RPS183

RPS183 DFI | Alldatasheet

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Technical content

(RPS183-H610E) Bottom View Rear View (RPS183-H610E) Rear View (RPS183-Q670E) 100G 000G 300G 200G DC-in COM1 SATA 3.0 COM2 M.2 2280 M key PCIE Gen4x4 M.2 2230 E key SIM Card PCIe Gen 3 USB 3.2 Gen1 Header USB2.0 Type A (Vertical) HDMI M.2 2242/3042/3052 B key MXM Slot Line-out / Mic-in (Audio header by opt.) RPS183-Q670E RPS183-H610E 14th/13th/12th Gen Intel Core TM Mini-ITX KEY FEATURES DDR5 Wide Voltage Multiple Display Multiple Expansion Rich I/O

2 DDR5 SODIMM up to

Power input 19~24V 1 DP++(CPU), 1 DP++(MXM),

1 USB Type C(DP Alt-mode),

1 eDP(MXM), 1 internal HDMI(MXM) 1 PCIe x4 (side), 1 M.2 M Key, 1 M.2 E Key, 1 M.2 B Key

2 Intel

2.5GbE, up to 4 USB 3.2 Type A, up to 1 USB Type C Desktop 3 USB 3.2 Gen2 1 USB Type C 2 USB 3.2 Gen2

1 USB Type C

2 USB 3.2 Gen2 2 USB 2.0 4 USB 3.2 Gen2 DP++DP++ DP (MXM) DP (MXM) DC-inDC-in 2.5G LAN 2.5G LAN Line-out / Mic-in (Audio header by opt.) PCIe Gen3 x4 PCIe Gen3 x4 DP (MXM) DP (MXM)

4.90 45.39 123.39 136.98 159.84 31.35 188.83 31.35 98.61 176.61 188.83 195 170 13.5326 www.dfi.com MECHANICAL DRAWING BLOCK DIAGRAM Intel Q670E/ H610E Chipset Channel A SATA 3.0 SMBus SPI eSPI DDI DDI PCIE x 4 HDA Audio Jack (Line out & Mic in) co-lay header(opt.) DDR5 4800MHz SODIMM DP++ SATA 1x SIM SPI BIOS 80 port Header SMBus TPM 2.0 NPCT760AABYX DP++ Type-C RJ45 / 2.5G LAN1 RJ45 / 2.5G LAN2 USB 2.0 Vertical I219LM/V I226V PCIe x4 Realtek ALC888 Super IO IT8786 with WDT Fan Control Case Open H/W Monitor DMI 4.0 INTEL DT Raptor Lake-S LGA 1700 Desktop ECC-ram Channel B DDR5 4800MHz SODIMM DP to HDMI HDMI Vertical eDP Panel eSPI IT8855 MDI MDI PCIe x1 / GbE PCIe x1 PCIe x16 PCIe x4 PCIe x1 PCIe x1 USB 3.2 Gen1 PCIe x1 / CNVi SATA 3.0 SATA 3.0 USB 2.0 USB 2.0 USB 2.0 MXM 3.1 MUX MUX uPD720202K8 USB3.2 Gen1 2x Internal Header M.2 E Key 2230 M.2 B Key 2242/3042/3052 M.2 M Key 2280 CPU FAN 1x System FAN 2x I2CEXT OOB SPI Front panel 8 bit DIO header Port_B Port_D Port_A H610E Only Q670E Only USB 3.2 Gen2 / USB 2.0 USB 3.2 Gen2 USB 3.2 Gen2 USB 2.0 USB 3.2 Gen1 USB 3.2 Gen1 USB 3.2 Gen2 2x USB 2.0 2x USB 3.2 Gen2 USB 2.0 USB 2.0 co-lay USB 3.2 Gen2 2x COM1/2 RS232/422/485 2x w/ Power

