RMASME494ATF03 WALSIN | Alldatasheet
Document overview
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Technical content
Page 1 of 16 ASC_RMASME494ATF03_V03 Sep.2017 RF Switch Series – RoSH Compliance SP10T MIPI Switch Halogens Free Product Any 2G/3G/4G Band for TRx system P/N: RMASME494ATF03 *Contents in this sheet are subject to change without prior notice.
Page 2 of 16 ASC_RMASME494ATF03_V03 Sep.2017
FEATURES
Low Insertion Loss and Low Distortion： Broadband frequency range：0.4 to 2.7 GHz High Isolation and linearity： Integrated MIPI RFFE Slave Controller： High ESD tolerance of 2kV HBM at all pins： Small LGA(20-pin, 2.5 x 2.5 x 0.78 mm3) package： Moisture Sensitive Level 3 (MSL3)：
Description
The RMASME494ATF03 is a Single Pole, T en Throw (SP1 0T) antenna switch with an integrated Mobile Industry Processor Interface (MIPI) controller. Using an advanced switching technology, the RMASME494ATF03 maintains low insertion and high isolation, which makes i t an ideal choice for UMTS, CDMA2000, EDGE, GSM, and LTE applications. The design integrated two GSM transmit ports and eight low loss TRX ports. The switch also has an excellent 2 nd/3rd Order Intermodulation Distortion (IMD2/IMD3) performance. Switching is controlled by the MIPI decoder and High ESD tolerance of 2kV HBM at all pins. No blocking capacitor requirements on the RF paths as long as no DC voltage are applied. The RMASME494ATF03 is manufactured in a compact, 2.5 x 2.5 x 0.78 mm3 package. The functional block diagram is shown in Figure 1. The pin assignment and package are shown in Figure 2. Signal pin assignments and functional pin descriptions are provided in Table 1. Application 2G/3G/4G multimode cellular handsets (LTE, UMTS, CDMA2000, EDGE, GSM, TDD-LTE, TD-SCDMA) Block Diagram and Pin Out (Top View) Figure 1. RMASME494ATF03 Block Diagram Figure 2. RMASME494ATF03 Pin assignment
Table 1. RMASME494ATF03 Pin Descriptions
1 ANT Antenna port 11 TRX3 RF path 3
2 TRX7 RF path 7 12 TRX2 RF path 2
3 TRX6 RF path 6 13 TRX1 RF path 1
4 TRX5 RF path 5 14 N/C Not connected
5 TRX4 RF path 4 15 N/C Not connected
6 GND Ground 16 TRX8 RF path 8
7 VDD DC power supply 17 GND Ground
8 VIO RFFE Interface Power Supply 18 TXHB GSM transmit high band
9 SDATA RFFE Data input/output 19 TXLB GSM transmit low band
10 SCLK RFFE Clock Input 20 GND Ground
Note 1：Bottom ground paddles must be connected to ground. Figure 3. RMASME494ATF03 Application Circuit Note: No DC Blocking capacitors are required for all RF ports unless DC is biased externally.
Table 2. RMASME494ATF03 Absolute Maximum Ratings absolute maximum for extended periods may reduce reliability . provided in Tables 3 and 5. The Table 8 and 9 are provides the measurement result. Figure 4, 5 and Table4 describes the RMASME494ATF03 has four operating states. IMD2 and IMD3 test conditions for various frequencies are listed in Tables 6 and 7, respectively. the Toshiba MIPI RFFE slave interface. programming sequences and MIPI bus specifications. Table 12 register mapping shows the list of the registers inside the RMASME494ATF03. Table 13 provides the switch control register. Table 14, 15 and 16 describes the detail information of RFFE status, power mode and trigger states, respectively. Figure 10 and Table 17 describes the solder land pad and dimensions. Table 3. RMASME494ATF03 DC Electrical Specifications (Note 1) Note 1 : Performance is guaranteed only under the conditions listed in this Table.
Table 5. RMASME494ATF03 RF Electrical Specifications (Note 1) Note 1 : Performance is guaranteed only under the conditions listed in this Table .
Table 6. IMD2 Test Conditions Table 7. IMD3 Test Conditions Table 8. Isolation Matrix : ANT to Off Path (1 of 2)
Table 8. Isolation Matrix : ANT to Off Path (2 of 2) Table 9. Insertion Loss and Return Loss Matrix (1 of 2)
Table 10. Digital Interface Timing Specifications Note 1 : Input SDATA is sampled at the falling edge of the SCLK. Note 2 : Output SDATA changes at the rising edge of the SCLK. Note 3 : The time between the consecutive Register Write Command Sequences for the Switch State regi ster. Note 4 : The time for the switch to reach Active State. Note : The table of input SCLK signal conditions as below.
Table 11. MIPI Transaction Details Table 12. Register Mapping Table 12. shows the list of the registers inside the RMASME494ATF03. Note : The RMASME494ATF03 start-up procedure as below description. RMASME494ATF03 operating in the active mode. The table of register address setup as below.
Table 13. Switch Control Register Table 14. RFFE Status Table 15. Power Mode
Table 16. Trigger States Table 17. Dimensions
*electrode must be covered by fresh solder. Typical examples of soldering processes that provide reliable joints without a ny damage are given in Figure 11. Figure 11. Infrared soldering profile
Page 15 of 16 ASC_RMASME494ATF03_V03 Sep.2017 Ordering code RM ASM E 494A T RF module RM: Walsin RF Module Device Module type ASM: Antenna Switch Module Application E: SP10T Design Code Packing T: Taping Minimum Ordering Quantity: 3000 pcs per reel. Packaging w F E Ao PoP2P1 Bo D T Plastic Tape specifications (unit :mm) Index Ao Bo D T W Index E F Po P1 P2 Reel dimensions A B C Taping Quantity : 3000 pieces per 7” reel Index A B C Dimension (mm) Φ178.0 Φ60.0 Φ13.0
Page 16 of 16 ASC_RMASME494ATF03_V03 Sep.2017 Caution of handling Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects, which might directly cause damage to the third party’s life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Medical equipment (5) Disaster prevention / crime prevention equipment (6) Traffic signal equipment (7) Transportation equipment (vehicles, trains, ships, etc.) (8) Applications of similar complexity and /or reliability requirements to the applications listed in the above. Storage condition (1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which ca n be confirmed. (2) Storage environment condition. Products should be storage in the warehouse on the following conditions. Temperature : -10 to +40°C Humidity : 30 to 70% relative humidity Don’t keep products in corrosive gases such as sulfur. Ch lorine gas or acid or it may cause oxidization of electrode, resulting in poor solderability. Products should be storage on the palette for the prevention of the influence from humidity, dust and son on. Products should be storage in the warehouse without heat shock, v ibration, direct sunlight and so on. Products should be storage under the airtight packaged condition.