S1000H SYTECH | Alldatasheet

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CN-TDS-1911-03-S1000H-S1000HB Test Items Test Method Test Condition Unit Typical Value Tg IPC-TM-650 2.4.24.4 DMA ℃ 160 IPC-TM-650 2.4.25D DSC 155 Td IPC-TM-650 2.4.24.6 TGA (5% W.L) ℃ 348 T288 IPC-TM-650 2.4.24.1 TMA min 20 T260 IPC-TM-650 2.4.24.1 TMA min >60 Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip s >100 CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 37 IPC-TM-650 2.4.24 After Tg ppm/℃ 230 Permittivity (1GHz) IPC-TM-650 2.5.5.9 C-24/23/50 - 4.6 Loss Tangent (1GHz) IPC-TM-650 2.5.5.9 C-24/23/50 - 0.011 Volume Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 MΩ-cm 1.5×108 Surface Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 MΩ 3.5×107 Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-0.5/23 s 150 Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-0.5/23 kV >45 Peel Strength (1oz) IPC-TM-650 2.4.8 288℃/10s N/mm [lb/in] 1.3 [7.43] Flexural Strength (LW/CW) IPC-TM-650 2.4.4 A Mpa 530/440 Water Absorption IPC-TM-650 2.6.2.1 D-24/23 % 0.09 Flammability UL94 C-48/23/50 Rating V-0 CTI IEC60112 A Rating PLC 3

  • Anti-CAF capability
  • Lead-free compatible
  • Low water absorption
  • Excellent thermal reliability
  • Excellent through-hole reliability. Instruments Computer and NB Consumer electronics Automotive electronics Power supplier and Industrial GENERAL PROPERTIES FEATURES APPLICATIONS Remarks: 1. Specification sheet: IPC-4101/99, is for your reference only. 2. All the typical value is based on the 1.6mm (8*7628) specimen. 3. All the typical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd. S1000H (UL ANSI: FR-4.0) High Performance, Mid-Tg, Lead-free

CN-TDS-1911-03-S1000H-S1000HB Glass fabric type Resin content (%) Cured thickness (mm) Standard size (Roll type) 106/1037 73 0.050 1.260m×150m 78 0.063 65 0.072 1.260m×300m 68 0.081 70 0.087 2313 57 0.100 2116 55 0.120 1.260m×250m 58 0.130 1506 48 0.160 1.260m×150m 7628 46 0.195 48 0.205 50 0.215 52 0.225 Thickness Copper foil Standard size 0.05mm to 3.2mm 12um to 105 um 1,020mm ×1,220mm(40”×48”) 915mm ×1,220mm(36”×48”)  The heat-up rate depends on the inner copper or the structure of multilayer PCB.  Curing time: >45min (180~190℃).  If you need any more detail information, please turn to Shengyi Technology Co., Ltd. S1000HB PREPREG (UL ANSI: FR-4.0) Bonding Prepreg For S1000H  3 months when stored at < 23℃ and <50% RH.  6 months when stored at <5℃. Normalize in room temperature for at least 4h before using.  Beware of moisture, always keep wrapped in damp-proof material. Keeping in normal condition, prepreg might absorb moisture and its bonding strength would be weakened.  Avoid UV-rays and strong light. STORAGE CONDITION HOT PRESSING CYCLE Other type, resin content and size could be available upon request. PREPREG PARAMETERS Remarks: Other sheet size and thickness could be available upon request. PURCHASING INFORMATION