RMASMNT1492ATF03 WALSIN | Alldatasheet
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Technical content
Page 1 of 17 ASC_RMASMNT1492ATF03_V02 Dec. 2016 RF Switch Series SP16T MIPI Antenna Switch Module Any 2G/3G/4G Handset Application P/N: RMASMNT1492ATF03 *Contents in this sheet are subject to change without prior notice.
Page 2 of 17 ASC_RMASMNT1492ATF03_V02 Dec. 2016
FEATURES
Low Insertion Loss and Low Distortion：： Broadband frequency range：0.4 to 2.7 GHz High Isolation and linearity：： Integrated MIPI RFFE Slave Controller： High ESD tolerance of 2kV HBM at all pins： Small LGA(24-pin, 2.5 x 3.3 x 0.78 mm3) package： Moisture Sensitive Level 3 (MSL3)：
Description
The RMASMNT1492ATF03 is a Single Pole, Sixteen Throw (SP1 6T) antenna switch with an integrated Mobile Industry Processor Interface (MIPI) controller. Using an advanced switching technology, the RMASMNT1492ATF03 maintains low insertion and high isolation, which mak es it an ideal choice for UMTS, CDMA2000, EDGE, GSM, and LTE applications. The design integrated two GSM transmit ports and fourteen low loss TRX ports. The switch also has an excellent 2nd/3rd Order Intermodulation Distortion (IMD2/IMD3) performance. Switching is controlled by the MIPI decoder and High ESD tolerance of 2kV HBM at all pins. No blocking capacitor requirements on the RF paths as long as no DC voltage are applied. The RMASMNT1492ATF03 is manufactured in a compact, 2.5 x 3.3 x 0.78 mm3 package. The functional block diagram is shown in Figure 1. The pin assignment and package are shown in Figure 2. Signal pin assignments and functional pin descriptions are provided in Table 1. Application 2G/3G/4G multimode cellular handsets (LTE, UMTS, CDMA2000, EDGE, GSM, TDD-LTE, TD-SCDMA) Block Diagram and Pin Out (Top View) Figure 1. RMASMNT1492ATF03 Block Diagram Figure 2. RMASMNT1492ATF03 Pin assignment
Table 1. RMASMNT1492ATF03 Pin Descriptions
1 ANT Antenna port 13 TRX14 RF path 14
2 TRX7 RF path 7 14 TRX2 RF path 2
3 TRX6 RF path 6 15 TRX1 RF path 1
4 TRX5 RF path 5 16 TRX12 RF path 12
5 TRX4 RF path 4 17 TRX11 RF path 11
6 TRX3 RF path 3 18 TRX10 RF path 10
7 TRX13 RF path 13 19 TRX9 RF path 9
8 GND Ground 20 TRX8 RF path 8
9 VDD DC power supply 21 GND Ground
10 VIO RFFE Interface Power Supply 22 TXHB GSM transmit high band
11 SDATA RFFE Data input/output 23 TXLB GSM transmit low band
12 SCLK RFFE Clock Input 24 GND Ground
Note 1：Bottom ground paddles must be connected to ground.
9 TRX14
Figure 3. RMASMNT1492ATF03 Application Circuit Note: No DC Blocking capacitors are required for all RF ports unless DC is biased externally.
Table 2. RMASMNT1492ATF03 Absolute Maximum Ratings absolute maximum for extended periods may reduce reliability . provided in Tables 3 and 5. The Table 8 and 9 are provides the measurement result. Figure 4, 5 and Table4 describes the RMASMNT1492ATF03 has four operating states. IMD2 and IMD3 test conditions for various frequencies are listed in Tables 6 and 7, respectively. the Toshiba MIPI RFFE slave interface. programming sequences and MIPI bus specifications. Table 12 register mapping shows the list of the registers inside the RMASMNT1492ATF03. Table 13 provides the switch control register. Table 14, 15 and 16 describes the detail information of RFFE status, power mode and trigger states, respectively. Figure 10 and Table 17 describes the solder land pad and dimensions. Table 3. RMASMNT1492ATF03 DC Electrical Specifications (Note 1) Note 1 : Performance is guaranteed only under the conditions listed in this Table.
Table 5. RMASMNT1492ATF03 RF Electrical Specifications (Note 1) Note 1 : Performance is guaranteed only under the conditions listed in this Table .
Table 6. IMD2 Test Conditions Table 7. IMD3 Test Conditions Table 8. Isolation Matrix : ANT to Off Path (1 of 2)
Table 8. Isolation Matrix : ANT to Off Path (2 of 2)
Table 9. Insertion Loss and Return Loss Matrix (1 of 2)
Table 9. Insertion Loss and Return Loss Matrix (2 of 2) Table 10. Digital Interface Timing Specifications Note 1 : Input SDATA is sampled at the falling edge of the SCLK. Note 2 : Output SDATA changes at the rising edge of the SCLK. Note 3 : The time between the consecutive Register Write Command Sequences for the Switch State regi ster. Note 4 : The time for the switch to reach Active State. Note : The table of input SCLK signal conditions as below.
Table 11. MIPI Transaction Details Table 12. Register Mapping Table 12. shows the list of the registers inside the RMASMNT1492ATF03. Note : The RMASMNT1492ATF03 start-up procedure as below description. RMASMNT1492ATF03 operating in the active mode. The table of register address setup as below.
Table 13. Switch Control Register Table 14. RFFE Status Table 15. Power Mode
Table 16. Trigger States Table 17. Dimensions Figure 10. Solder Land Pattern Top View Line width is designed to match 50 Ω characteristic impedance, depending on PCB material and thickness.
*electrode must be covered by fresh solder. Typical examples of soldering processes that provide reliable joints with out any damage are given in Figure 11. Figure 11. Infrared soldering profile
Page 16 of 17 ASC_RMASMNT1492ATF03_V02 Dec. 2016 Ordering code RM ASM N T1492A T RF module RM: Walsin RF Module Device Module type ASM: Antenna Switch Module Application N: SP16T Design Code Packing T: Taping Minimum Ordering Quantity: 3000 pcs per reel. Packaging Plastic Tape specifications (unit :mm) Index Ao Bo D T W Index E F Po P1 P2 Reel dimensions A B C Taping Quantity : 3000 pieces per 7” reel Index A B C Dimension (mm) Φ 178.0 Φ 60.0 Φ 13.0
Page 17 of 17 ASC_RMASMNT1492ATF03_V02 Dec. 2016 Caution of handling Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects, which might directly cause damage to the third party’s life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Medical equipment (5) Disaster prevention / crime prevention equipment (6) Traffic signal equipment (7) Transportation equipment (vehicles, trains, ships, etc.) (8) Applications of similar complexity and /or reliability requirements to the applications listed in the above. Storage condition (1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be confirmed. (2) Storage environment condition. Products should be storage in the warehouse on the following conditions. Temperature : -10 to +40°C Humidity : 30 to 70% relative humidity Don’t keep products in corrosive gases such as sulfur. Ch lorine gas or a cid or it may cause oxidization of electrode, resulting in poor solderability. Products should be storage on the palette for the prevention of the influence from humidity, dust and son on. Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on. Products should be storage under the airtight packaged condition.