S250S DAESAN | Alldatasheet
Document overview
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- PDF pages: 2
Technical content
Features
- Glass Passivated Die Construction
- Diffused Junction
- Low Forward Voltage Drop, High Current Capability
- Surge Overload Rating to 30A Peak
- Designed for Printed Circuit Board Applications
- Plastic Material - UL Flammability Classification 94V-0 Maximum Ratings And Electrical Characteristics
- Case : Molded Plastic
- Terminals : Solder Plated Leads, Solderable per MIL-STD-202, Method 2026
- Polarity : As Marked on Case
- Approx. Weight : 0.125 grams
- Mounting Position : Any
- Marking : Type Number (Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive load. For capacitive load, derate by 20%) CURRENT 0.8 Amperes VOLTAGE 100 to 1000 Volts Notes: (1) Measured at 1.0MHz and Applied Reverse Voltage of 4.0V DC. (2) Thermal Resistance, junction to ambient, measured on PC board with 5.02mm (0.03mm thick) land areas. Peak Repetitive Reverse voltage Working Peak Reverse voltage DC Blocking voltage RMS Reverse voltage Average Rectified Output Current @ TA=40 Non-Repetitive Peak Forward Surge Current, 8.3ms single half-sine-wave superimposed on rated load (JEDEC method) Volts Forward voltage (per element) @ IF=0.4 A VRMM VRWM VR 100 Volts Symbols Units 1.0 VFM VRMS 0.8 Amp IFSM Tj TSTG 500 -55 to +150 Amp Peak Reverse Current at Rated DC Blocking voltage (per element) Typical Junction Capacitance per element (Note 1) Operating and Storage Temperature Range S40S S80S S125S S250S S380S S500S 200 400 140 280 600 420 800 560 1000 700 Volts μA ℃/W pF Io IRM Cj RθJA @ TA=25℃ @ TA=125℃ Typical Thermal Resistance, Junction to Ambient (Note 2) A B C D E G H J L K MiniDIP Dim Min Max A 5.43 5.75 B 3.60 4.00 C 0.15 0.05 0.35 D 0.20 7.00 E G 0.70 1.10 H 4.50 4.90 J 2.80 2.90 K 2.50 2.70 L 0.50 0.80 All Dimens ions in mm
RATING AND CHARACTERISTIC CURVES S40S THRU S500S 0.01 0.1 1.0 0.2 0.6 1.0 1.4 I , INST ANT ANEOUS FOR WARD CURRENT (A) F V , INST ANT ANEOUS FOR WARD VOLTAGE (V) Fig. 2 T ypical Forward Characteristics (per leg) F T = 25 C Pulse Width = 300 s j 0.4 0.8 1.2 1.6 1.0 I , PEAK FOR WARD SURGE CURRENT (A) FSM NUMBER OF CYCLES AT 60 Hz Fig. 3 Maximum Peak Forward Sur ge Current (per leg) T = 25 C Single Half Sine-W ave Pulse Width = 5.3ms (JEDEC Method) A 100 100 C , JUNCTION CAP ACIT ANCE (pF) j V , REVERSE VOL TAGE (V) Fig. 4 Typical Junction Capacitance R T = 25 C f = 1.0MHz j 0.01 0.1 1.0 100 100 120 140 I , INST ANT ANEOUS REVERSE CURRENT ( A) R PERCENT OF RA TED PEAK REVERSE VOL TAGE (%) Fig. 5 Typical Reverse Characteristics (per element) T = 25 C j T = 125 C j 0.2 0.4 0.6 0.8 120 160 I , AVERAGE FOR WARD RECTIFIED CURRENT (A) (AV) T , AMBIENT TEMPERA TURE ( C) Fig. 1 Output Current Derating Curve A Resistive or Inductive Load Ceramic PC Board μ