RS1A CHENG-YI | Alldatasheet

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-50 TO -800 VOLTS CURRENT -1.0 Amperes MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS0 Ratings at 25 C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, reistive or inductive load. For capacitive load, derate current by 20%. SURFACE MOUNT FAST SWITC HENG RECTIFI ER SURFACE MOUNT FAST SWITC HENG RECTIFI ER SYMBOLS Maximum Recurrent Peak Reverse Voltage VRRM VRMS VDC Maximum RMS Voltage Maximum DC Blocking Voltage UNITS V V V RS1A RS1B 100 100 RS1D 200 140 200 RS1G 400 280 400 Maximum Average Forward Rectified Current, at TL=90 C I(AV) A1.0 IFSM Peak Forward Surge Current 8.3 ms single half sine-wave superimposed on rated load (JEDEC Method) A30 RS1J 600 420 600 RS1K 800 560 800 Notes : 1. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A 2. Measured at 1.0 MHZ and Applied Vr=4.0 volts.2 3. 8.0mm (.013mm thick) land areas. T, TSTGJ Operating and Storage Temperature Range C-50 to +150 Maximum Thermal Resistance (Note 3) 32 0 C/WRJ L Typical Junction Capacitance (Note 2) Maximum Reverse Recovery Time (Note 1) TJ=25 C VF IR TRR CJ Maximum Instantaneous Forward Voltage at 1.0A 0TMaximum DC Reverse Current @ =25 CA 0Tat Rated DC Blocking Voltage @ =125 CA A nS V 5.0 150 150 250 500 1.30 12 pF .002(.051) .008(.203) .006(.152) .012(.305) .078(2.00) .096(2.44) .030(0.76) .060(1.52) .157(4.00) .181(4.60) .098(2.50) .114(2.90) .055(1.40) .062(1.60) .002(.051) .008(.203) .006(.152) .012(.305) .188(4.80) .208(5.28) .078(2.00) .096(2.44) .030(0.76) .060(1.52) .157(4.00) .181(4.60) .098(2.50) .114(2.90) .055(1.40) .062(1.60) SMA/DO-214AC RS1A thru RS1K Dimensions in inches and (millimeters)

FEATURES

For surface mounted applications Low profile package Built-in strain relief Easy pick and place Fast recovery times for high efficiency Plastic package has Underwriters Laboratory Flammability Classification 94V-O Glass passivated chip junction High temperature solderingo

260 C/10 seconds at terminals

Case: JEDEC DO-214AC molded plastic Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Indicated by cathode band Standard Packaging: 12mm tape (EIA-481) Weight: 0.002 ounces, 0.064 gram

RATING AND CHARACTERISTICS CURVES RS1A THRU RS1K CHENG- YICHENG- YI ELECTRONIC SURFACE MOUNT FAST SWITC HENG RECTIFI ER SURFACE MOUNT FAST SWITC HENG RECTIFI ER Fig. 3 - MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT 1 2 5 10 20 50 100 NUMBER OF CYCLES AT 60HZ PEAK FORWARD SURGE CURRENT, AMPERES 8.3ms Single Half Since-Wave JEDEC Method Fig. 5 - REVERSE RECOVERY TIME CHARACTERISTIC AND TEST CIRCUIT DIAGRAM Noninductive NON- Inductive NOTES:1. Rise Time=7ns max. Input Impedance=1 megohm. 22pF 2. Rise Time=10ns max. Source Impedance=50 Ohms. Noninductive D.U.T. OSCILLOSCOPE NOTE 1 PULSE GENERATOR NOTE 2

25 Vdc

(approx) (+) (+) SET TIME BASE FOR 10ns/cm 1cm -1.0 -0.25 +0.5A trr 1.6 1.4 1.2 1.0 AVERAGE FORWARD RECTIFIED CURRENT, AMPERES 20 40 60 80 100 120 140 160 180 Fig. 1 - FORWARD CURRENT DERATING CURVE o LEAD TEMPERATURE, C Fig. 2 - TYPICAL JUNCTION CHARACTERISTICS REVERSE VOLTAGE, Vdc 0.1 0.01 CAPACITANCE. (pF) 1 10 100 T =25CJ Fig. 4 - TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS INSTANTANEOUS FORWARD VOLTAGE, VOLTS SINGLE PHASE HALF W AVE 60HZ RESISTIVE OR INDUCTIVE LOAD P.C.B MOUNTED COPPER PAD AREAS RS1A thru RS1K Pulse Width=300 S 1% Duty Cycle T =25CJ