RS2104SPbF

IRS2104PBF IRF | Alldatasheet

Document overview

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• PDF pages: 15

Technical content

Features

• Floating channel designed for bootstrap operation
• Fully operational to +600 V
• Tolerant to negative transient voltage, dV/dt immune
• Gate drive supply range from 10 V to 20 V
• Undervoltage lockout
• 3.3 V, 5 V, and 15 V input logic compatible
• Cross-conduction prevention logic
• Internally set deadtime
• High-side output in phase with input
• Shutdown input turns off both channels
• Matched propagation delay for both channels

Description

The IRS2104 is a high voltage, high speed power MOSFET and IGBT driver with dependent high- and low- side referenced output channels. Proprietary HVIC and latch immune CMOS technologies enable ruggedized monolithic construction. The logic input is compatible with standard CMOS or LSTTL output, down to 3.3 V logic. The output drivers feature a high pulse current buffer stage designed for minimum driver cross- conduction. The floating channel can be used to drive an N-channel power MOSFET or IGBT in the high-side configuration which operates from 10 V to 600 V. www.irf.com 1 IRS2104(S)PbF VCC VB VS HO LOCOM IN SDSD IN up to 600 V TO LOAD VCC (Refer to Lead Assignment for correct pin configuration). This diagram shows electrical connections only. Please refer to our Application Notes and DesignTips for proper circuit board layout. Packages

8 Lead PDIP

8 L ead SOIC

• RoHS compliant

IRS2104(S) PbF www.irf.com 2 Symbol Definition Min. Max. Units VB High-side floating absolute voltage -0.3 625 VS High-side floating supply offset voltage VB - 25 VB + 0.3 VHO High-side floating output voltage VS - 0.3 VB + 0.3 VCC Low-side and logic fixed supply voltage -0.3 25 VLO Low-side output voltage -0.3 VCC + 0.3 VIN Logic input voltage (IN & SD) -0.3 V CC + 0.3 dVs/dt Allowable offset supply voltage transient — 50 V/ns (8 lead PDIP) — 1.0 (8 lead SOI C) — 0.625 RthJA Thermal resistance, junction to ambient (8 lead PDIP) — 125 (8 lead SOIC) — 200 TJ Junction temperature — 150 TS Storage temperature -55 150 TL Lead temperature (soldering, 10 seconds) — 300 Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol Definition Min. Max. Units VB High-side floating supply absolute voltage VS + 10 VS + 20 VS High-side floating supply offset voltage Note 1 600 VHO High-side floating output voltage VS VB VCC Low-side and logic fixed supply voltage 10 20 VLO Low-side output voltage 0 VCC VIN Logic input voltage (IN & SD)0 V CC TA Ambient temperature -40 125 Note 1: Logic operational for VS of -5 V to +600 V. L ogic state held for VS of -5 V to -VBS. (Please refer to the Design Tip DT97-3 for more details). Recommended Operating Conditions The input/output logic timing diagram is shown in Fig. 1. For proper operation the device should be used within the recommended conditions. The V S offset rating is tested with all supplies biased at a 15 V differential. V V W °C/W

IRS2104(S) PbF www.irf.com 3 Symbol Definition Min. Typ. Max. Units Test Conditions VIH Logic “1” (HO) & L ogic “0” (LO) input voltage 2.5 — — VIL Logic “0” (HO) & L ogic “1” (LO) input voltage — — 0.8 VSD,TH+ SD input positive going threshold 2.5 — — VSD,TH- SD input negative going threshold — — 0.8 VOH High level output voltage, VBIAS - VO — 0.05 0.2 VOL Low level output voltage, VO — 0.02 0.1 ILK Offset supply leakage current — — 50 V B = VS = 600 V IQBS Quiescent VBS supply current — 30 55 IQCC Quiescent VCC supply current — 150 270 IIN+ Logic “1” input bias current — 3 10 V IN = 5 V IIN- Logic “0” input bias current — — 5 VIN = 0 V VCCUV+ VCC supply undervoltage positive going 8 8.9 9.8threshold VCCUV- VCC supply undervoltage negative going 7.4 8.2 9threshold IO+ Output high short circuit pulsed current 130 290 — VO = 0 V PW ≤ 10 µs IO- Output low short circuit pulsed current 270 600 — VO = 15 V PW ≤ 10 µs Symbol Definition Min. Typ. Max. Units Test Conditions ton Turn-on propagation delay — 680 820 V S = 0 V toff Turn-off propagation delay — 150 220 V S = 600 V tsd Shutdown propagation delay — 160 220 tr Turn-on rise time — 70 170 tf Turn-off fall time — 35 90 DT Deadtime, LS turn-off to HS turn-on & 400 520 650HS turn-on to LS turn-off Static Electrical Characteristics VBIAS (VCC, VBS) = 15 V and TA = 25 °C unless otherwise specified. The VIN, VTH, and IIN parameters are referenced to COM. The VO and IO parameters are referenced to COM and are applicable to the respective output leads: HO or LO. Dynamic Electrical Characteristics VBIAS (VCC, VBS) = 15 V, CL = 1000 pF and TA = 25 °C unless otherwise specified. V V mA MT Delay matching, HS & LS turn-on/off — — 60 ns µA VCC = 10 V to 20 V IO = 2 mA VIN = 0 V or 5 V