www.dfi.com SPECIFICATION Model Name RPS183-Q670E RPS183-H610E SYSTEM Processor 14th Generation Intel LGA 1700 Socket Processors, TDP support up to 65W Intel Core™ I9-14900 (24 Cores, 36M Cache, up to 5.8 GHz); 65W Intel Core™ I9-14900T (24 Cores, 36M Cache, up to 5.5 GHz); 35W Intel Core™ I7-14700 (20 Cores, 33M Cache, up to 5.4 GHz); 65W Intel Core™ I7-14700T (20 Cores, 33M Cache, up to 5.2 GHz); 35W Intel Core™ I5-14500 (14 Cores, 24M Cache, up to 5.0 GHz); 65W Intel Core™ I5-14500T (14 Cores, 24M Cache, up to 4.8 GHz); 35W Intel Core™ I5-14400 (10 Cores, 20M Cache, up to 4.7 GHz); 65W Intel Core™ I5-14400T (10 Cores, 20M Cache, up to 4.5 GHz); 35W Intel Core™ I3-14100 (4 Cores, 12M Cache, up to 4.7 GHz); 60W Intel Core™ I3-14100T (4 Cores, 12M Cache, up to 4.4 GHz); 35W Intel 300 (2 Cores,6M Cache, 3.9 GHz); 46W Intel 300T (2 Cores, 4M Cache, 3.4 GHz); 35W 13th Generation Intel LGA 1700 Socket Processors, TDP support up to 65W Intel Core™ I9-13900E (24 Cores, 36M Cache, up to 5.2 GHz); 65W Intel Core™ I9-13900TE (24 Cores, 36M Cache, up to 5.0 GHz); 35W Intel Core™ I7-13700E (16 Cores, 30M Cache, up to 5.1 GHz); 65W Intel Core™ I7-13700TE (16 Cores, 30M Cache, up to 4.8 GHz); 35W Intel Core™ I7-13700T (16 Cores, 30M Cache, up to 4.9 GHz); 35W Intel Core™ I5-13500E (14 Cores, 24M Cache, up to 4.6 GHz); 65W Intel Core™ I5-13500TE (14 Cores, 24M Cache, up to 4.5 GHz); 35W Intel Core™ I5-13500T (14 Cores, 24M Cache, up to 4.6 GHz); 35W Intel Core™ I5-13400E (10 Cores, 20M Cache, up to 4.6 GHz); 65W Intel Core™ I3-13100E (4 Cores, 12M Cache, up to 3.3 GHz); 60W Intel Core™ I3-13100TE (4 Cores, 12M Cache, up to 4.1 GHz); 35W Intel Core™ I3-13100T (4 Cores, 12M Cache, up to 4.2 GHz); 35W 12th Generation Intel LGA 1700 Socket Processors, TDP support up to 65W Intel Core™ i9-12900E (16 Cores, 30M Cache, up to 5.0 GHz); 65W Intel Core™ i9-12900TE (16 Cores, 30M Cache, up to 4.8 GHz); 35W Intel Core™ i7-12700E (12 Cores, 25M Cache, up to 4.8 GHz); 65W Intel Core™ i7-12700TE (12 Cores, 25M Cache, up to 4.6 GHz); 35W Intel Core™ i5-12500E (6 Cores, 18M Cache, up to 4.5 GHz); 65W Intel Core™ i5-12500TE (6 Cores, 18M Cache, up to 4.3 GHz); 35W Intel Core™ i3-12100E (4 Cores, 12M Cache, up to 4.2 GHz); 60W Intel Core™ i3-12100TE (4 Cores, 12M Cache, up to 4.0 GHz); 35W Intel Pentium G7400E (2 Cores, 6M Cache, 3.6 GHz); 46W Intel Pentium G7400TE (2 Cores, 6M Cache, 3.0 GHz); 35W Intel Celeron G6900E (2 Cores, 4M Cache, 3.0 GHz); 46W Intel Celeron G6900TE (2 Cores, 4M Cache, 2.4 GHz); 35W Chipset Intel Q670E Chipset Intel H610E Chipset Memory 2x 262-pin SODIMM up to 64GB Dual Channel DDR5 4800MHz 2x 262-pin SODIMM up to 64GB Dual Channel DDR5 4800MHz BIOS AMI SPI 256Mbit AMI SPI 256Mbit GRAPHICS Controller Intel UHD Graphics 700 series Intel UHD Graphics 700 series Feature OpenGL 4.5, DirectX 12, OpenCL 2.1 HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9 HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9 OpenGL 4.5, DirectX 12, OpenCL 2.1 HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9 HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9 Display 1 x DP++(CPU): Resolution up to 4096x2304 @ 60Hz 1 x DP++(MXM): Resolution by MXM 1 x USB Type C: DP Alt-mode, Resolution up to 4096x2304 @60Hz 1 x eDP(MXM): Resolution by MXM 1 x Internal HDMI: Resolution by MXM 1 x DP++(CPU): Resolution up to 4096x2304 @ 60Hz 1 x DP++(MXM): Resolution by MXM 1 x USB Type C: DP Alt-mode, Resolution up to 4096x2304 @60Hz 1 x eDP(MXM): Resolution by MXM 1 x Internal HDMI: Resolution by MXM Multiple Display 1 DP++(CPU) + 1 DP++(MXM) + 1 USB Type C(DP Alt-mode) + 1 eDP(MXM) + 1 internal HDMI(MXM)

