S1A_16 TMT | Alldatasheet

Document overview

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Technical content

  • Glass passivated chip junction - Ideal for automated placement - Low forward voltage drop - High surge current capability - Halogen-free according to IEC 61249-2-21 definition Molding compound, UL flammability classification rating 94V-0 Part no. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test V RRM 50 100 200 400 600 800 1000 V VRMS 35 70 140 280 420 560 700 V VDC 50 100 200 400 600 800 1000 V IF(AV) A trr μs CJ pF TJ °C TSTG °C Document Number: DS_D1411068 Version: R15 A Maximum RMS voltage Weight: 0.06 g (approximately) Maximum average forward rectified current 1 Maximum reverse current @ rated VR TJ=25°C TJ=125°C Maximum repetitive peak reverse voltage S1M UNIT DO-214AC (SMA)Case: DO-214AC (SMA) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER Polarity: Indicated by cathode band S1G S1JS1D Non-repetitive peak reverse avalanche energy at 25°C, IAS=1A, L=10mH 1.5 S1A - S1M 1A, 50V - 1000V Surface Mount Rectifiers

FEATURES

Moisture sensitivity level: level 1, per J-STD-020 S1K - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC MECHANICAL DATA Maximum DC blocking voltage Typical reverse recovery time (Note 2) SYMBOL S1A S1B Taiwan Semiconductor 40 30 1.1 Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM Maximum instantaneous forward voltage (Note 1) @ 1 A VF Typical junction capacitance (Note 3) Operating junction temperature range Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A Typical thermal resistance RθJL RθJA ERSM 5 - 55 to +175 Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C. Note 1: Pulse test with PW=300μs, 1% duty cycle V IR μA mJ Storage temperature range - 55 to +175 °C/W

PART NO. PART NO. Document Number: DS_D1411068 Version: R15 H RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) S1A - S1M Taiwan Semiconductor

ORDERING INFORMATION

PART NO. SUFFIX PACKING CODE PACKING CODE SUFFIX PACKAGE PACKING S1x (Note 1) G SMA 1,800 / 7" Plastic reel R2 SMA 7,500 / 13" Paper reel M2 SMA 7,500 / 13" Plastic reel F3 Folded SMA 1,800 / 7" Plastic reel F2 Folded SMA 7,500 / 13" Paper reel F4 Folded SMA 7,500 / 13" Plastic reel E3 Clip SMA 1,800 / 7" Plastic reel E2 Clip SMA 7,500 / 13" Plastic reel Note 1: "x" defines voltage from 50V (S1A) to 1000V (S1M) EXAMPLE PREFERRED PART NO. PART NO. SUFFIX PACKING CODE PACKING CODE SUFFIX

DESCRIPTION

Green compoundS1MHR3G S1M H R3 G 0.2 0.4 0.6 0.8 1.2 0 2 55 07 5 1 0 0 1 2 5 1 5 0 1 7 5 AVERAGE FORWARD CURRENT (A) LEAD TEMPERATURE (°C) FIG.1 FORWARD CURRENT DERATING CURVE RESISTIVE OR INDUCTIVE LOAD 100 1 10 100 PEAK FORWARD SURGE URRENT(A) NUMBER OF CYCLES AT 60 Hz FIG. 3 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 8.3ms Single Half Sine Wave S1A-S1K S1M 0.001 0.01 0.1 100 0 20 40 60 80 100 120 140 INSTANTANEOUS REVERSE CURRENT (μA) PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FIG. 2 TYPICAL REVERSE CHARACTERISTICS TJ=125°C TJ=75°C TJ=25°C 0.1 100 INSTANTANEOUS FORWARD CURRENT (A) FORWARD VOLTAGE (V) FIG. 4 TYPICAL FORWARD CHARACTERISTICS Pulse Width=300μs 1% Duty Cycle

A 1.27 1.58 0.050 0.062 B 4.06 4.60 0.160 0.181 C 2.29 2.83 0.090 0.111 D 1.99 2.50 0.078 0.098 E 0.90 1.41 0.035 0.056 F 4.95 5.33 0.195 0.210 G 0.10 0.20 0.004 0.008 H 0.15 0.31 0.006 0.012 P/N = Specific Device Code G = Green Compound YW = Date Code F = Factory Code Document Number: DS_D1411068 Version: R15 S1A - S1M Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DIM. Unit (mm) Unit (inch) DO-214AC (SMA) SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 1.68 0.066 B 1.52 0.060 C 3.93 0.155 MARKING DIAGRAM D 2.41 0.095 E 5.45 0.215 100 0.01 0.1 1 10 100 CAPACITANCE (pF) REVERSE VOLTAGE (V) FIG. 5 TYPICAL JUNCTION CAPACITANCE f=1.0MHz Vsig=50mVp-p

assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1411068 Version: R15 S1A - S1M Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,