RM914 SKYWORKS | Alldatasheet
Document overview
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Technical content
© 2001, 2002 Skyworks Solutions, Inc., All Rights Reserved. March 22, 2002 RM914 Power Amplifier Module for AMPS Applications (824–849 MHz) The RM914 Advanced Mobile Phone Service (AMPS) Power Amplifier is a fully matched 6-pin surface mount module designed for mobile units operating in the 824-849 MHz cellular bandwidth. This device can be driven to power output levels beyond 31 dBm for high efficiency FM mode operation. A single GaAs Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry as well as input and interstage matching circuits. The output match is realized off-chip and within the module package to optimize efficiency and power performance into a 50 Ω load. This device is manufactured with Skyworks’s GaAs HBT process that provides for all positive voltage DC supply operation while maintaining high efficiency. Primary bias to the RM914 can be supplied directly from a three cell nickel-cadmium, single cell lithium-ion, or other suitable battery with output in the 3-4 volt range. Power down is accomplished by setting the voltage on the low current reference pin to zero volts. No external supply side switch is needed as typical “off” leakage is a few microamperes with full primary voltage supplied from the battery. Functional Block Diagram MMIC MODULE RF Input (2) RF Output (5) VCC1 GND GND VCC2VREF Driver Stage Bias Power Stage Bias Input Match DA Inter Stage Match PA Output Match (6, 7) (3) (1) (4) (6, 7) Distinguishing Features Low voltage positive bias supply (3 to 4 Volts, typical) High efficiency Large dynamic range 6-pin package (6mm x 6mm x 1.5 mm) Power down control
Applications
Analog cellular (AMPS) Wireless local loop (WLL)
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performance of the RM914 Power Amplifier over the recommended operating conditions. Table 1. Absolute Maximum Ratings(1) Table 2. Recommended Operating Conditions
Table 3. Electrical Specifications for AMPS Nominal Operating Conditions(1) (1) Vcc = +3.4 V, Vref = +3.0 V, Freq = 836.5 MHz, Tc = 25 °C, unless otherwise specified. Table 4. Electrical Specifications Limits for AMPS Recommended Operating Conditions(1)
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Figure 1. Analog Gain vs. Output Power
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Figure 4. Analog Third Order Harmonic Suppression Magnitude
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Figure 7. Analog Third Order Harmonic Suppression Magnitude Figure 8. Noise Figure Variation Over Recommended Operating Conditions
Figure 9. Voltage Standing Wave Ratio Variation Over Recommended Operating Conditions
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to 849 MHz range. Figure 11 illustrates the board layout. Figure 10. Evaluation Board Schematic Figure 11. Evaluation Board Assembly Diagram
counter-clockwise around the package. Table 5 describes each pin function. Figure 12. RM914 Package Drawing
1.500 TYP
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Table 5. Pin Description
1 VCC1 (1)
4 VCC2
6 GND
7 GND
(1) All supply pins may be connected together at the supply. (2) Package underside is GND. Figure 13. Typical Case Markings
Power Amplifier Module for AMPS Applications (824–849 MHz) 100637D Skyworks 13 March 22, 2002 Package and Handling Information Because of its sensitivity to moisture absorption, this device package is baked and vacuum packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The RM914 is capable of withstanding an MSL 3/225 °C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 °C per second; maximum temperature should not exceed 225 °C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 225 °C for more than 10 seconds. For details on both attachment techniques, precautions, and handling procedures recommended by Conexant, please refer to Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J–STD–020A. Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Application Note: Tape and Reel, Document Number 101568.
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pins marked > 2000 V pass 2000V ESD stress. criteria and fails devices as soon as the pin begins to show any degradation on a curve tracer. listed in Table 6 be used in the product assembly and test areas follow. Figure 14. ESD Sensitivity Areas Table 6. Precautions for GaAs ICs with ESD Thresholds Greater Than 200V But Less Than 2000V
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© 2002, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its products, specifications and produc t descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibili ty whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its products and product desc riptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Exce pt as may be provided in Skyworks' Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF SKYWORKS™ PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT , GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS. Skyworks™ products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks' customers using or selling Skyworks™ products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: Skyworks ™ , the Skyworks symbol, and "Breakthrough Simplicity" ™ . Product names or services listed in this publication are for identification purposes only, and may be trademarks of third parti es. Third- party brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference.
Ordering Information
Revision History
Application Note: Tape and Reel, Document Number 101568. Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752 JEDEC Standard J–STD–020A Model Number Manufacturing Part Number Product Revision Package Operating Temperature RM914 RM914-13 13 6x6LM-6 –30 °C to +85 °C Revision Level Date Description A September 2000 Initial Release B December 2000 Add Solder Reflow, Temperature Guidelines Revised data Table 1, Table 4; Revised Figure 13 C August 2001 Revise: Table 3, Leakage Current. D March 22, 2002 Revise: Tables 3 and 4. Add: Reference Documents
General Information: Skyworks Solutions, Inc. 4311 Jamboree Rd. Newport Beach, CA. 92660-3007 www.skyworksinc.com