S1AB_16 TMT | Alldatasheet
Document overview
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Technical content
FEATURES
- Glass passivated chip junction - Ideal for automated placement - Low forward voltage drop - High surge current capability - Halogen-free according to IEC 61249-2-21 MECHANICAL DATA Case: DO-214AA (SMB) Molding compound, UL flammability classification rating 94V-0 Moisture sensitivity level: level 1, per J-STD-020 Part no. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.09 g (approximately) V RRM 50 100 200 400 600 800 1000 V VRMS 35 70 140 280 420 560 700 V VDC 50 100 200 400 600 800 1000 V IF(AV) A CJ pF RθJL °C/W TJ °C TSTG °C Note 1: Pulse test with PW=300μs, 1% duty cycle Note 2: Measured at 1 MHz and applied reverse voltage of 4.0V DC. Version: G1511 DB GB Taiwan Semiconductor 1A, 50V - 1000V Surface Mount Rectifiers - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC DO-214AA (SMB) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) JB KB MB UNIT Maximum repetitive peak reverse voltage Maximum RMS voltage PARAMETER SYMBOL S1 AB BB TJ=25°C IR 5 μA Maximum DC blocking voltage Maximum average forward rectified current 1 Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 30 TJ=125°C 50 Typical junction capacitance (Note 2) 12 A Maximum instantaneous forward voltage (Note 1) @ 1 A VF 1.1 V Maximum reverse current @ rated VR Typical thermal resistance 30 Operating junction temperature range - 55 to +150 Storage temperature range - 55 to +150
PART NO. *: Optional available PART NO. (TA=25°C unless otherwise noted) Version: G1511 S1AB - S1MB Taiwan Semiconductor
ORDERING INFORMATION
PART NO. SUFFIX PACKING CODE PACKING CODE SUFFIX (*) PACKAGE PACKING S1xB (Note 1) G SMB 850 / 7" Plastic reel R4 SMB 3,000 / 13" Paper reel M4 SMB 3,000 / 13" Plastic reel Note 1: "x" defines voltage from 50V (S1AB) to 1000V (S1MB) EXAMPLE EXAMPLE P/N PART NO. SUFFIX PACKING CODE PACKING CODE SUFFIX
DESCRIPTION
H RATINGS AND CHARACTERISTICS CURVES S1MBHR5G S1MB H R5 G AEC-Q101 qualified Green compound 0.2 0.4 0.6 0.8 1.2 0 2 55 07 5 1 0 0 1 2 5 1 5 0 AVERAGE FORWARD CURRENT (A) LEAD TEMPERATURE (°C) FIG.1 FORWARD CURRENT DERATING CURVE Resistive or inductive load 100 1 10 100 PEAK FORWARD SURGE URRENT (A) NUMBER OF CYCLES AT 60 Hz FIG. 3 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 8.3ms single half sine wave 0.001 0.01 0.1 0 20 40 60 80 100 120 140 INSTANTANEOUS REVERSE CURRENT (μA) PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FIG. 2 TYPICAL REVERSE CHARACTERISTICS TJ=25°C TJ=125°C TJ=75°C 0.1 100 INSTANTANEOUS FORWARD CURRENT (A) FORWARD VOLTAGE (V) FIG. 4 TYPICAL FORWARD CHARACTERISTICS Pulse width=300μs 1% duty cycle
A 1.95 2.10 0.077 0.083 B 4.25 4.75 0.167 0.187 C 3.48 3.73 0.137 0.147 D 1.99 2.61 0.078 0.103 E 0.90 1.41 0.035 0.056 F 5.10 5.30 0.201 0.209 G 0.10 0.20 0.004 0.008 H 0.15 0.31 0.006 0.012 P/N = Specific Device Code G = Green Compound YW = Date Code F = Factory Code Version: G1511 S1AB - S1MB Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DO-214AA (SMB) DIM. Unit (mm) Unit (inch) SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 2.3 0.091 B 2.5 0.098 C 4.3 0.169 MARKING DIAGRAM D 1.8 0.071 E 6.8 0.268 100 0.01 0.1 1 10 100 CAPACITANCE (pF) REVERSE VOLTAGE (V) FIG. 5 TYPICAL JUNCTION CAPACITANCE f=1.0MHz Vsig=50mVp-p
assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Version: G1511 S1AB - S1MB Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,