RS1JM TSC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

  • Ideal for automated placement - Compact package size - High surge current capability - Low power loss, high efficiency - Halogen-free according to IEC 61249-2-21 definition Molding compound, UL flammability classification rating 94V-0 Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test SYMBOL UNIT V RRM V VRMS V VDC V IF(AV) A trr ns TJ °C TSTG °C Document Number: DS_D1412007 Version: A14 1.3 Note 2: Reverse recovery test condition: IF=0.5A, IR=1.0A, IRR=0.25A Storage temperature range -55 to +150 Note 1: Pulse test with PW=300μs, 1% duty cycle °C/W Operating junction temperature range -55 to +150 A Maximum instantaneous forward voltage (Note 1) @ 1.0A VF V Typical thermal resistance RθJL RθJA Maximum reverse current @ rated VR @ TJ=25 °C @ TJ=125 °C IR Maximum reverse recovery time (Note 2) Maximum average forward rectified current 1 Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 20 600 800 560 Maximum DC blocking voltage 600 Marking code MECHANICAL DATA Case: Micro SMA Micro SMA Polarity: Indicated by cathode band Maximum repetitive peak reverse voltage RS1JM RS1KM R7 R9 RS1JM thru RS1KM Taiwan Semiconductor Surface Mount Fast Recovery Rectifiers

FEATURES

  • Moisture sensitivity level: level 1, per J-STD-020 - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC Weight: 6 mg (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER μA 150 250 500 800 Maximum RMS voltage 420

PART NO. Note 1: "x" defines voltage from 600V (RS1JM) to 800V (RS1KM) Note 2: Whole series with green compound (halogen free) PART NO. RS1JM (TA=25°C unless otherwise noted) Document Number: DS_D1412007 Version: A14 RS1JM RSG RS G PREFERRED PART NO. Green compound

DESCRIPTION

G PACKING CODE EXAMPLE RS1xM (Note 1, 2) PACKAGE 3,000 / 7" Plastic reel PACKING RS1JM thru RS1KM Taiwan Semiconductor PACKING CODE RS Micro SMA PACKING CODE SUFFIX RATINGS AND CHARACTERISTICS CURVES PACKING CODE SUFFIX

ORDERING INFORMATION

0.2 0.4 0.6 0.8 1.2 0 25 50 75 100 125 150 AVERAGE FORWARD CURRENT (A) LEAD TEMPERATURE (°C) FIG.1 MAXIMUM FORWARD CURRENT DERATING CURVE 11 0 1 0 0 PEAK FORWARD SURAGE CURRENT(A) NUMBER OF CYCLES AT 60 Hz FIG. 2 MAXIMUM FORWARD SURGE CURRENT 8.3ms Single Half Sine-Wave 0.1 INSTANTANEOUS FORWARD CURRENT (A) FORWARD VOLTAGE (V) FIG. 3 TYPICAL FORWARD CHARACTERISTICS TJ=125°C TJ=25°C RESISTIVE OR INDUVTIVE LOAD 0.01 0.1 100 10 20 30 40 50 60 70 80 90 100 INSTANTANEOUS REVERSE CURRENT (μA) PERCENT OF RATED PEAK REVERSE VOLTAGE(%) FIG. 4 TYPICAL REVERSE CHARACTERISTICS TJ=25°C TJ=125°C

A 2.30 2.70 0.091 0.106 B 2.10 2.30 0.083 0.091 C 0.63 0.73 0.025 0.029 D 0.10 0.20 0.004 0.008 E 1.15 1.35 0.045 0.053 F 0.65 0.85 0.026 0.034 G 1.15 1.35 0.045 0.053 H 0.75 0.95 0.030 0.037 I 1.10 1.50 0.043 0.059 J 0.55 0.75 0.022 0.030 K 0.55 0.75 0.022 0.030 L 0.65 0.85 0.026 0.034 P/N = Marking code YW = Date Code Document Number: DS_D1412007 Version: A14 RS1JM thru RS1KM Taiwan Semiconductor DIM. Unit (mm) Unit (inch) PACKAGE OUTLINE DIMENSIONS Micro SMA SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 1.1 0.043 B 2.0 0.079 C 0.5 0.020 MARKING DIAGRAM D 0.8 0.031 E 1.0 0.039 100 0.1 1 10 100 CAPACITANCE (pF) REVERSE VOLTAGE (V) FIG. 5 TYPICAL JUNCTION CAPACITANCE f=1.0MHz Vsig=50mVp-p

assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1412007 Version: A14 RS1JM thru RS1KM Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,