S18753EJ1V0DS00_15 RENESAS | Alldatasheet
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- Manufacturer or author: NEC Electronics Corporation/NEC Electronics Corporation
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To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.
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The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. MOS INTEGRATED CIRCUIT μPD166104 DUAL N-CANNEL LOW SIDE INTELLIGENT POWER DEVICE Document No. S18753EJ1V0DS00 (1st edition) Date Published June 2007 NS Printed in Japan DATA SHEET 2007 The μPD166104 is a high voltage, dual output, and N-cannel low side intelligent power device with built-in overheat protection and overcurrent limitat ion circuits. It protects itself by shutti ng down or limiting curr ent when it detects overheat or overcurrent. Output MOS shut down is restarted automatically by cooling of the chip temperature.
FEATURES
- High voltage dual output low side driver Built-in overcurrent limitation circ uits and overheat protection circuits - Shuts down by overheat detection - Restarts automatically after cooling Built-in dynamic clamping circuit (100 V Min.) Low on-state resistance Small 20-pin SOP package
ORDERING INFORMATION
Part Number Lead plating Packing Package Remark μPD166104GS-E1-AZ Sn-Bi Tape 2500 p/reel 20-pin plastic SOP (7.62 mm (300)) Lead-free product μPD166104GS-E2-AZ Sn-Bi Tape 2500 p/reel 20-pin plastic SOP (7.62 mm (300)) Lead-free product QUALITY GRADE Part Number Quality Grade μPD166104GS-E1-AZ Special μPD166104GS-E2-AZ Special Please refer to "Quality Grades on NEC Semiconductor Devices" (Document No. C11531E) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applications. APPLICATION Injector driver
Data Sheet S18753EJ1V0DS 2 μPD166104 BLOCK DIAGRAM Overheat Protection Current Limitation OUT1 IN1 GND1 VCC1 Input Circuit Dynamic Clamping Circuit Output MOS (N-ch) Ch 1 Ch 2 VCC2 IN2 OUT2 GND2 PIN CONFIGURATION
- 20-pin plastic SOP (7.62 mm (300)) Top View OUT1 IN1 N.C. VCC1 OUT1 OUT2 IN2 N.C. VCC2 OUT2 OUT2 GND2 GND2 GND2 GND1 GND1 GND1 OUT2 OUT1 OUT11 Pin Name Pin No. Pin Name Pin No. Pin Name Pin No. Pin Name Pin No. Pin Name
1 OUT1 6 OUT2 11 OUT2 16 OUT1
2 IN1 7 IN2 12 GND2 17 GND1
3 N.C. 8 N.C. 13 GND2 18 GND1
4 V CC1 9 V CC2 14 GND2 19 GND1
5 OUT1 10 OUT2 15 OUT2 20 OUT1
Data Sheet S18753EJ1V0DS 3 μPD166104 ABSOLUTE MAXIMUM RATINGS Parameter Symbol Condition Rating Unit Input voltage V IN −1.5 to +7 V VCC1 −0.5 to +18 V Power supply voltage VCC2 1 s 35 V Output voltage V OUT Except the clamping voltage at the flyback time 100 V Output current I O (DC) V IN = 5 V, DC SELF LIMITED A/ch Power dissipation P D Ta = 25 °C, both channels are ON Note 2.5 W Channel temperature Tch 150 °C Storage temperature Tstg −55 to +150 °C Note When mounted on 50 mm x 50 mm x 1.5 mm epoxy PCB FR4 substrate with 600 mm x 70 μm copper foil. Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameters. That is, the absolute maximum ratings are rated valu es at which the product is on the verge of suffering physical damage , and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. The ratings and conditions indicated for DC ch aracteristics and AC characteristics represent the quality assurance range during normal operation.