1 DP++(CPU) + 1 DP++(MXM)

+ 1 USB Type C(DP Alt-mode) + 1 eDP(MXM) + 1 internal HDMI(MXM) EXPANSION Interface 1 x PCIe Gen 3 x4 (Locate at board side) 1 x M.2 2280 M Key (PCIE Gen3x4, SATA3) 1 x M.2 2230 E Key (PCIE Gen3x1, USB 2.0, support Intel CNVi) 1 x MXM Type-A/B/B+ 1 x M.2 2242/3042/3052 B Key (PCIE Gen3x1, USB 3.2 Gen2, USB 2.0) 1 x M.2 2280 M Key (PCIE Gen3x4, SATA3) 1 x M.2 2230 E Key (PCIE Gen3x1, USB 2.0, support Intel CNVi) 1 x MXM Type-A/B/B+ 1 x M.2 2242/3042/3052 B Key (PCIE Gen3x1, USB 3.2 Gen1, USB 2.0) AUDIO Audio Codec Realtek ALC888S Realtek ALC888S ETHERNET Controller 1 x Intel I226LM(vPro)(10/100/1000/2500Mbps) 1 x Intel I226V (10/100/1000/2500Mbps) 1 x Intel I219V (10/100/1000/2500Mbps) 1 x Intel I226V (10/100/1000/2500Mbps) REAR I/O Ethernet 2 x 2.5GHz RJ45 2 x 2.5GHz RJ45 USB 4 x USB 3.2 Gen2 or 3 x USB 3.2 Gen2 + 1 x USB Type C 2 x USB 3.2 Gen2 + 2 x USB 2.0 or 2 x USB 3.2 Gen2 + 1 x USB Type C Display 1 x DP++, 1 DP++(MXM) 1 x USB Type C 1 x DP++, 1 DP++(MXM) 1 x USB Type C

www.dfi.com SPECIFICATION Model Name RPS183-Q670E RPS183-H610E REAR I/O Audio 1 Audio Jack (Line-out/Mic-in) (Audio header by opt.)

