RS2105 RUNIC | Alldatasheet

Document overview

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Technical content

REV C.2 1 www.run-ic.com Ultra Low ON-Resistance, Low Voltage, Dual, SPDT Analog Switch

FEATURES

  • -3dB Bandwidth: 30MHz
  • High Speed, Typically 50ns
  • Supply Range: +1.8V to +5.5V
  • Low ON-State Resistance, 0.6Ω(TYP)
  • Break-Before-Make Switching
  • Rail-to-Rail Operation
  • TTL/CMOS Compatible
  • Extended Industrial Temperature Range: -40°C to +125° C

APPLICATIONS

  • Wearable Devices
  • Battery-Operated Equipment
  • Signal Gating, Chopping, Modulation or Demodulation (Modem)
  • Portable Computing
  • Cell Phones FUNCTION TABLE LOGIC NO NC

0 OFF ON

1 ON OFF

NO1, NO2 2, 10 Normally-Open Terminal COM1 COM2 3, 9 Common Terminal IN1, IN2 4, 8 Digital Control Pin NC1, NC2 5, 7 Normally-Closed Terminal GND 6 Ground

DESCRIPTION

The RS2105 is a dual, low on -resistance, single-pole double-throw (SPDT) analog switch that is designed to operate from1.8 V to 5.5 V. The RS2105 device can handle both analog and digital signals. It features fast switching speeds (50ns) and low on-resistance (0.6Ω TYP). Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog -to-digital and digital -to-analog conversion systems. PIN CONFIGURATIONS 1 10 RS2105 NO1 COM1

3 IN2

9 COM2

2 www.run-ic.com ABSOLUTE MAXIMUM RATINGS (1) Storage Temperature ……….…………… −65° C to +150° C Operating Temperature ……….…….…… −40° C to +125°C Package Thermal Resistance @ TA = +25°C ESD Susceptibility (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should be current-limited to 10mA or less. PACKAGE/ORDERING INFORMATION PRODUCT ORDERING NUMBER TEMPERATURE RANGE PACKAGE LEAD PACKAGE MARKING PACKAGE OPTION RS2105 RS2105XN -40℃~125℃ MSOP-10 RS2105 Tape and Reel,3000 RS2105XTDC10 -40℃~125℃ TDFN-3x3-10L RS2105 Tape and Reel,5000 ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ESD SENSITIVITY CAUTION

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ELECTRICAL CHARACTERISTICS

V+ = 5.0 V, TA= –40° C to 125° C (unless otherwise noted) PARAMETER SYMBOL CONDITIONS V+ TA MIN TYP MAX UNITS ANALOG SWITCH Analog Signal Range VNO, VNC, VCOM FULL 0 V+ V On-Resistance RON 0 ≤ (VNO or VNC) ≤V+, ICOM = -10mA, Switch ON, See Figure 1 +25℃ 0.6 1.0 Ω FULL 1.2 Ω 3.3V +25℃ 1.0 1.5 Ω FULL 1.7 Ω On-Resistance Match Between Channels ∆RON 0 ≤ (VNO or VNC) ≤V+, ICOM = -10mA, Switch ON, See Figure 1 +25℃ 0.04 0.1 Ω FULL 0.12 Ω 3.3V +25℃ 0.04 0.1 Ω FULL 0.12 Ω On-Resistance Flatness RFLAT(ON) 0 ≤ (VNO or VNC) ≤V+, ICOM = -10mA, Switch ON, See Figure 1 +25℃ 0.18 0.3 Ω FULL 0.4 Ω 3.3V +25℃ 0.54 0.7 Ω FULL 0.8 Ω NC,NO OFF Leakage Current INC(OFF), INO(OFF) VNO or VNC = 0.3V, V+/2 VCOM = V+/2, 0.3V See Figure 2 1.8 to 5.5V FULL 1 μA NC,NO,COM ON Leakage Current INC(ON), INO(ON), ICOM(ON) VNO or VNC = 0.3V, Open VCOM = Open, 0.3V See Figure 2 1.8 to 5.5V FULL 1 μA DIGITAL CONTROL INPUTS(1) Input High Voltage VINH 5V FULL 1.5 V 3.3V FULL 1.3 V Input Low Voltage VINL 5V FULL 0.6 V 3.3V FULL 0.5 V Input Leakage Current IIN VIN = VIO or 0 1.8 to 5.5V FULL 1 μA (1) All unused digital inputs of the device must be held at VIO or GND to ensure proper device operation.

