RMCG SEI | Alldatasheet
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Technical content
Rev Date: 11/18/2020 1 www.seielect.com This specification may be changed at any time without prior notice . marketing@seielect.com Please confirm technical specifications before you order and/or use. RMCG Series Gold Barrier Thick Film Chip Resistors Stackpole Electronics, Inc. Resistive Product Solutions Features:
- Gold terminations are completely impervious to sulfur
- Zero ohm available (max resistance 0.05Ω)
- RoHS compliant and halogen free
- REACH compliant Electrical Specifications -0/+600 ± 350 ± 200 ± 350 ± 350 ± 200 ± 350 ± 350 ± 250 ± 200 ± 250 ± 350 ± 350 ± 250 ± 200 ± 250 ± 350 ± 350 ± 250 ± 200 ± 250 ± 350 ± 350 1 - 2 ± 250 2.2 - 9.1 ± 200 ± 250 ± 350 ± 350 ± 250 ± 200 ± 250 ± 350 Ohmic Range (Ω) and Tolerance (1) Lesser of or maximum working voltage. 1.1M - 5.1M 1.1M - 5.1M 5.6M - 10M 10 - 1M 5.6M - 10M 1 - 3.6 3.9 - 9.1 400 RMCG2010 RMCG2512 1 10 - 1M 1 - 3.6 3.9 - 9.1 0.75 RMCG0603 0.1 50 100 0.33 200 200 150RMCG0805 0.125 RMCG1206 0.25 RMCG1210 400 400 1 - 3.6 300 200 3.9 - 9.1 1.1M - 5.1M 5.6M - 10M 1 - 3.6 3.9 - 9.1 1.1M - 5.1M 5.6M - 10M 10 - 1M 10 - 1M 200 400 3.9 - 9.1 1 - 3.6 3.9 - 9.1 1.1M - 5.1M 5.6M - 10M 10 - 1M 1 - 9.1 1.1M - 10M 10 - 1M 1% 2%, 5% 1 - 3.6 TCR (ppm/ºC)Type / Code Power Rating (W) @ 70ºC Maximum Working Voltage (V) (1) Maximum Overload Voltage (V) RMCG0402 50 1000.1 10 - 1M 1.1M - 10M √ P*R
Rev Date: 11/18/2020 2 www.seielect.com This specification may be changed at any time without prior notice . marketing@seielect.com Please confirm technical specifications before you order and/or use. RMCG Series Gold Barrier Thick Film Chip Resistors Stackpole Electronics, Inc. Resistive Product Solutions Performance Characteristics Mechanical Specifications Test Test Conditions (JIS C 5202) Test Results Short Time Overload 2.5x rated voltage for 5 seconds ± (2% + 0.1 Ω) Dielectric Withstanding Voltage 100 VAC, 1 minute ± (1% + 0.05 Ω) Resistance to Soldering Heat 260ºC ± 5ºC, for 10 seconds ± 0.5 seconds (solder bath) ± (1% + 0.05 Ω) Solderability 245ºC ± 5ºC, for 3 seconds ± 0.5 seconds (colophonium flux) 95% coverage, minimum -55ºC: 30 minutes 25ºC: 2 to 3 minutes ± (1% + 0.05 Ω) 125ºC: 30 minutes 25ºC: 2 to 3 minutes Jumper (< 0.05 Ω) 60ºC ± 2ºC, 90% RH, Rated Load ± (3% + 0.1 Ω) 90 minutes On, 30 minutes Off (1000 hours -0 hours +48 hours) Jumper (< 0.05 Ω) 70ºC ± 2ºC, Rated Load ± (3% + 0.1 Ω) 90 minutes On, 30 minutes Off (1000 hours -0 hours +48 hours) Jumper (< 0.05 Ω) Voltage Coefficient 1/10 rated voltage for 3 second, then rated voltage for 3 seconds ± 100 (ppm/V) Robustness of Termination Bend of 3 mm for 5 ± 1 seconds ± (1% + 0.05 Ω) Operating Temperature Range: -55ºC to +125ºC (0402) -55ºC to +155ºC (0603 - 2512) Endurance (Rated load) Temperature Cycle (100 cycles) Endurance (Damp load) RMCG0402 RMCG0603 Type / Code RMCG2512 RMCG0805 RMCG1206 RMCG1210 RMCG2010 L Body Length W Body Width b Bottom Termination H Body Height a Top Termination Unit
Rev Date: 11/18/2020 3 www.seielect.com This specification may be changed at any time without prior notice . marketing@seielect.com Please confirm technical specifications before you order and/or use. RMCG Series Gold Barrier Thick Film Chip Resistors Stackpole Electronics, Inc. Resistive Product Solutions Power Derating Curve: Recommended Solder Profile This information is intended as a reference for solder profiles for Stackpole resistive components. These profiles should be compatible with most soldering processes. These are only recommendations. Actual numbers will depend on board density, geometry, packages used, etc., especially those cells labeled with “*”. 100% Matte Tin / RoHS Compliant Terminations Soldering iron recommended temperatures: 330°C to 350°C with minimum duration. Maximum number of reflow cycles: 3. Wave Soldering Description Maximum Recommended Minimum Preheat Time 80 seconds 70 seconds 60 seconds Temperature Diff. 140°C 120°C 100°C Solder Temp. 260°C 250°C 240°C Dwell Time at Max. 10 seconds 5 seconds * Ramp DN (°C/sec) N/A N/A N/A Temperature Diff. = Defference between final preheat stage and soldering stage. Convection IR Reflow Description Maximum Recommended Minimum Ramp Up (°C/sec) 3°C/sec 2°C/sec * Dwell Time > 217°C 150 seconds 90 seconds 60 seconds Solder Temp. 260°C 245°C * Dwell Time at Max. 30 seconds 15 seconds 10 seconds Ramp DN (°C/sec) 6°C/sec 3°C/sec *
