RMT3170HB48F9W-1866

RMT3170EB68F9W-1600 RAMAXEL | Alldatasheet

Document overview

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Technical content

Ver1.0/Jun.12 1/9 ƹDESCRIPTION The Ramaxel RMT3170EB68F9W-1600 memory module fam ily are low profile Unbuffered SODIMM modules with 30.00mm height based DDR3 technology. DIMMs are available as No-ECC (x64) modules. The module family based on 8 (x64) x8 DDR3 DRAM c omponents, and the DIMMs feature serial presence detect based on a serial EEPROM device. ƹFEATURE ƽ 204-pin Dual-in-line DDR3 memory module. ƽ JEDEC Standard with 1.35V (±0.075 V) power supply ƽ 1 Rank Organizations based x8 DDR3 DRAM components ƽ Fast data transfer rates: PC3(L)-12800 ƽ Differential data strobe (DQS, DQS#) option ƽ Differential clock inputs (CK,CK#) ƽ Commands entered on each rising CK edge ƽ Eight-bit pre-fetch architecture ƽ DQS edge-aligned with data for READs ƽ DQS center-aligned with data for WRITEs ƽ DLL to align DQ and DQS transitions with CK ƽ Data mask (DM) for masking write data ƽ Programmable burst lengths: 4 or 8 ƽ Adjustable data-output drive strength ƽ Concurrent auto pre-charge option is supported ƽ Auto Refresh (CBR) and Self Refresh Mode ƽ ZQ calibration ƽ On-die termination (ODT) ƽ Serial Presence Detect (SPD) with EEPROM ƽ Gold edge contacts ƽ For contact pads, electrolytic gold plating 0.76 micrometer minimum. ƽ Halogen-free

Ver1.0/Jun.12 2/9 ƹƹ ƹƹPART NUMBER DECODER R M T 317 0 E B 68 F 9 W- 1600 Ramaxel Module Module Type Max Speed: 800: 800MHz R:240pin DDR3 Unbufferd DIMM 1066: 1066MHz T:204pin DDR3 Unbufferd SO-DIMM 1333: 1333MHz 1600: 1600MHz PCB Number 1866: 1866MHz ECC: F: FBGA 0: Without ECC W: WBGA 1: With ECC DRAM Vendor: Module Density M: Micron 5: 256MB H: Hynix 6: 512MB S: Infineon 7: 1GB L: Longmax 8: 2GB E: Elpida 9: 4GB K: Samsung SSTL: (Refer to DRAM manufacturer) F:1.35V & 1.5V DRAM Density: 18: 128Mb (16M*8b) 28: 256Mb (32M*8b) 38: 512Mb (64M*8b) 48: 1Gb (128M*8b) 58: 2Gb (256M*8b) 68: 4Gb (512M*8b)

Ver1.0/Jun.12 3/9 ƹPINOUT, PIN LOCATION and FUNCTIONAL DESCRIPTION PINOUT $$ %&'# /0$ 10!+ ! +, -2 ) !($-0! +5(*5 5 +35 -.* !" "60!(--+ !!5076) % $$ % - )(**! 26 !/- 4 $-0$7 $$ % - 6 50$(0 $+ !0!

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Ver1.0/Jun.12 5/9 ƹCOMMAND TRUTH TABLE

Ver1.0/Jun.12 6/9 ƹƹ ƹƹBLOCK DIAGRAM

Ver1.0/Jun.12 7/9 ƹABSOLUTE MAXIMUM RATING ƹOPERATING TEMPERATURE and DC/AC OPERATING CONDITION OPERATING TEMPERATURE Note: Operating Temperature TOPER is the case surface temperature on the center / top side of the DRAM for measurement conditions. DC/AC OPERATING CONDITION Recommended DC Operating Conditions - DDR3L (1.35V) operation Recommended DC Operating Conditions - DDR3 (1.5V) operation

Ver1.0/Jun.12 8/9 Single Ended AC and DC Input Levels for Command and ADDress Single Ended AC and DC Input Levels for DQ and DM

Ver1.0/Jun.12 9/9 ƹDIMENSIONS (Unit: mm) Note: Tolerances on all dimensions +-0.15 unless otherwise specified.