S1ZA20 SHINDENGEN | Alldatasheet

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200V 1.1A Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd OUTLINE DIMENSIONS RATINGS SHINDENGEN Case : 1Z iUnit : mm Dual œSmall SMT package œArray œHigh reliability with superior moisture resistance œApplicable to Automatic Insertion

FEATURES

œConventional Rectification œMotor œHome Appliances, Office Equipment œTelecommunication, Factory Automation APPLICATION General Purpose Rectifiers œAbsolute Maximum Ratings (If not specified Tl=25Ž) Item Symbol Conditions RatingsUnit Storage TemperatureTstg -40\`150Ž Operating Junction TemperatureTj 150 Ž Maximum Reverse VoltageVRM 200 V 50Hz sine wave, R-load Ta=25Ž On alumina substrate 1 element operation1.1 Average Rectified Forward CurrentIO 50Hz sine wave, R-load Ta=25Ž On alumina substrate 2 element operation0.8 A 50Hz sine wave, R-load Ta=25Ž On glass-epoxy substrate 1 element operation0.9 50Hz sine wave, R-load Ta=25Ž On glass-epoxy substrate 2 element operation0.63 Peak Surge Forward CurrentIFSM 50Hz sine wave, Non-repetitive 1cycle peak value, Tj=25Ž30 A œElectrical Characteristics (If not specified Tl=25Ž) Item Symbol Conditions RatingsUnit Forward Voltage VF IF=0.9A, Pulse measurement, Rating of per diodeMax.1.1 V Reverse Current IR VR=VRM , Pulse measurement, Rating of per diodeMax.10 ƒÊA junction to ambient On alumina substrate 1 element operationMax.93 Thermal Resistance ƒÆjajunction to ambient On alumina substrate 2 element operationMax.140Ž/W junction to ambient On glass-epoxy substrate 1 element operationMax.120 junction to ambient On glass-epoxy substrate 2 element operationMax.186

0.01 0.1 S1ZAx Tl=150°C [TYP] Tl=25°C [TYP] Pulse measurement per diode Forward Voltage V F [V] Forward Current I F [A]

0.4 0.8 1.2 1.6 S1ZAx Forward Power Dissipation Tj= 150°C Sine wave Average Rectified Forward Current I O [A] Forward Power Dissipation P F [W]

0.2 0.4 0.6 0.8 1.2 1.4 0 20 40 60 80 100 120 140 160 S1ZAx Derating Curve Sine wave R-load Free in air (Alumina substrate) 1-circuit current 2-circuit current (Glass-epoxy substrate) 1-circuit current 2-circuit current Alumina substrate Soldering land 1mm φ Conductor layer 20 µm Substrate thickness 0.64mm Glass-epoxy substrate Soldering land 1mm φ Conductor layer 35 µm Ambient Temperature Ta [ °C] Average Rectified Forward Current I O [A] PCB

Peak Surge Forward Capability 1 10 100 S1ZAx 2 5 20 50 IFSM 10ms 10ms 1 cycle Number of Cycles [cycles] Peak Surge Forward Current I FSM [A] non-repetitive, sine wave, Tj=25°C before surge current is applied