RM008 SKYWORKS | Alldatasheet
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Technical content
Data Sheet Skyworks Solutions, Inc. Proprietary 100781D © 1999–2002 Skyworks Solutions, Inc., All Rights Reserved. July 26, 2002 RM008 PA Module for Dual-band GSM900 and DCS1800 Applications The RM008 is a dual-band Power Amplifier Module (PAM) designed in a compact form factor for Class 4 GSM900 and Class 1 DCS1800 operation. The PAM consists of two Gallium Arsenide (GaAs) Heterojunction Bipolar Transistor (HBT) power amplifiers and internal components that match the RF input and output ports to 50 ohms, which reduces the number of external components for a dual-band design. Optimized for lithium-ion battery operation, both PAs share common power supply pins to distribute current. The RM008 dual PAM has extremely low standby current, which maximizes handset standby time. A block diagram of the RM008 is shown below. The Analog Power Control (APC) pins (GSM APC and DCS APC), control output power level. Table 4 of this data sheet shows the complete signal pin assignments and descriptions of the RM008 dual-band Power Amplifier Module. Functional Block Diagram HBTDCS IN DCS OUT GSM OUTGSM IN DCS APC GSM APC HBT Distinguishing Features
- High efficiency GSM 50% DCS 45% Input and output matching 50 ohms internal Small outline 9.1 mm x 11.61 mm Low profile 1.64 mm
Applications
Class 4 GSM900 and Class 1 DCS1800 dual-band cellular handsets
P A Module for Dual-band GSM900 and DCS1800 Applications 2 Skyworks Solutions, Inc. Proprietary 100781D July 26, 2002
Electrical Characteristics
The following tables list the electrical characteristics of the RM008 Power Amplifier. Table 1 depicts the absolute maximum ratings and Table 2 specifies the recommended operating conditions to achieve the performance specifications in Table 3. Table 1. Absolute Maximum Ratings Table 2. Recommended Operating Conditions Table 3. Electrical Specifications for Nominal Operating Conditions (1 of 2)
Table 3. Electrical Specifications for Nominal Operating Conditions (2 of 2)
Figure 1. Typical RM008 PAM Application Place caps at closest proximity to PA module with the capacitor ground directly connected to the PAM grounds. Optional depending on PAC circuit. Common connect Vbat to all Vcc pins.
the device pin configuration and Table 4 lists the pins and signal descriptions. Figure 2. RM008 Package Dimensions—16-pin PAM (All Views)
0.762 Typ
1.02 Typ
0.127 Ref
- All contact points are gold plated, lead free-surfaces.
- All dimensions are in millimeters.
Figure 3. RM008 Pin Configuration–16-Pin Leadless PAM (Top View) Table 4. RM008 Pin and Signal Descriptions
1 GND Ground 9 GND Ground
2 DCS IN RF input to DCS PA 10 GSM OUT GSM RF output (DC coupled)
3 GND Ground 11 GND Ground
4 GSM IN RF input to GSM PA 12 DCS OUT DCS RF output (DC coupled)
5 GND Ground 13 GND Ground
6 VCC2 Power supply for PA driver stages 14 GSM APC GSM analog power control
7 GND Ground 15 GND Ground
8 VCC2 Power supply for PA output stages 16 DCS APC DCS analog power control
may occur when the part is subjected to high temperature during solder assembly. Figure 4. Typical Case Markings
was performed in compliance with MIL-STD-883E Method 3015.7 using the Human Body Model. marked > 2000 V pass 2000V ESD stress. fails devices as soon as the pin begins to show any degradation on a curve tracer. test areas follow the Class-1 ESD handling precautions listed in Table 5. Figure 6. ESD Sensitivity Ares (Top View) Table 5. Precautions for GaAs ICs with ESD Thresholds Greater Than 200 V But Less Than 2000 V
Electrostatic Discharge Sensitivity RM008 P A Module for Dual-band GSM900 and DCS1800 Applications 10 Skyworks Solutions, Inc. Proprietary 100781D July 26, 2002
© 1999–2002, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its products, specifications and produc t descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibili ty whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its products and product desc riptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Exce pt as may be provided in Skyworks' Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF SKYWORKS™ PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY , PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT , COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT , GRAPHICS OR OTHER ITEMS CONT AINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS. Skyworks™ products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks' customers using or selling Skyworks™ products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: Skyworks ™ , the Skyworks symbol, and "Breakthrough Simplicity" ™ . Product names or services listed in this publication are for identification purposes only, and may be trademarks of third parti es. Third- party brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference.
Ordering Information
Revision History
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752 JEDEC Standard J–STD–020A. Model Number Manufacturing Part Number Product Revision Package Operating Temperature RM008 RM008 –23 23 –30 °C to +85 °C Revision Level Date Description A October 1999 Initial Release B October 2000 Revise: Table 4; Figure 4 C May 2001 Revise: Converted to standard format; Figure 1 Add: ESD data; Packaging and Handling Information D July 26, 2002 Revise: Part Number to RM008 –23; ESD data, Package and Handling Add: New Figure 5
General Information: Skyworks Solutions, Inc. 4311 Jamboree Rd. Newport Beach, CA. 92660-3007 www.skyworksinc.com