S1A DAESAN | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
Features
- For surface mounted applications
- Glass passivated junction Chip
- Low profile package
- Built-in strain relief, ideal for automated placement
- Plastic package has Underwrites Laboratory Flammability Classification 94V-0
- High temperature soldering guaranteed: 350℃/10 seconds, at terminals Maximum Ratings And Electrical Characteristics (Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive load. For capacitive load, derate by 20%) Maximum repetitive peak reverse voltage Operating and storage temperature range Maximum DC blocking voltage V Symbols Units A A Maximum reverse current at rated voltage V TA=25℃ TA=125℃ Items Mechanical Data
- Case : JEDEC SMA(DO-214AC) molded plastic body
- Terminals : Plated axial lead solderable per MIL-STD-750, method 2026
- Polarity : Color band denotes cathode end
- Mounting Position : Any
- Weight : 0.002 ounce, 0.064 gram VRRM μA Dimensions in inches and (millimeters) 1.1 -55 to +150 STANDARD RECTIFIER CURRENT 1.0 A VOLTAGE 50 to 1000 V IF(AV) TJ , TSTG Maximum average forward rectified current (See Fig.1) Maximum RMS voltage IFSM 1.0 VMaximum forward voltage @ IF=1.0A IR 5.0 Peak forward surge current 8.3ms half sing wave superimposed on rated load (JEDEC method) at T L=110℃ VRMS 100 100 200 140 200 400 280 400 600 420 600 VV DC VF Typical thermal resistance (Note 1) S1A S1B S1D S1G S1J RθJA RθJL 85 ℃/W ℃/W 800 560 800 1000 700 1000 S1K S1M Notes : (1) Thermal resistance from junction to ambient and from junction to lead mounted on 0.2×0.2"(5.0×5.0mm) copper pad areas (2) Reverse recovery test conditions:I F=0.5A, IR=1.0A, Irr=0.25A https://dec.co.krDAESAN ELECTRONIC CORP. DO-214AC (SMA) 0.006(0.152) 0.012(0.305) 0.194(4.93) 0.222(5.65) 0.078(1.98) 0.960(2.42) 0.157(3.99) 0.177(4.50) 0.100(2.54) 0.110(2.80) 0.008(0.203) MAX. 0.049(1.25) 0.067(1.70) 0.030(0.76) 0.060(1.52) A ll data sheet.com
FIG.1-FORWARD CURRENT DERATING CURVE LEAD TEMPERATURE (℃) AVERAGE FORWARD CURRENT (A) FIG.3-TYPICAL INSTANEOUS FORWARD CHARACTERISTICS INSTANTANEOUS FORWARD VOLTAGE (V) INSTANTANEOUS FORWARD CURRENT (A) FIG.2-MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT NUMBER OF CYCLES AT 60Hz PEAK FORWARD SURGE CURRENT (A) FIG.4-TYPICAL REVERSE CHARACTERISTICS PERCENT OF RATED PEAK REVERSE VOLTAGE (%) INSTANTANEOUS REVERSE CURRENT (μA) RATINGS AND CHARACTERISTIC CURVES S1A THRU S1M 1404020 60 16012080 1.0 0.8 0.6 0.4 0.2 0.6 0 20 100 0 10 100 0.8 1.2 1.6 2.0 FIG.5-TYPICAL JUNCTION CAPACITANCE REVERSE VOLTAGE (V) JUNCTION CAPACITANCE (pF) 0.01 0.1 1.0 10 100 100 40 60 80 100 0.1 0.01 0.001 100 1.0 0.1 0.01 TJ=25℃ Pulse width 300ms 1% duty cycle Resistive or inductive load Thick copper pad areas TJ=125℃ TJ=100℃ TJ=25℃ TL=110℃ 8.3ms Single half sine wave (JEDEC METHOD) TJ=25℃ f=1.0MHz Vsig=50m Vp-p FIG.6-TYPICAL TRANSIENT THERMAL IMPEDANCE t,PULSE DURATION,sec TRANSIENT THERMAL IMPEDANCE (℃/W) 0.01 0.1 1.0 10 100 1000 100 1.0 https://dec.co.krDAESAN ELECTRONIC CORP. A ll data sheet.com