RS1AG CHENDA | Alldatasheet

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The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 Idea for printed circuit board Open Junction chip Low reverse leakage High forward surge current capability High temperature soldering guaranteed: 250℃/ 10 seconds at terminals Glass passivated chip junction DO-214AC/SMA Dimensions in inches and (millimeters) Case : JEDEC DO-214AC/SMA Molded plastic body Terminals : Solder plated, solderable per MIL-STD-750,Method 2026 Polarity : Polarity symbol marking on body Mounting Position : Any Weight : 0.002ounce, 0.055 grams Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. Maximum Ratings And Electrical Characteristics 0.208(5.30) 0.067 (1.70) 0.051 (1.30) 0.177(4.50) 0.157(3.99) 0.1 10(2.80) 0.094(2.40) 0.060(1.52) 0.030(0.76) 0.188(4.80) 0.012(0.305) 0.006(0.152) 0.008(0.203)MAX. 0.096(2.42) 0.078(1.98) Parameter SYMBOLS RS1AG RS1BG RS1DG RS1GG RS1JG RS1KG RS1MG UNITS Marking Code MDD RS1A MDD RS1B MDD RS1D MDD RS1G MDD RS1J MDD RS1K MDD RS1M Maximum repetitive peak reverse voltage VRMM 50 100 200 400 600 800 1000 V Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V Maximum average forward rectified current at TL=90¥ I(AV) 1.0 A Peak forward surge current 8.3ms single half sine-wave superimposed onrated load (JEDEC Method) IFSM 30 A Maximum instantaneous forward voltage at 1.0A VF 1.30 V Maximum DC reverse current TA=25℃ at rated DCblocking voltage TA=125℃ IR 5.0 50.0 μA Maximum reverse recovery time (NOTE 1) trr 150 250 500 ns Typical junction capacitance (NOTE 2) CJ 15.0 pF Typical thermal resistance (NOTE 3) RJA 75.0 ℃/W Operating junction and storage temperature range TJ,TSTG -55 to +150 ℃ 3.The typical data above is for reference only.

Rev:2019A0 Page :2 Ratings And Characteristic Curves https://www.microdiode.com Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere RS1AG THRU RS1MG The curve above is for reference only. 0.2 0.4 0.6 0.8 1.0 1.2 0.0 25 50 75 100 125 150 175 Fig.1 Forward Current Derating Curve Average Forward Current (A) Case T emperature (°C) Single phase half-wave 60 Hz resistive or inductive load Fig.3 T ypical Instaneous Forward Instaneous Forward Current (A) 0.01 0.1 1.0 Instaneous Forward Voltage (V) Characteristics TJ=25°C pulse with 300μs 1% duty cycle Fig.2 T ypical Reverse Characteristics 0.1 1.0 100 20 40 60 80 100 12000 140 percent of Rated Peak Reverse Voltage (%) Instaneous Reverse Current( μA) TJ=125 °C TJ=25°C Fig.4 T ypical Junction Capacitance JunctionCapacitance ( pF) 1.0 10 1000.1 100 Reverse Voltage (V) TJ=25°C 10 100 Fig.5 Maximum Non-Repetitive Peak Forward Surge Current Peak Forward Surge Current (A) Number of Cycles 8.3 ms Single Half Sine Wave (JEDEC Method)

https://www.microdiode.com Rev:2019A0 Page :3 Important Notice and Disclaimer Microdiode Electronics (Jiangsu) reserves the right to make changes to this document and its products and specifications at any time without notice. Customers should obtain and confirm the latest product information and specifications before final design,purchase or use. Microdiode Electronics (Jiangsu) makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, not does Microdiode Electronics (Jiangsu) assume any liability for application assistance or customer product design. Microdiode Electronics (Jiangsu) does not warrant or accept any liability with products which are purchased or used for any unintended or unauthorized application. No license is granted by implication or otherwise under any intellectual property rights of Microdiode Electronics (Jiangsu). Microdiode Electronics (Jiangsu) products are not authorized for use as critical components in life support devices or systems without express written approval of Microdiode Electronics (Jiangsu). Suggested Pad Layout E B d F W PA D D1D2 C T Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. Reel packing SMA 7" 2,000 4.0 4,000 183*155*183 178 382*356*392 160,000 16.0 PACKAGE REEL SIZE REEL COMPONENT SPACING BOX INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(m/m)(m/m)(m/m)(pcs)(m/m)(pcs) SMA 11" 5,000 4.0 10,000 290* 290*38 330 310*3 10*360 80,000 11.0 Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere RS1AG THRU RS1MG SMA 13" 7,500 4.0 15,000 335*335*38 330 350*330*360 120,000 14.5 unit:mm Item Symbol Tolerance SMA Carrier width A 0.1 2.80 Carrier length B 0.1 5.33 Carrier depth C 0.1 2.36 Sprocket hole d 0.05 1.50 13" Reel outside diameter D 2.0 330.00 13" Reel inner diameter D 1 min 50.00 7" Reel outside diameter D 2.0 178.00 7" Reel inner diameter D 1 min 62.00 Feed hole diameter D2 0.5 13.00 Sprocket hole position E 0.1 1.75 Punch hole position F 0.1 5.50 Punch hole pitch P 0.1 4.00 Sprocket hole pitch P0 0.1 4.00 Embossment center P1 0.1 2.00 Overall tape thickness T 0.1 0.28 Tape width W 0.3 12.00 Reel width W1 1.0 18.00 Symbol Unit (mm) Unit (inch) A 1.68 0.066 B 1.52 0.060 C 3.90 0.154 D 2.41 0.095 E 5.45 0.215