S1AL_16 TMT | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
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Technical content

  • Glass passivated junction chip - Ideal for automated placement - Low-Profile Package - Low power loss, high efficiency - Halogen-free according to IEC 61249-2-21 definition Molding compound, UL flammability classification rating 94V-0 Part No. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test 1AL 1BL 1DL 1GL 1JL 1KL 1ML V RRM 50 100 200 400 600 800 1000 V VRMS 35 70 140 280 420 560 700 V VDC 50 100 200 400 600 800 1000 V IF(AV) A CJ pF trr μs TJ °C TSTG °C Document Number: DS_D1410010 Version: O15 S1AL - S1ML Taiwan Semiconductor 1A, 50V - 1000V Surface Mount Rectifier

FEATURES

  • Moisture sensitivity level: level 1, per J-STD-020 S1AL S1BL S1DL S1GL S1JL - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC MECHANICAL DATA Case: Sub SMA Sub SMA S1KL S1ML UNIT Marking code Maximum repetitive peak reverse voltage Polarity: Indicated by cathode band Weight: 0.019 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER SYMBOL Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current 1 Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load I FSM 30 IR μA A Maximum instantaneous forward voltage (Note 1) @ 1 A VF V Maximum reverse current @ rated VR TJ=25°C TJ=125°C Note 1: Pulse test with PW=300μs, 1% duty cycle - 55 to +175 Typical junction capacitance (Note 2) 9 Typical thermal resistance RθJL RθJA °C/W25 Note 2: Measured at 1 MHz and Applied VR=4.0 Volts. Note 3: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A 1.1 Typical reverse recovery time (Note 3) 1.8 Operating junction temperature range Storage temperature range - 55 to +175

PART NO. PART NO. Document Number: DS_D1410010 Version: O15 AEC-Q101 qualified Green compoundS1MLHRUG S1ML H RU G Note 1: "x" defines voltage from 50V (S1AL) to 1000V (S1ML) EXAMPLE PREFERRED PART NO. PART NO. SUFFIX PACKING CODE PACKING CODE SUFFIX

DESCRIPTION

RH Sub SMA 10,000 / 13" Paper reel (12mm tape) MH Sub SMA 10,000 / 13" Plastic reel (12mm tape) R2 Sub SMA 7,500 / 13" Paper reel (12mm tape) M2 Sub SMA 7,500 / 13" Plastic reel (12mm tape) R3 Sub SMA 1,800 / 7" Plastic reel (12mm tape) RF Sub SMA 3,000 / 7" Plastic reel (12mm tape) RQ Sub SMA 10,000 / 13" Paper reel (8mm tape) MQ Sub SMA 10,000 / 13" Plastic reel (8mm tape) 3,000 / 7" Plastic reel (8mm tape) RT Sub SMA 7,500 / 13" Paper reel (8mm tape) MT Sub SMA 7,500 / 13" Plastic reel (8mm tape) PACKAGE PACKING S1xL (Note 1) H RU G Sub SMA 1,800 / 7" Plastic reel (8mm tape) RV Sub SMA RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) Taiwan Semiconductor S1AL - S1ML

ORDERING INFORMATION

PART NO. SUFFIX PACKING CODE PACKING CODE SUFFIX 0.2 0.4 0.6 0.8 1.2 0 25 50 75 100 125 150 175 AVERAGE FORWARD CURRENT (A) LEAD TEMPERATURE (°C) FIG.1- MAXIMUM FORWARD CURRENT DERATING CURVE 100 1 10 100 PEAK FORWARD SURGE CURRENT (A) NUMBER OF CYCLES AT 60 Hz FIG. 3- MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 8.3ms Single Half Sine Wave 0.001 0.01 0.1 100 0 20 40 60 80 100 120 140 INSTANTANEOUS REVERSE CURRENT (μA) PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FIG. 2- TYPICAL REVERSE CHARACTERISTICS TJ=125°C TJ=75°C TJ=25°C 0.01 0.1 100 INSTANTANEOUS FORWARD CURRENT (A) FORWARD VOLTAGE (V) FIG. 4- TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS

B 1.70 1.90 0.067 0.075 C 2.70 2.90 0.106 0.114 D 0.16 0.30 0.006 0.012 E 1.23 1.43 0.048 0.056 F 0.80 1.20 0.031 0.047 G 3.40 3.80 0.134 0.150 H 2.45 2.60 0.096 0.102 I 0.35 0.85 0.014 0.033 J 0.00 0.10 0.000 0.004 P/N = Marking Code G = Green compound Code YW = Date Code F = Factory Code Document Number: DS_D1410010 Version: O15 MARKING DIAGRAM S1AL - S1ML Taiwan Semiconductor C3 . 1 D PACKAGE OUTLINE DIMENSIONS DIM. Unit (mm) Unit (inch) 0.169 1.9 E4 . 3 SUGGESTED PAD LAYOUT A1 . 4 B1 . 2 Symbol Sub SMA Unit (inch) 0.055 0.047 0.122 0.075 Unit (mm) 100 0.01 0.1 1 10 100 JUNCTION CAPACITANCE (pF) REVERSE VOLTAGE (V) FIG. 5- TYPICAL JUNCTION CAPACITANCE f=1.0MHz Vsig=50mVp-p

assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1410010 Version: O15 S1AL - S1ML Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,