RMB12F JUXING | Alldatasheet
Document overview
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Technical content
Features
Ideal for automated placement Glass passivated chip junction Low forward voltage drop Low leakage current High forward surge capability High temperature soldering： 260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC Mechanical Date Case: MBF Molded plastic over glass passivated chip Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D Polarity: Polarity symbols marked on body Maximum Ratings & Thermal Characteristics & Electrical Characteristics A = 25 °C unless otherwise noted) Symbol RMB12F RMB14F RMB16F UNIT V RRM 200 400 600 V V RMS 140 280 420 V V DC 200 400 600 V Maximum average forward output rectified current at T A =30℃ I F(AV) A I FSM A V F V I R μA t rr 250 nS R θJA ℃/W T J , T STG Operating junction and storage temperature range –55 to +150 80Thermal resistance per leg (Note:1) Maximum DC reverse current at rated DC blocking voltage per leg T A = 25 ℃ T A = 125℃ 5.0 100 Maximum reverse recovery time at IF = 0.5 A , IR = 1.0 A , Irr = 0.25 A 150 Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load(JEDEC Method) 30 Maximum instantaneous forward voltage drop per leg at 1.0A 1.25 Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage T j max. 150 °C t rr 150nS,250nS V F 1.25V I F(AV) 1.0A V RRM 200-600V I FSM 30 A I R 5.0 μA http://www.trr-jx.com SURFACE MOUNT BRIDGE RECTIFIERS
A =25 ℃ unless otherwise noted) http://www.trr-jx.com RMB12F-RMB16F SURFACE MOUNT BRIDGE RECTIFIERS