RMPA61810 FAIRCHILD | Alldatasheet

Document overview

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Technical content

Features

  • 21dB Typical Small Signal Gain
  • 2.0:1 Typical Input VSWR, 2.5:1 Typical Output VSWR
  • 31dBm Output Power at 1dB Gain Compression
  • 32dBm Output Power at 3dB Gain Compression
  • 22% Typical Power Added Efficiency at 1dB Gain Compression
  • Chip size: 6.55mm x 2.67mm x 0.1mm Absolute Ratings

Electrical Characteristics

(Operated at 25°C, 50 Ω system, Vd = +8V, quiescent current (Idq = 600 mA) Note: 1. Typical range of the negative gate voltage is -1 to 0V to set a typical Idq of 600 mA. Symbol Parameter Ratings Units Vd Positive Drain DC Voltage 8.5 V Vg Negative DC Voltage -2 V Vdg Simultaneous (Vd–Vg) +10.5 V Pin RF CW Input Power (50 Ω source) 27 dBm Id Drain Current 1.2 A T STG Storage Temperature -55 to +125 °C Tc Operating Baseplate Temperature -40 to +85 °C R JC Thermal Resistance (Channel to Backside) 12 °C/W Parameter Min Typ Max Units Frequency Range 6.0 18.0 GHz Small Signal Gain 15 21 dB P1dB Compression 28 31 dBm P3dB Compression 30 32 dBm PAE at 1dB Gain Compression 12 22 % Input Return Loss 9.5 dB Output Return Loss 7.4 dB Gate Voltage (Vg) -0.4 V Gain vs. Temp. 0 ~ 85°C -0.025 dB/°C Device

(1) 1 mil gold bond wires are used on the carrier assembly. 100 pF (single layer) are used on the carrier. oscillations caused by the test fixture connections. current limits on supplies to RF drive-up current level. Figure 3. Recommended Application Schematic Circuit Diagram *Vg and Vd on both sides of the MMIC must be biased to insure proper operation.

Figure 4. Recommended Assembly and Bonding Diagram AMPLIFIER. THIS AMPLIFIER IS AN ESD SENSITIVE DEVICE.

4 Places

2 Places

Vg, if needed, to maintain the drain current at Ids.

©2004 Fairchild Semiconductor Corporation RMPA61810 Rev. B RMPA61810 Typical Characteristics The above data is derived from fixtured measurements which includes 3 parallel, 1 mil diameter, 15 mil long, gold bond wires connected to the RF input and output. The Id @ 1 dB compression increases to approximately 1A. The DC supply should be able to support the required current to achieve the above performance. 468 1 0 1 2 1 4 1 6 1 8 2 01 0 1 2 1 4 1 6 1 8 2 0 FREQUENCY (GHz) FREQUENCY (GHz) FREQUENCY (dB) 468 468 1 0 12 14 16 18 20 FREQUENCY (GHz) 468 1 0 12 14 16 18 20 S11 S22 Small Signal Gain Vd = 8.0V, Idq = 600mA Output Power @ 1dB Compression Vd = 8.0V, Idq = 600mA Input & Output Return Loss Vd = 8.0V, Idq = 600mA Power Added Efficiency @ P1dB Vd = 8.0V, Idq = 600mA

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY , FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Preliminary No Identification Needed Obsolete This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Formative or In Design First Production Full Production Not In Production ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC OPTOPLANAR™ PACMAN™ FACT Quiet Series™ FAST FASTr™ FPS™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ I 2C™ ImpliedDisconnect™ Rev. I9 ACEx™ ActiveArray™ Bottomless™ CoolFET™ CROSSVOLT ™ DOME™ EcoSPARK™ E 2CMOS™ EnSigna™ FACT™ POP™ Power247™ PowerSaver™ PowerTrench QFET  QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ SILENT SWITCHER SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic TINYOPTO™ TruTranslation™ UHC™ UltraFET VCX™ Across the board. Around the world.™ The Power Franchise Programmable Active Droop™