RT1300B6 CTS | Alldatasheet
Document overview
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- PDF pages: 2
Technical content
Features
- 9 Line LVD Termination Network
- Ultra2 and Ultra3 Compliant
- Low Channel Capacitance Less than 0.25pF
- BGA package reliability
- ±1% Resistor Tolerance
- Low Channel Cross Talk
- RoHS Compliant Designs Available
- Compatible with both lead and lead-free manufacturing processes
Description
This LVD SCSI termination network is designed for high performance active termination of SCSI networks compliant to SPI-2 (Ultra2), SPI-3 (Ultra3) and beyond. Designed with a ceramic substrate and a ball grid array interconnect, this device virtually eliminates channel capacitance and lead inductance, the primary cause of reduced system performance. BGA packaging has been proven to reduce rework and improve reliability. LVD SCSI Terminator Technical Data Sheet RoHS Compliant Parts Available Electrical Specifications Resistor Tolerance: ± 1.0% TCR ± 200ppm/°C Operating Temperature Range -55°C to +125°C Maximum Resistor Power: 0.05 Watts at 70°C Maximum Package Power: 1.0 Watts at 70°C Process Requirements: Maximum Re-flow Temperature Per IPC/JEDEC J-STD-020C Style E Schematic Diagram DEFABC G H J LVD SCSI Active Termination Circuit
Ordering Information
Part No. R1 Ω R2 Ω Lines Pitch (mm) RoHS Part No. RT1300B6* 475 121 9 1.27 RT2300B6 * *Indicates available Top Probe-able part numbers. Refer to the following link for detailed Top Side Probe-able information: www.ctscorp.com/components/clearone/TopProveClearOne.pdf Packaging Information Suffix TR7 TR13 Tape Width 24 mm 24mm Carrier Pitch 8 mm 8 mm Reel Diameter 7 inch 13 inch Parts/Reel 1,000 4,000 Part Number Coding 7 inch reel, Add TR7 to part number, example RT2300B6TR7 13 inch reel, Add TR13 to part number, example RT2300B6TR13 (Bulk packaging is not available) Direction of Feed
© 2006 CTS Corporation. All rights reserved. Information subject to change. CTS Electronic Components Page 2 March 06 www.ctscorp.com LVD SCSI Terminator Complete ClearONE Product, Processing, and Application Information can be found at the following link: http://www.ctscorp.com/components/clearone.asp Mechanical Diagram K P (Pitch) L W H P (Pitch) A1 Identifier RT_300B6 CTS YRWK D 1.27mm Pitch L W H P D K Solder Mask Dia = Pad Diameter +.15mm (.006 inch) Recommended Land Pattern 1.27 mm Pitch (B6) = 0.64mm/.025 inch Outline of Substrate PCB Pad Diameter For .006" Thick Solder Paste Stencil, Aperture Opening Should be Equal to the PCB Pad Diameter. Refer to www.ctscorp.com/components/clearone.asp for additional PCB design information