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Technical content
@copyright Good-Ark2012 www.goodark.com Chip Fuse Chip Fuse
Description
■ High inrush current withstanding capability ■ Compatible with reflow and wave solder ■ Rugged ceramic and glass construction ■ Excellent environmental performance ■ RoHS Compliant ,Lead Free & Halogen Free material
Applications
■ Telecommunication: PDA / DSL ■ Computers: LCD Panel / Printers/ Laptop/ Servers ■ Consumer Electronics: DVD player / MP3 MP4 Player Environmental Data ■ Life Test: MIL-STD-202, Method 108D ■ Humidity Bias: MIL-STD-202 , Method 103 ■ Moisture Resistance Test: MIL-STD-202, Method 106G ■ Thermal Shock: MIL-STD-202, Method 107G ■ Terminal Strength: AEC-Q200-006 ■ Board Flex: AEC-Q200-005 Appendix 2 Note: 1mm (Min) ■ Vibration: MIL-STD-202, Method 204C ■ Mechanical Shock:MIL-STD-202,Method 213C ■ Solderability: ANSI/J-STD-202 ■ Resistance to Solder Heat: MIL-STD-202,Method 210B ■ Resistance to Solvents Test: MIL-STD-202, Method 215
Electrical Characteristics
Ampere Rating % of Amp Rating Opening Time 1A-7A 100% 4 Hours Minimum 1A-7A 200% 1~120 Senconds 1A-7A 300% 0.1~3 Senconds 1A-7A 800% 0.002～0.05 Seconds S1206S Series Sn PLATING OVERCOAT CERAMIC SUBSTRATE FUSE ELEMENT Cu / Ni PLATING Electrical Specifications Product Code Current Rating Voltage Rating DC Interruptin g Rating* Resistance (ohms) Typ. Typical Melt I2t * (A2s) Alpha Code Marking S1206S1 1A 63V 50A 0.42 0.10 H
@copyright Good-Ark2012 www.goodark.com Chip Fuse Chip Fuse Typical Performance Curves 1 10 100 0.0001 0.001 0.01 0.1 1.0A 1.25A 1.5A 2.0A 2.5A 3.0A 4.0A 3.5A 5.0A 5.5A 6.0A 4.5A Time(S) Current(A) 100 S1206S1.25 1.25A 63V 50A 0.25 0.22 J S1206S1.5 1.5A 63V 50A 0.21 0.25 K S1206S2 2A 63V 50A 0.13 0.59 N S1206S2.5 2.5A 32V 50A 0.08 0.88 O S1206S3 3A 32V 50A 0.05 1.10 P S1206S3.5 3.5A 32V 50A 0.036 1.55 R S1206S4 4A 32V 50A 0.03 2.30 S S1206S4.5 4.5A 32V 50A 0.025 3.55 X S1206S5 5A 32V 50A 0.02 5.40 T S1206S5.5 5.5A 24V 60A 0.016 6.20 ▲ S1206S6 6A 24V 60A 0.013 8.10 Y S1206S7 7A 24V 60A 0.012 9.88 U *; DC interrupting rating (Measured at rated voltage, time constant of less than 50 microseconds, battery source) DC Cold Resistance (Measured at 10% of rated current) * Typical Melting I2t (Measured with a battery bank at rated DC voltage and at 0.001 second clear time, time constant of calirated circuit less than 50 microseconds)Device designed to carry rated current for four hours minimum. An operating current of 75% or less of rated current is recomm ended, with further derating required at elevated ambient temperatures. 7.0A 1.25A 1.5A 2.0A 2.5A 3.0A 4.0A 3.5A 5.0A 5.5A 6.0A 4.5A 7.0A
@copyright Good-Ark2012 www.goodark.com Chip Fuse Chip Fuse Product Dimension Recommended Pad Layout Part Number System S1206 S 2 TR Packing Code Ampere Rating S (Slow Blow) Series(1206 size) Note: TR: 5,000 pieces of fuses on 8mm tape-and-reel on a 7 inch (178mm) reel per EIA Standard 481 3.2± 0.2 1.6± 0.2 0.5± 0.25 0.55± 0.2 1.5 3.5 1.8 DIMENSIONS:mm 0.01 0.1 1 0.1 100 1000 10000 0.001 100000 10 100
@copyright Good-Ark2012 www.goodark.com Chip Fuse Chip Fuse
Revision history
Date Revision Description of changes 31-July-2011 A First issue