Data Sheet S18753EJ1V0DS 4 μPD166104 ELECTRICAL SPECIFICATIONS (VCC = 5 to 18 V, Tch = –40 to 150 °C, unless otherwise specified) Parameter Symbol Condition Min. Typ. Max. Unit High level input voltage V IH Rin = 1 kΩ, VDS = 0.3 V, IO = 1.4 A 3.0 V Low level input voltage V IL Rin = 1 kΩ, VDS = 20 V, IO = 1 mA 1.5 V High level input current I IH V IN = 5.5 V, VDS = 0 V 300 μA Low level input current I IL V IN = 0 V, VDS = 20 V –10 +10 μA ICC1 V CC = 16 V, ON condition 10.0 mA/ch Power supply current ICC2 V CC = 16 V, OFF condition 10.0 mA/ch RDS(on)1 I o = 1.4 A, Tch = 25 °C, VIN = VIH, VCC = 16 V 64 91 mΩ Output ON state resistance RDS(on)2 I o = 1.4 A, Tch = 150 °C, VIN = VIH, Vcc = 16 V 107 146 mΩ Turn on time ton 3.5 35 μs Rise time tr VIN = 0→5 V, Rin = 1 kΩ, RL = 8 Ω, VCC = 12 V, Tch = 0 to 150 °C 35 μs Turn off time toff 30 μs Fall time tf VIN = 5→0 V, Rin = 1 kΩ, RL = 8 Ω, VCC = 12 V, Tch = 0 to 150 °C 15 μs Output leak current I DSS V IN = 0 V, VDS = 18 V 350 μA Clamp voltage V OUT I O = 10 mA, Tch = 25 °C, VIN = 0 V 100 130 V Temperature characteristics of clamp voltage ΔVZ IO = 1.4 A, VIN = VIL, L = 1mH 130 mV/°C Overheat detection temperature T HI 150 °C Current limitation I LIM 1.7 A Switching mesurement circuit Switching measurement waveform 12 V 8 Ω VIN IN OUT GND μPD166104 VCC 1 kΩ IN Wave Form OUT Wave Form 90% 50% 90% 10% 50% 10% ton tr toff tf
Data Sheet S18753EJ1V0DS 5 μPD166104 Input circuit (On/Off control) Output MOS turns on when the high-level input voltage (3.0 V or more) is applied to IN terminal. Output MOS turns off when the low-level input voltage (1.5 V or less) is applied to IN terminal. VIN VOUT (Resistance load) 5 V GND VOUT GND OFF OFF OFF OFF ON ON ON “L ” Dynamic clamp circuit This circuit is for protection of out put and other circuits from the overvo ltage by back electromotive force when inductive load turns off. The clamp diode is connected between drain and gate of output. Output voltage is clamped by this circuit when the voltage of the OUT terminal exceeded the output clamping voltage. 5 V GND VOUT GND VIN VOUT (Inductive load) “L ” “L ” “H” OFF OFF ON Vz Current limitation circuit This circuit prevents destruction from the overcurrent when the short-circuit occurs. When the overcurrent flows to the OUT terminal such as short-circuit condition, the output current is limited. Power supply voltage to OUT terminal should be 18 V or less when the short-circuit occurs. Overheat protection circuit This circuit prevents destruction from overheat. The channel temperature of the output is monitored and the output is shut down when overheat is detected. Output restarts automatically after the channel cooled down. 5 V GND “L ” “L ” “H” VIN VOUT Tch THI VCC
Data Sheet S18753EJ1V0DS 6 μPD166104 TYPICAL CHARACTERISTICS HIGH LEVEL INPUT VOLTAGE vs. SUPPLY VOLTAGE HIGH LEVEL INPUT VOLTAGE vs. AMBIENT TEMPERATURE LOW LEVEL INPUT VOLTAGE vs. SUPPLY VOLTAGE LOW LEVEL INPUT VOLTAGE vs. AMBIENT TEMPERATURE HIGH LEVEL INPUT CURRENT vs. SUPPLY VOLTAGE HIGH LEVEL INPUT CURRENT vs. AMBIENT TEMPERATURE 100 150 200 250 300 0 5 10 15 20 V CC - Supply Voltage - IIH - High Level Input Current - μA 100 150 200 250 300 –50 0 50 100 150 200 Ta - Ambient Temperature - °C IIH - High Level Input Current - μA 1.0 1.5 2.0 2.5 3.0 3.5 0 5 10 15 20 V CC - Supply Voltage - VIL - Low Level Input Voltage - V 1.0 1.5 2.0 2.5 3.0 3.5 –50 0 50 100 150 200 Ta - Ambient Temperature - °C VIL - Low Level Input Voltage - V 1.0 1.5 2.0 2.5 3.0 3.5 –50 0 50 100 150 200 Ta - Ambient Temperature - °C VIH - High Level Input Voltage - V 1.0 1.5 2.0 2.5 3.0 3.5 0 5 10 15 20 V CC - Supply Voltage - VIH - High Level Input Voltage - V