1 Audio Jack (Line-out/Mic-in)

(Audio header by opt.) INTERNAL I/O USB 2 x USB 3.2 Gen1 Header 1 x USB 2.0 Type A 2 x USB 3.2 Gen1 Header 1 x USB 2.0 Type A Display 1 x eDP(MXM) 1 x HDMI(MXM) 1 x eDP(MXM) 1 x HDMI(MXM) Serial 2 x RS-232/422/485 2 x RS-232/422/485 SATA 1 x SATA 3.0 1 x SATA 3.0 DIO 1 x 8-bit DIO (BOX HEADER 1*10P/1.00mm) 1 x 8-bit DIO (BOX HEADER 1*10P/1.00mm) SPI 1 x SPI (BOX HEADER 1*6P/1.25mm) 1 x SPI (BOX HEADER 1*6P/1.25mm) I2C 2 x I2C (BOX HEADER, 1*8P/1.0m) 2 x I2C (BOX HEADER, 1*8P/1.0m) FAN 1 x CPU, 2 x System (WAFER,1*4P/1.25mm) 1 x CPU, 2 x System (WAFER,1*4P/1.25mm) WATCHDOG TIMER Output & Interval System Reset, Programmable via Software from 1 to 255 Seconds System Reset, Programmable via Software from 1 to 255 Seconds SECURITY TPM dTPM (default) fTPM (option) dTPM (default) fTPM (option) POWER Type DC IN DC IN Connector 4-pin Terminal 19~24V DC-In 4-pin Terminal 19~24V DC-In Consumption Idle: i9-13900E 65W with MXM A4500: Max: i9-13900E 65W with MXM A4500: 19V @ 14.73A (279.87W) Idle: i9-13900E 65W with MXM A4500: Max: i9-13900E 65W with MXM A4500: 19V @ 14.73A (279.87W) Idle: i9-13900E 65W : Max: i9-13900E 65W: 24V @ 6.40A (153.60W), 19V @ 8.08A (153.52W) Idle: i9-13900E 65W : Max: i9-13900E 65W: 24V @ 6.40A (153.60W), 19V @ 8.08A (153.52W) RTC Battery CR2032 Coin Cell CR2032 Coin Cell OS SUPPORT Microsoft Windows 10 IoT Enterprise 64-bit Windows 11 L TSC Windows 10 IoT Enterprise 64-bit Windows 11 L TSC Linux Linux Ubuntu 22.04 Linux Ubuntu 22.04 ENVIRONMENT Temperature Operating w/o MXM: -5°C ~ 65°C Operating w/i MXM: By MXM spec Storage: -40°C ~ 85°C Operating w/o MXM: -5°C ~ 65°C Operating w/i MXM: By MXM spec Storage: -40°C ~ 85°C Humidity Operating: 5% ~ 90% RH Storage: 5% ~ 90% RH Operating: 5% ~ 90% RH Storage: 5% ~ 90% RH MTBF RPS183-Q670E 480,169 hrs @ 25°C; 281,641 hrs @ 45°C; 182,084 hrs @ 60°C; Calculation model: Telcordia Issue 4 Environment: GB, GC – Ground Benign, Controlled RPS183-H610E 480,169 hrs @ 25°C; 281,641 hrs @ 45°C; 182,084 hrs @ 60°C; Calculation model: Telcordia Issue 4 Environment: GB, GC – Ground Benign, Controlled MECHANISM Dimensions 195mm (7.7") x 170mm (6.7") 195mm (7.7") x 170mm (6.7") Height PCB: 1.6mm Top Side: 26.0mm(Audio); 25.79mm(RJ45) Bottom Side: 13.53mm PCB: 1.6mm Top Side: 26.0mm(Audio); 25.79mm(RJ45) Bottom Side: 13.53mm CERTIFICATION Certification CE, FCC, RoHS CE, FCC, RoHS

www.dfi.com PACKING LIST OPTIONAL ITEMS

ORDERING INFORMATION

Model Name P/N Description Active Thermal Solution(65W) A71-101137-000G Thermal solution (For 65W, Height: 46mm) Active Thermal Solution(35W) A71-101136-000G Thermal solution (For 35W, Height: 39mm) PSU(450W, 24V) TBD Meanwell HRP-450-24 Power adapter (360W, 24V) TBD Meanwell GST360B24-C6P Power adapter (160W, 24V) 671-116005-000G Meanwell GST160A24-DFIA Power terminal converting cable (Spade-to-Phoenix 4P) TBD 20cm, for Meanwell HRP-450-24 Power terminal converting cable (ATX 6P-to-Phoenix 4P) TBD 20cm, for Meanwell GST360B24-C6P Power terminal converting cable (DC5.5-to-ATX 2x2P) A81-004110-009G 20cm, for Meanwell GST160A24-DFIA

• 1 RPS183 motherboard
• 1 Serial ATA data cable (Length: 500mm)
• 1 I/O shield (P/N: TBD)
• 3 M.2 screw/standoff DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © December 26, 2024 DFI Inc. Model Name P/N Memory Rear I/O Internal I/O TPM Power Operating Temp.Display 2.5 GbE USB M.2 Display USB RPS183-H610EDB 770-RPS1831-000G

2 DDR5 2 DP*++ 2

2 USB 3.2 Gen2,

1 M/B/E Key 1 eDP*,

1 HDMI*

2 USB 3.2 Gen1, 1 USB 2.0 Type A w/TPM 19~24VDC -5 to 65°C RPS183-Q670EDB 770-RPS1831-100G 3 USB 3.2 Gen2, RPS183-H610EDB 770-RPS1831-200G 2 USB 3.2 Gen2, 2 USB 2.0 Type A RPS183-Q670EDB 770-RPS1831-300G 4 USB 3.2 Gen2 (NOTE: * Full functionality requires MXM implementation)