RS3ABG CHENDA | Alldatasheet
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Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. Maximum Ratings And Electrical Characteristics Mechanical Data The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 Idea for printed circuit board Open Junction chip Low reverse leakage High forward surge current capability High temperature soldering guaranteed: 250℃/ 10 seconds at terminals Glass passivated chip junction Case : JEDEC DO-214AA/SMB Molded plastic body Terminals : Solder plated, solderable per MIL-STD-750,Method 2026 Polarity : Polarity symbol marking on body Mounting Position : Any Weight : 0.003 ounce, 0.098 grams Note:1.Reverse recovery condition IF=0.5A,IR=1.0A,Irr=0.25A 3.The typical data above is for reference only. DO-214AA/SMB Dimensions in inches and (millimeters) 0.060(1.52) 0.030(0.76) 0.220(5.59) 0.200(5.08) 0.012(0.305) 0.006(0.152) 0.008(0.203)MAX. 0.096(2.44) 0.084(2.13) 0.086 (2.20) 0.071 (1.80) 0.185(4.70) 0.160(4.06) 0.155(3.94) 0.130(3.30) Parameter SYMBOLS RS3ABGRS3BBGRS3DBGRS3GBG RS3JBG RS3KBGRS3MBG UNITS Marking Code MDD RS3AB MDD RS3BB MDD RS3DB MDD RS3GB MDD RS3JB MDD RS3KB MDD RS3MB Maximum repetitive peak reverse voltage VRMM 50 100 200 400 600 800 1000 V Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V Maximum average forward rectified current at TL=90℃ I(AV) 3.0 A Peak forward surge current 8.3ms single half sine-wave superimposed onrated load (JEDEC Method) IFSM 90 A Maximum instantaneous forward voltage at 3.0A VF 1.30 V Maximum DC reverse current TA=25℃ at rated DCblocking voltage TA=125℃ IR 5.0 100.0 μA Maximum reverserecovery time (NOTE 1) trr 150 250 500 ns Typical junction capacitance (NOTE 2) CJ 40.0 pF Typical thermal resistance (NOTE 3) RJA 60.0 ℃/W Operating junction and storage temperature range TJ,TSTG - 5 5t o+ 1 5 0 ℃
Rev:2019A0 Page :2 Ratings And Characteristic Curves The curve above is for reference only. https://www.microdiode.com Reverse Voltage - 50 to 1000 Volts Forward Current - 3.0 Ampere RS3ABG THRU RS3MBG Fig.3 Typical Instaneous Forward Instaneous Forward Current (A) 0.01 0.1 1.0 Instaneous Forward Voltage (V) Characteristics TJ=25°C pulse with 300 μs 1% duty cycle Fig.2 Typical Reverse Characteristics 0.1 1.0 100 20 40 60 80 100 12000 140 percent of Rated Peak Reverse Voltage (%) Instaneous Reverse Current（μ A） TJ=125°C TJ=25°C Junction Capacitance (pF) 1.0 10 1000.1 100 Reverse Voltage (V) TJ=25°C Fig.4 Typical Junction Capacitance TJ=25°C f = 1.0MHz Vsig = 50mV p-p 100 120 10 100 Fig.5 Maximum Non-Repetitive Peak Forward Surge Current Peak Forward Surge Current (A) Number of Cycles 8.3 ms Single Half Sine Wave (JEDEC Method) 0.5 1.0 1.5 2.0 2.5 4.0 0.0 25 50 75 100 125 150 175 Average Forward Current (A) Case Temperature (°C) Fig.1 Maximum Average Forward Current Rating 3.0 3.5 Single phase half-wave 60 Hz resistive or inductive load
https://www.microdiode.com Rev:2019A0 Page :3 Important Notice and Disclaimer Microdiode Electronics (Jiangsu) reserves the right to make changes to this document and its products and specifications at any time without notice. Customers should obtain and confirm the latest product information and specifications before final design,purchase or use. Microdiode Electronics (Jiangsu) makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, not does Microdiode Electronics (Jiangsu) assume any liability for application assistance or customer product design. Microdiode Electronics (Jiangsu) does not warrant or accept any liability with products which are purchased or used for any unintended or unauthorized application. No license is granted by implication or otherwise under any intellectual property rights of Microdiode Electronics (Jiangsu). Microdiode Electronics (Jiangsu) products are not authorized for use as critical components in life support devices or systems without express written approval of Microdiode Electronics (Jiangsu). Suggested Pad Layout E B d F W PA D D1D2 C T Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. Reel packing Reverse Voltage - 50 to 1000 Volts Forward Current - 3.0 Ampere RS3ABG THRU RS3MBG unit:mm Item Symbol Tolerance SMB Carrier width A 0.1 3.81 Carrier length B 0.1 5.41 Carrier depth C 0.1 2.42 Sprocket hole d 0.05 1 5.0 13" Reel outside diameter D 2.0 330.00 13" Reel inner diameter D1 min 50.00 Feed hole diameter D2 0.5 13.00 Sprocket hole position E 0.1 1.75 Punch hole position F 0.1 5.55 Punch hole pitch P 0.1 8.00 Sprocket hole pitch P0 0.1 4.00 Embossment center P1 0.1 2.00 Overall tape thickness T 0.1 0.30 Tape width W 0.3 12.00 Reel width W1 1.0 12.30 SMB 13" 3,000 4.0 10,000 190*190*41 330 365* 365* 360 80,000 14.0 PACKAGE REEL SIZE REEL COMPONENT SPACING BOX INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(mm)(mm)(mm)(pcs)(mm)(pcs) Symbol Unit (mm) Unit (inch) A2 .8 0 .110 B 2.4 0.094 C 4.6 0.181 D 2.2 0.086 E7 .0 0 .276