4 www.run-ic.com ELECTRICAL CHARACTERISTICS (continued) V+ = 5.0 V, TEMP= –40° C to 125° C (unless otherwise noted)) PARAMETER SYMBOL CONDITIONS V+ TEMP MIN TYP MAX UNITS DYNAMIC CHARACTERISTICS Turn-On Time tON VCOM = V+, RL = 300Ω, CL = 35pF, See Figure 5 5V +25℃ 50 ns 3.3V 50 Turn-Off Time tOFF VCOM = V+, RL = 300Ω, CL = 35pF, See Figure 5 5V +25℃ 15 ns 3.3V 17 Break-Before-Make Time Delay tBBM VNO1 = VNC1 = VNO2 = VNC2 = 3V, RL = 300Ω, CL = 35pF,See Figure 6 5V +25℃ 10 ns 3.3V 11 Off Isolation OISO RL = 50Ω, Switch OFF, See Figure 8 f = 100KHz +25℃ -68 dB f = 10KHz +25℃ -86 dB -3dB Bandwidth BW Switch ON, RL = 50Ω See Figure 7 +25℃ 30 MHz NC,NO OFF Capacitance CNC(OFF), CNO(OFF) VNC or VNO=V+/2 or GND, Switch OFF See Figure 4 +25℃ 80 pF NC,NO,COM ON Capacitance CNC(ON), CNO(ON), CCOM(ON) VNC or VNO=V+/2 or GND, Switch ON See Figure 4 +25℃ 350 pF POWER REQUIREMENTS Power Supply Range V+ FULL 1.8 5.5 V Power Supply Current I+ VIN = GND or V+ 5.5V FULL 1 μA

5 www.run-ic.com TYPICAL CHARACTERISTICS 0 1 10 100 Gain(dB) Frequency(MHz) V+=3V BANDWIDTH 0 1 10 100 Gain(dB) Frequency(MHz) V+=5V BANDWIDTH 0.1 Ron(Ω) VI(V) Typical ron as a Function of Input Voltage (VI ) for VI = 0 to V+ V+=5.5V V+=4V V+=3.3V V+=2.5V V+=1.8V

9 www.run-ic.com Figure 10.Charge Injection (QC) Figure11.Total Harmonic Distortion (THD)

10 www.run-ic.com PACKAGE OUTLINE DIMENSIONS MSOP-10 E b e D 4.65 0.5 1.02 0.31 θ c L AA2 RECOMMENDED LAND PATTERN (Unit: mm) Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 0.820 1.100 0.032 0.043 A1 0.020 0.150 0.001 0.006 A2 0.750 0.950 0.030 0.037 b 0.180 0.280 0.007 0.011 c 0.090 0.230 0.004 0.009 D 2.900 3.100 0.114 0.122 e 0.50(BSC) 0.020(BSC) E 2.900 3.100 0.114 0.122 E1 4.750 5.050 0.187 0.199 L 0.400 0.800 0.016 0.031 θ 0° 6° 0° 6°

11 www.run-ic.com TDFN-3x3-10L A SIDE VIEW E D TOP VIEW BOTTOM VIEW b L e K N1N5 2.4 1.7 2.8 0.24 0.5 0.6 RECOMMENDED LAND PATTERN (Unit: mm) Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 0.700 0.800 0.028 0.031 A1 0.000 0.050 0.000 0.002 A2 0.203 0.008 b 0.180 0.300 0.007 0.012 D 2.900 3.100 0.114 0.122 D1 2.300 2.600 0.091 0.103 E 2.900 3.100 0.114 0.122 E1 1.500 1.800 0.059 0.071 e 0.500 TYP 0.020 TYP k 0.200 MIN 0.008 MIN L 0.300 0.500 0.012 0.020