Rev Date: 11/18/2020 4 www.seielect.com This specification may be changed at any time without prior notice . marketing@seielect.com Please confirm technical specifications before you order and/or use. RMCG Series Gold Barrier Thick Film Chip Resistors Stackpole Electronics, Inc. Resistive Product Solutions RoHS Compliance Stackpole Electronics has joined the worldwide effort to reduce the amount of lead in electronic components and to meet the v arious regulatory requirements now prevalent, such as the European Union’s directive regarding “Restrictions on Hazardous Substances” (RoHS 3). As part of this ongoing program, we periodically update this document with the status regarding the availability o f our compliant components. All our standard part numbers are c ompliant to EU Directive 201 1/65/EU of the European Parliament as amended by Directive (EU) 2015/863/EU as regards the list of restricted substances. “Conflict Metals” Commitment We at Stackpole Electronics, Inc. are joined with our industry in opposing the use of metals mined in the “conflict region” of the Eastern Democratic Republic of the Congo (DRC) in our products. Recognizing that the supply chain for metals used in the electronics industry is very complex, we work closely with our own suppliers to verify to the extent possible that the materials and products we supply do not contain metals sourced from this conflict region. As such, we are in compliance with the requirements of Dodd-Frank Act regarding Conflict Minerals. Compliance to “REACH” We certify that all passive components supplied by Stackpole Electronics, Inc. are SVHC (Substances of Very High Concern) free and compliant with the requirements of EU Directive 1907/2006/EC, “The Registration, Eval uation, Authorization and Restriction of Chemicals”, otherwise referred to as REACH. Contact us for complete list of REACH Substance Candidate List. Recommended Lead Free Resistor Reflow Profile RoHS Compliance Status RMCG Gold Barrier Thick Film Surface Mount Chip Resistor SMD YES(1) 100% Matte Sn over Ni Jan-06 06/01 Lead-Free Mfg. Effective Date (Std Product Series) Lead-Free Effective Date Code (YY/WW) Note (1): RoHS Compliant by means of exemption 7c-I. Standard Product Series
Description
Rev Date: 11/18/2020 5 www.seielect.com This specification may be changed at any time without prior notice . marketing@seielect.com Please confirm technical specifications before you order and/or use. RMCG Series Gold Barrier Thick Film Chip Resistors Stackpole Electronics, Inc. Resistive Product Solutions 1 2 3 4 5 6 7 8 9 10 11 12 13 14 R M C G 0 4 0 2 J T 4 K 7 0 Environmental Policy It is the policy of Stackpole Electronics, Inc. (SEI) to protect the environment in all localities in which we operate. We continually strive to improve our effect on the environment. We observe all applicable laws and regulations regarding the protection of our environment and all requests related to the environment to which we have agreed. We are committed to the prevention of all forms of pollution. How to Order Resistance Value Code Description Size W Code Tol Code Description Size RMCG Gold Termination 0402 0.1 F 1% 0402 0603 0.1 G 2% 0603, 0805 0805 0.125 J 5% 1206, 1210 1206 0.25 3.9 ohm = 3R90 1210 0.333 10 Kohm = 10K0 2010 0.75 1.1 Mohm = 1M10 2512 1 7" Reel Paper TapeT 7" Reel Plastic Tape 2010, 2512 Product Series Tolerance Four characters with the multiplier used as the decimal holder. PackagingSize