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@ T A = 25/c176C unless otherwise specified /c183 /c183 /c183 /c183 /c183 /c183 Mechanical Data /c183 /c183 /c183 /c183 RS1A-RS1M Built-in strain relief,ideal for automated placement Plastic package has underwriters laborator 1 flammabilityclassification 94V-0 For surface mounted applications High temperature soldering: 250 o C/10 seconds at terminals Low profile package Glass passivated chip junction Case:JEDEC DO-214AC,molded plastic over passivated chip Terminals:Solder plated, solderable per M IL-STD- 750, Method 2026 Polarity: color band denotes cathode end Weight: 0.002 ounces, 0.064 gram RS1D RS1G RS1J RS1K Maximum recurrent peak reverse voltage V RRM 200 400 600 800 V Max imu m RMS v olt age V RWS 140 280 420 560 V Maximum DC blocking voltage V DC 200 400 600 800 V Maximumaverage forword rectified current c @ T L =90 O C I F(AV) Peakforward surge current 8.3ms single c half-sine-wave superimposedon rated c load I FSM A Maximuminstantaneousforward voltage at 1.0A V F V M axim um DC reverse current @T A =25 o C atrated DCblocking voltage @T A =125 o C M axim um reverse recovery tim e (NOTE 1) t rr 250 ns Typical junction capacitance (NOTE 2) C J pF R JA R JL Operating junction and storage temperature range T J T STG o C 700 1000 50 100 RS1M 1000 50.0 1.30 5.0 105 I R NOTE: 1.Reverse recovery time test conditions:I F =0.5A,I R =1.0A,I rr =0.25A 2. Measured at 1.0MHz and applied rev erse v oltage of 4.0 Volts Typical thermal resitance (NOTE 3) ) copper padareas UNITS 50 100 o C/W RS1BRS1A 1.0 500150 30.0 7.0 A A 1of2
Lead Temperature ( Fig. 1 — Forward Current Derating Curve Average Forward Rectified Current (A) Fig. 3 — Typical Instantaneous Forward Characteristics Instantaneous Forward Voltage (V) Instantaneous Forward Current (A) Percent of Rated Peak Reverse Voltage (%) Instantaneous Reverse Current ( µ Fig. 4 — Typical Reverse Characteristics Fig. 6 — Typical Transient Thermal Impedance Number of Cycles at 60 H Z t, Pulse Duration (sec.) Fig. 2 — Maximum Non-Repetitive Peak Forward Surge Current Peak Forward Surge Current (A) Reverse Voltage (V) Junction Capacitance (pF) Transient Thermal Impedance ( CW) Fig. 5 — Typical Junction Capacitance 100 120 140 160 180 0.5 1.0 1.2 Resistive or Inductive Load 100 T L = 90 C 8.3ms Single Half Sine-Wave (JEDEC Method) 0.4 0.6 0.8 1.2 1.4 1.6 1.8 0.01 0.1 Pulse Width = 300 µ s 1% Duty Cycle 100 0.01 0.1 100 T J = 25 C f = 1.0MH Z Vsig = 50mVp-p 0.01 0.1 100 Mounted on 0.2 x 0.2" (5 x 5mm) Copper Pad Area Copper Pad Areas T J = 25 C T J = 100 C T J = 125 C T J = 125 C T J = 25 C 2of2