IRS2104(S) PbF www.irf.com 4 Functional Block Diagram Lead Definitions Symbol Description IN Logic input for high-side and low-side gate driver outputs (HO and LO), in phase with HO Logic input for shutdown VB High-side floating supply HO High-side gate drive output VS High-side floating supply return VCC Low-side and logic fixed supply LO Low-side gate drive output COM Low-side return SD Lead Assignments

8 Lead PDIP 8 L ead SOIC

DEAD TIME & SHOOT-THROUGH PREVENTION PULSE GEN PULSE FILTER HV LEVEL SHIFT R S Q VCC LO COM UV DETECT

IRS2104(S) PbF www.irf.com 13 01-6014 01-3003 01 (MS-001AB)8 Lead PDIP 01-6027 01-0021 11 (MS-012AA)8 Lead SOIC D B E A e6X H 0.25 [.010] A 4312 4. OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA. NOTES: 1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 2. CONTROLLING DIMENSION: MILLIMETER 3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES]. K x 45° 8X L 8X c y FOOTPRINT 8X 0.72 [.028] 6.46 [.255] 5 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. 6 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].

7 DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO

A SUBSTRATE. MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006]. 0.25 [.010] CAB A A18X b C 0.10 [.004] D E y b A H K L .189 .1497 .013 .050 BASIC .0532 .0040 .2284 .0099 .016 .1968 .1574 .020 .0688 .0098 .2440 .0196 .050 4.80 3.80 0.33 1.35 0.10 5.80 0.25 0.40

1.27 BASIC

5.00 4.00 0.51 1.75 0.25 6.20 0.50 1.27 MIN MAX MILLIMETERSINCHES MIN MAXDIM e c .0075 .0098 0.19 0.25 .025 BASIC 0.635 BASIC Case Outline

IRS2104(S) PbF www.irf.com 14 CARRIER TAPE DI MENSION FOR 8SOICN Code Mi n Ma x Mi n Ma x A 7 .9 0 8.1 0 0.31 1 0 .3 18 B 3. 90 4. 10 0.153 0. 161 C 11. 70 12.30 0. 46 0. 484 D 5 .4 5 5.5 5 0.21 4 0 .2 18 E 6 .3 0 6.5 0 0.24 8 0 .2 55 F 5 .1 0 5.3 0 0.20 0 0 .2 08 G 1.50 n/a 0.059 n/a H 1 .5 0 1.6 0 0.05 9 0 .0 62 M etr ic Im p erial REEL DIMENSIONS FOR 8SOICN Code Mi n Ma x Mi n Ma x A 329.60 330. 25 12. 976 13. 001 B 20. 95 21.45 0.824 0. 844 C 12. 80 13.20 0.503 0. 519 D 1 .9 5 2.4 5 0.76 7 0 .0 96 E 98. 00 102. 00 3.858 4. 015 F n /a 1 8.40 n /a 0 .7 24 G 14. 50 17.10 0.570 0. 673 H 12. 40 14.40 0.488 0. 566 M etr ic Im p erial E F A C D G AB H NOTE : CO NTROLLING DIMENS ION I N MM LOAD ED TAPE FEED DIRECTION A H F E G D B C Tape & Reel 8-lead SOIC

IRS2104(S) PbF www.irf.com 15 ORDER INFORMATION 8-Lead PDIP IRS2104PbF 8-Lead SOIC IRS2104SPbF 8-Lead SOIC Tape & Reel IRS2104STRPbF IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105 LEADFREE PART MARKING INFORMATION Lead Free Released Non-Lead Free Released Part number Date code IRxxxxxx YWW? ?XXXXPin 1 Identifier IR logo Lot Code (Prod mode - 4 digit SPN code) Assembly site code Per SCOP 200-002 P ? MARKING CODE S The SOIC-8 is MSL2 qualified. This product has been designed and qualified for the industrial level. Qualification standards can be found at www.irf.com Data and specifications subject to change without notice. 11/27/2006