RT1250B6 CTS | Alldatasheet
Document overview
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- PDF pages: 2
Technical content
Features
- 8 Bit Thevinin Termination Set
- Compliant for LVPECL Termination
- Excellent High Frequency Performance
- Slim BGA Package
- 1% Resistor Tolerance
- Low Channel to Channel Cross Talk
- RoHS Compliant Designs Available
- Compatible with both lead and lead- free processes
Ordering Information
Part No. R1 Ω R2 Ω Bits Pitch (mm) RoHS Part No. RT1250B6* 127 82.5 8 1.27 RT2250B6 * RT1250B7 127 82.5 8 1.00 RT2250B7 *Indicates available Top Probe-able part numbers. Refer to the following link for detailed Top Side Probe-able information: www.ctscorp.com/components/clearone/TopProveClearOne.pdf
Description
These integrated termination networks provide high performance line termination for LVPECL busses. Specifically designed shielding inside the package combined with a ceramic substrate virtually eliminates cross talk between channels that is common in other termination networks and resistor arrays. The BGA packaging has been proven to reduce rework and improve reliability. Style G DEFABC GH VEE VCC Zo Zo = 50 Ohms Thevenin Vtt = 1.3Volts VCC = 3.3 Volts R1 = 127 Ohms VEE = 0 Volts R2 = 82.5 Ohms LVPECL Thevenin Termination Electrical Specifications Resistor Tolerance: ± 1.0% TCR ± 200 ppm/°C Operating Temperature Range -55°C to +125°C B6-1.27mm Pitch B7-1.00mm Pitch Maximum Resistor Power: 96mw 96mw 60mW 66mW Maximum Package Power: 1.0 Watt at 70°C Process Requirements: Maximum Re-flow Temperature Per IPC/JEDEC J-STD-020C
© 2006 CTS Corporation. All rights reserved. Information subject to change. CTS Electronic Components Page 2 March 06 www.ctscorp.com LVPECL Terminators Complete ClearONE Product, Processing, and Application Information can be found at the following link: http://www.ctscorp.com/components/clearone.asp Solder Mask Dia = Pad Diameter +.15mm (.006 inch) BGA Routing Scheme Blind vias to VEE reference plane layer recommended on every other row as shown. Signal Lines - 9 mil tr ace width or si milar to achieve controlled 50 Ohm transmission line impedance Zo. Blind vias to VCC reference plane layer recommended on every other row as shown. Mechanical Diagram K P (Pitch) L W H P (Pitch) A1 Identifier RT_250B_ CTS YRWK D 1.00mm Pitch L W H P D K 1.27mm Pitch L W H P D K Recommended Land Pattern 1.00mm Pitch (B7) = 0.51mm/.020 inch (minimum) 1.27mm pitch (B6) = 0.64mm/.025 inch (minimum) Outline of Substrate PCB Pad Diameter For .006" Thick Solder Paste Stencil, Aperture Opening Should be Equal to the PCB Pad Diameter. Refer to www.ctscorp.com/components/clearone.asp for additional PCB design information