70% RH. No harmful gases containing sulfuric acid, ammonia, hydrogen sulfide or chlorine. Packaging should not be opened until the capacitors are required for use. If opened, the pack should be re-sealed as soon as is practicable. Taped product should be stored out of direct sunlight, which might promote deterioration in tape or adhesion performance. The product is recommended to be used within 12 months after shipment and checked the solderability before use. ◙ Handling Chip capacitors are dense, hard, brittle, and abrasive materials. They are liable to suffer mechanical damage, in the form of cracks or chips. Chip Capacitors should be handled with care to avoid contamination or damage. To use vacuum or plastic tweezers to pick up or plastic tweezers is recommended for manual placement. Tape and reeled packages are suitable for automatic pick and placement machine. ◙ Preheat In order to minimize the risk of thermal shock during soldering, a carefully controlled preheat is required. The rate of preheat should not exceed 3° C per second. ◙ Soldering Use middy activated rosin RA and RMA fluxes do not use activated flux. The amount of solder in each solder joint should be controlled to prevent the damage of chip capacitors caused by the stress between solder, chips, and substrate. a.) Hand soldering : Fig. 4.1 Hand Soldering Profile Chip Size Pre-Heat temp. ∆T Max. soldering iron temp. ≤1206 ≥150° C ≤150° C ≤350° C 1210~2225 ≥150° C ≤130° C ≤280° C * Soldering iron tip diameter ≤1.0 mm and wattage max. 20W. * The Capacitors shall be pre-heated and that the temperature gradient between the devices and the tip of the soldering iron. * The required amount of solder shall be melted on the soldering tip. * The tip of iron should not contact the ceramic body directly. * The Capacitors shall be cooled gradually at room temperature after soldering. * Forced air cooling is not allowed.

Multilayer Ceramic Capacitors Approval Sheet Page 11 of 11 ASC Safety Certified X1/Y2_(S2)_010X_AS May. 2019 b.) Reflow soldering : Fig. 4.2 Reflow soldering profile For Sn/Ag/Cu Series solder paste (Pb-Free) ◙ Cooling After soldering, cool the chips and the substrate gradually to room temperature. Natural cooling in air is recommended to minimize stress in the solder joint. ◙ Cleaning All flux residues must be removed by using suitable electronic-grade vapor-cleaning solvents to eliminate contamination that could cause electrolytic surface corrosion. Good results can be obtained by using ultrasonic cleaning of the solvent. The choice of the proper system is depends upon many factors such as component mix, flux, and solder paste and assembly method. The ability of the cleaning system to remove flux residues and contamination from under the chips is very important.