Data Sheet S18753EJ1V0DS 7 μPD166104 OPERATING CURRENT vs. AMBIENT TENPERATURE OUTPUT LEAKAGE CURRENT vs. AMBIENT TEMPERATURE TURN ON TIME vs. AMBIENT TEMPERATURE TURN OFF TIME vs. AMBIENT TEMPERATURE RISE TIME vs. AMBIENT TEMPERATURE FALL TIME vs. AMBIENT TEMPERATURE 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 –50 0 50 100 150 200 Ta - Ambient Temperature - °C ICC - Operating Current - mA ICC1 ICC2 100 120 –50 0 50 100 150 200 Ta - Ambient Temperature - °C IDSS - Output Leakage Current - μA –50 0 50 100 150 200 Ta - Ambient Temperature - °C toff - Turn Off Time - μs –50 0 50 100 150 200 Ta - Ambient Temperature - °C ton - Turn On Time - μs –50 0 50 100 150 200 Ta - Ambient Temperature - °C tr - Rise Time - μs –50 0 50 100 150 200 Ta - Ambient Temperature - °C tf - Fall Time - μs
Data Sheet S18753EJ1V0DS 8 μPD166104 ON STATE RESISTANCE vs. AMBIENT TEMPERATURE TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE TRANSIENT THERMAL RESISTANCE CHARACTERISTICS TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH 0.1 100 1000 0.001 0.01 0.1 1 10 100 1000 Pulse width (s) Transient thermal resistance Rth (°C/W) Rth(ch-a) = 62.5 °C/W Rth(ch-c) = 16.5 °C/W Device on 50 mm × 50 mm × 1.5 mm epoxy PCB FR4 with 6 cm of 70 μm copper area 0.0 0.5 1.0 1.5 2.0 2.5 0 50 100 150 200 Ta - Ambient Temperature - °C PT - Total Power Dissipation - W 2 units 1 unit 0.00 0.02 0.04 0.06 0.08 0.10 0.12 –50 0 50 100 150 200 RDS(ON) - On State Resistance - Ω 0.14 Ta - Ambient Temperature - °C
Data Sheet S18753EJ1V0DS 9 μPD166104 APPLICATION EXAMPLE IN2 OUT2 GND Micro computer GND Power GND μPD166104 VBAT IN1 OUT1 Injector Rin Rin VCC IN2 OUT2 GND Power GND μPD166104 IN1 OUT1 Rin Rin VCC Rin: ex. 470 Ω Injector Injector Injector Caution This application circuit is example and not intended for use in actual mass production design.
Data Sheet S18753EJ1V0DS 10 μPD166104 PACKAGE DRAWING 11 0 1120 S −3° ITEM MILLIMETERS A B C E F G H J 12.7 ±0.3 1.27 (T.P.) 1.8 MAX. 1.55 ±0.05 7.7 ±0.3 0.78 MAX. 0.12 1.1 M 0.1 ±0.1 N P20GM-50-300B, C-7 P3 °+7° NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. D 0.42 +0.08 −0.07 K 0.22 +0.08 −0.07 L 0.6 ±0.2 0.10 detail of lead end I 5.6 ±0.2 M P G C B D E F N 20-PIN PLASTIC SOP (7.62 mm (300)) SM H K L JI A
Data Sheet S18753EJ1V0DS 11 μPD166104 TAPING INFORMATION There are two types (E1, E2) of directions of the device in the career tape. Pin 1 indication Tape drawout direction E1: Pin 1 of the device faces toward the open end of the tape, away from the reel E2: Pin 1 of the device faces away from the open end of the tape, toward the reel Pin 1 indication MARKING INFORMATION This figure indicates the marking items and arrangement. Ho wever, details of the le tterform, the size and the position aren't indicated. D166104GS Country of assembly Lead-free mark Pin 1 indication Lot number
Data Sheet S18753EJ1V0DS 12 μPD166104 RECOMMENDED SOLDERING CONDITIONS The μPD166104 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
- μPD166104GS-E1-AZ: 20-pin plastic SOP (7.62 mm (300))
- μPD166104GS-E2-AZ: 20-pin plastic SOP (7.62 mm (300)) Soldering Method Solder ing Conditions Symbol Infrared reflow Peak package’s surface temperature: 260 °C, Reflow time: 60 seconds or less (220 °C or higher), Maximum allowable number of reflow processes: 3, Exposure limit Note : 7 days (10 to 72 hours pre-backing is required at 125C° afterwards), Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. <Caution> Non-heat-resistant trays, such as magazine and taping trays, cannot be baked before unpacking. IR60-107-3 Partial heating method Pin temperature: 350°C or below, Heat time: 3 seconds or less (per each side of the device) , Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. Note The Maximum number of days during which the product can be stored at a temperature of 5 to 25°C and a relative humidity of 20 to 65% after dry-pack package is opened.
Data Sheet S18753EJ1V0DS 13 μPD166104 [MEMO]
Data Sheet S18753EJ1V0DS 14 μPD166104 [MEMO]
Data Sheet S18753EJ1V0DS 15 μPD166104 [MEMO]
μPD166104 The information in this document is current as of June, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electroni cs assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customer- designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) M8E 02. 11-1 (1) (2) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "Standard": "Special": "Specific":